Enabling Next-Gen Compute with Customized 3D Solution
- Ultra High Bandwidth(up to 30TB/s) Memory Interface for AI applications
- Ultra Low Power Memory Interface compared to conventional DRAM and HBM with PHY
- SoC implementation based on 3D technology such as TSV and Hybrid Bonding
- Smart memory controller for yield improvement using redundancy memory channel
- PSI and Thermal solutions based on 3D
- Seamless SCM solutions with Custom Memory Partners and 3D Package Partners
