Chiplet SUMMIT
Date(s): January 21-23, 2025
Location: Santa Clara Convention Center, CA
The Third Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible. This unique event gives attendees a place to network with peers, ask questions of the experts, and talk to vendors offering a wide variety of products and services.
Presentations from the Event:
- 3D-IC Design Kits for Drop-in Chiplets: MDK, ADK, TDK
- BoW PHY 2.1
- Business Analysis & OCP Marketplace
- Chiplet Interconnects With Far More I/O Bandwidth
- Effective Management of Chiplet IP for Successful Designs
- Efficient Testing of Chiplet-Based SiPs
- Electrical Interfaces Performance Metrics
- How d-Matrix is Leveraging ODSA’s BoW Die-to-Die Link to Transform Generative AI Inference from Unsustainable to Attainable
- Modularity for Plug & Play Chiplets
- The OCP Open Chiplet Economy Marketplace Opens its Doors
- The OCP Open Chiplet Economy Marketplace Opens its Doors. What Comes Next?