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HW Management Project Leadership
Hemal Shah (Broadcom), Bob Stevens (Dell), John Leung (Intel), Han Wang (Inspur), Qian Wang (Intel), Eric Shobe (Dropbox)
|Intro to Hardware Management
-Why is this project important to OCP?
-Focust areas (sub-projects/workstreams)
--HW Fault Mgmt
--HW Mgmt Modules
|John Leung (Intel)||OCP Profiles - Progress Report
-Approved OCP profiles (baseline, server, rack)
-Current proposed changes
|Michael Jones (Vertiv)||HW Management for Liquid Cooling - overview of progress in the workstream withing the Cooling Environments Project||Slides|
|Richelle Ahlvers (Intel)||Profiles for Managing Storage||Slides|
|Hemal Shah (Broadcom), Bob Stevens (Dell), Patrick Corporale (Lenovo)||BMC Requirements for Internal Component Communications||Slides|
|Ed Tanous (Google), Gunner Mills (IBM)||OpenBMC and OCP Collaboration - support for profiles/validation||Slides|
|John Leung (Intel)||Prescribing Manageability for OCP Platforms
-Unprescribed parts of the Redfish Model
-Fabrics, SmartNIC, Certificates
|Ravi Bingi (AMD)||Hawaii DC-SCM 1.0 Reference Design Contribution||Slides|
|Hemal Shah (Broadcom), Bob Stevens (Dell)||What can Hardware Management do better?
-What communities should we collaborate with?
-What areas should we focus on?
Call to Action
-How to get involved (mailing lists)
-Next Project call information