OCP Tech Talk Series: Cooling Environments (CE) Session 2 of 2

Date:
May 25, 2022
Time:
4:30 AM – 5:30 AM

Click here to view the Chat Transcript from this event.

Presenter (Company)TitleSlides
Punith Veerlinga Shivaprasad (Shell) – presented by John BeanImmersion – Final version materials compatibilitySlides
Jessica GullbrandIC Strategic Initiative Discussion – Liquid Cooling in Edge DeploymentsSlides
John Bean, Rolf BrinkSustatinability Workshop for Immersion (dielectric fluids and impact of immersion)Slides
Noman Mithani (Meta), Tajesh Kasukurthy (Meta)Large Dripless Interoperable Quick ConnectorSlides
Cam Turner (CoolIT), Ashwin Siddarth (Motivair)Cold Plate requirements Rev 2Slides
Glenn Charest (Meta), Nick Goenner (Safeway)ORv3 Blind Mate Liquid Cooling Interfaces UpdateSlides
Nalco (Jim Dillon, Craig Myers, Paul Desh, Philip Yu)Failures in Water Cooled Components in Liquid Cooling ApplicationsSlides
Mick JonesHardware Management OverviewSlides
John Fernandes
Jordan Johnson
Rolf Brink
John Bean
John Menoche
John Gross
Cosimo Pecchioli
Jaime Comella
Liquid Cooling Hurdles – Kickoff Workshop
– What can Cooling Environments do better?
– Which communities should we collaborate with?
– What areas should we focus on?
Call to Action
– How to get involved (mailing list)
– Next Project Call Information
Slides