OCP APAC Summit

Date:
August 5–6, 2025
Time:
7:00 AM
Location:
Taipei City, Taiwan
2025 OCP APAC Summit

** OCP would like to thank all attendees and presenters. We hope you enjoy the 2025 APAC Summit content. If you have missing content to add, or find any mislabeled or incorrect link, please let us know. **

** We ask for your patience as we gather all of the 2025 OCP APAC Summit content for the website **

The Open Compute Project (OCP) brought together APAC communities for a very special two-day, in-person Summit to explore the many challenges and opportunities facing data center infrastructure, today and tomorrow.

Co-Hosted by

Index

Tracks
Keynotes [Jump To Section] [YouTube Playlist]
Adoption of OCP Recognized Equipment & Facilities [Jump To Section]  
AI Clusters [Jump To Section]  
Chiplets & Advanced Packaging / Photonics [Jump To Section]  
Cooling Environments [Jump To Section]  
Future Technologies Symposium [Jump To Section]  
Networking [Jump To Section]  
Optical Communication Networks [Jump To Section]  
Rack & Power [Jump To Section]  
Server [Jump To Section]  
Storage [Jump To Section]  

Keynotes (Alphabetical order)

Title Speaker(s) Video Slides
Advanced CPO Integrated by CoWoS and COUPE
  • Shang Y. Hou (TSMC)
[Video] [G-Drive]
[Dropbox]
Reshaping ICT Industry in AI Era : Perspectives from Global Supply Chain
  • Colley Huang (DigiTimes)
[Video] [G-Drive]
[Dropbox]
AI-Era Mass Storage Efficiency Evolution
  • Mohamad H El-Batal (SEAGATE)
[Video] [G-Drive]
[Dropbox]
Considering the Total Cost of Ownership of Liquid Cooled Deployments
  • RT Huang (SuperMicro)
[Video] [G-Drive]
[Dropbox]
IOWN Global Forum: Open Collaboration for Next-gen Communication and Computing Infrastructure
  • Yosuke Aragane (IOWN Global Forum)
[Video] [G-Drive]
[Dropbox]
Driving Toward Super-intelligence with Large-scale AI Infrastructure
  • Jasmeet Bagga (Meta)
[Video] [G-Drive]
[Dropbox]
Propelling AI forward through Advanced Packaging Creativity
  • Yin Chang (ASE)
[Video] [G-Drive]
[Dropbox]
Scaling to Super Intelligence
  • Ram Velaga (Broadcom)
[Video] [G-Drive]
[Dropbox]
Data Center Evolution : Powering Trust in AI
  • Chris Verne (Google)
[Video] [G-Drive]
[Dropbox]
AMD Journey with OCP
  • Robert Hormuth (AMD)
[Video] [G-Drive]
[Dropbox]
Welcome to the 2025 OCP APAC Summit
  • Cliff Grossner (OCP)
[Video] [G-Drive]
[Dropbox]

Back to the Top


Keynote (Chronological order)

Title Speaker(s) Video Slides
OCP APAC Summit Keynotes
  • Cliff Grossner (OCP)
  • Colley Huang (DigiTimes)
  • Jasmeet Bagga (Meta)
  • Shang Y. Hou (TSMC)
  • Yin Chang (ASE)
  • Robert Hormuth (AMD)
  • Yosuke Aragane (IOWN Global Forum)
  • Mohamad H El-Batal (SEAGATE)
  • RT Huang (SuperMicro)
  • Ram Velaga (Broadcom)
  • Chris Verne (Google)
[Video]   

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Adoption of OCP Recognized Equipment & Facilities (Alphabetical order)

Title Speaker(s) Video Slides
Cooling Technology Trend & Why Immersion Cooling
  • Chihfong Chou; Oriol Chavanel
  [G-Drive]
[Dropbox]
From Fixed Access to Open Edge: Metanoia’s Silicon Foundation for Disaggregated Infrastructure
  • Stewart Wu
  [G-Drive]
[Dropbox]
Methods for suppressing arcs on ±400V DC power lines
  • Kenzo Miyazaki; Fumio Mura
  [G-Drive]
[Dropbox]
OCP S.A.F.E.: Enabling IBV Firmware Supply Chain Security for a Heterogeneous Datacenter Infrastructure
  • Stefano Righi
  [G-Drive]
[Dropbox]
Panel: Understanding Global Regulations for ORV3-ready Data Centers with Batteries
  • James Emerson; Sebastien Belanger; Chris Egloff
    
Scaling OCP Adoption in the Enterprise: Lessons from Managing Heterogeneous Infrastructure at Scale
  • Zach Bobroff
  [G-Drive]
[Dropbox]
Tokenomics and the AI Factory Stack: Why Asia Needs More Datacenters
  • Dan Nishball; Myron Xie; Ivan Chiam
  [G-Drive]
[Dropbox]
Unlocking AI Infrastructure: Open Networking with IP Infusion and HYPER SCALERS
  • Frederik Hoogenboom; Evan Linwood
    
Welcome & Overview: Turning Contributions into Commercial Impact
  • Ewa McCurdy
  [G-Drive]
[Dropbox]

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AI Clusters (Alphabetical order)

Title Speaker(s) Video Slides
Advancing the AI Factory by Doing More with More
  • Chih-Tsung Huang; Wei-Jen Huang
  [G-Drive]
[Dropbox]
AI Application Concepts and Hardware Optimization by Workload
  • Gerry Juan
  [G-Drive]
[Dropbox]
AI Computing Design Trends for LLMs in the Generative AI Era
  • Bor-Sung (BS) Liang
  [G-Drive]
[Dropbox]
Catalina- Meta’s Latest AI/ML System Overview
  • LJ Chen
  [G-Drive]
[Dropbox]
Cooling Solutions for AI Racks and Clusters
  • Chris Pai
  [G-Drive]
[Dropbox]
Elastic Management Framework for the AI Cluster
  • Karl Chiang
  [G-Drive]
[Dropbox]
Exploring Azure’s Advanced AI Infrastructure for secure and sustainable growth
  • Kelvin Huang
  [G-Drive]
[Dropbox]
Innovative Liquid-Cooled Bus Bars: Enhancing Power Management in High-Density Data Centers
  • Nrupathunga Chakravarthy SR
  [G-Drive]
[Dropbox]
Liquid Cooling Solutions for Large-Scale AI Clusters
  • Daniel Kapesa
  [G-Drive]
[Dropbox]
Multi-heat-sources Impingement Cold Plate Solution
  • Yogesh Fulpagare; David Chen
  [G-Drive]
[Dropbox]
OCP Infrastructure: Towards a Sustainable Digital Transformation
  • Andie Yen
  [G-Drive]
[Dropbox]
OCP Open Systems for AI Overview
  • James Kelly; Rob Coyle
  [G-Drive]
[Dropbox]
Panel: Scale-up Ecosystem Discussion
  • Kurtis Bowman; Chris Petersen; Yongjin Cho; Ram Velaga
    
Role of Ethernet in the Next Generation AI System Architectures
  • Susmita Joshi
    
Scale Up Ethernet Overview
  • Ram Velaga
  [G-Drive]
[Dropbox]
Technical Deep Dive of UEC 1.0
  • J Metz
  [G-Drive]
[Dropbox]
UALink Overview
  • Kurtis Bowman
  [G-Drive]
[Dropbox]
Vertical vs. Horizontal Innovations: Shaping and Scaling the Future of AI Infrastructure
  • Jun Shi
  [G-Drive]
[Dropbox]

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Chiplets & Advanced Packaging / Photonics (Alphabetical order)

Title Speaker(s) Video Slides
Advanced Packaging Enabling AI Acceleration
  • Charles Lee
  [G-Drive]
[Dropbox]
AI-Driven Multiphysics Analysis for Silicon-to-System Advanced Packaging
  • Benson Wei
  [G-Drive]
[Dropbox]
AMD Advanced Packaging – Past, Present, and Future
  • Devin Wu
  [G-Drive]
[Dropbox]
CDX and 3DK: Enabling Open, Scalable Chiplet Integration
  • David Ratchkov
  [G-Drive]
[Dropbox]
Extending the Frontier: Heterogeneous Integration of Chiplet Designs
  • CT Kao
  [G-Drive]
[Dropbox]
Flash Memory Chiplet Implementation and Applications
  • DK Cheng
  [G-Drive]
[Dropbox]
From Edge to Cloud: Custom ASIC Unleashing Datacenter AI Innovation
  • CK Peng
  [G-Drive]
[Dropbox]
Innovations with Plug-and-Play Chiplets for Next Generation Computing using Universal Chiplet Interconnect Express (UCIe)
  • Debendra Das Sharma
  [G-Drive]
[Dropbox]
Integrated Photonics for Optical Interconnects
  • Erik Chen
  [G-Drive]
[Dropbox]
Introduction to Co-Packaged Optics(CPO) – Architecture, Use Cases, and Operational, Software Implications
  • Wataru Ishida
  [G-Drive]
[Dropbox]
Lifecycle System Monitoring with Arm’s System Monitoring Control Framework (SMCF) and proteanTecs
  • Dragon Hsu
  [G-Drive]
[Dropbox]
Meeting AI Workload Demands with Arm CSA and Chiplet
  • Sammy Huang
  [G-Drive]
[Dropbox]
Open Chiplet Economy: Bridging Taiwan and Silicon Valley
  • Cliff Grossner; Jawad Nasrullah
  [G-Drive]
[Dropbox]
Panel: Advancing Scalable Computing through Heterogeneous Integration and Open Innovation
  • Robert LoJawad Nasrullah; Debendra Das Sharma; Erik Chen; Robert Lo; CT Kao
  [G-Drive]
[Dropbox]
Panel: Chiplet Technology in the AI Era: Opportunities and Challenges
  • Eric HuangCK Peng; Eric Huang; Shang Y. Hou; Lihong Cao; Tony Lin
  [G-Drive]
[Dropbox]

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Cooling Environments (Alphabetical order)

Title Speaker(s) Video Slides
A Thermal Solution for HPC in Edge Computing Center: Advanced Liquid Cooling System for Mid-Scale High-Performance Computing Cluster
  • Robert Liu
  [G-Drive]
[Dropbox]
Advanced Liquid Cooling Solutions
  • Jerry Shih
  [G-Drive]
[Dropbox]
Breakthroughs in Liquid Cooling Driven by Superfluid Technology
  • Carrie Chen
  [G-Drive]
[Dropbox]
Chip to Data Thermal Resistance to Support 30°C Coolant
  • Paul Artman
  [G-Drive]
[Dropbox]
Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach
  • Reza Najjari
  [G-Drive]
[Dropbox]
Cooling Environments Overview
  • Edward Kung
  [G-Drive]
[Dropbox]
Corrosion Behavior of Brazed Heterogeneous Materials in Liquid Cooling Systems
  • FangChou Lin
  [G-Drive]
[Dropbox]
Data Center Commissioning and Considerations for Direct Liquid Cooled Solutions
  • Jerrod Buterbaugh
  [G-Drive]
[Dropbox]
Embracing AI: Infrastructure and Advanced Thermal Solutions
  • Sean Lim
  [G-Drive]
[Dropbox]
Empowering Data Centers with Synthetic Ester Coolants: A New Era of Efficiency, Safety, and Sustainability
  • Valentina Serra Holm
  [G-Drive]
[Dropbox]
Enabling Scalable, Energy-Efficient Cooling with Two-Phase Sidecar Solutions
  • Shahar Belkin
  [G-Drive]
[Dropbox]
Energy Efficiency in Datacenter
  • Jamko Hsu
  [G-Drive]
[Dropbox]
Making the case for AI factories as a profit center
  • Chinmay Shrikant kulkarni
  [G-Drive]
[Dropbox]
Overview of safety requirements for liquid cooling technologies
  • Flore Chiang
  [G-Drive]
[Dropbox]
Predicting immersion fluid’s stability window through accelerated aging model
  • CHENKUANG CHIANG
  [G-Drive]
[Dropbox]
Reusing Exhaust Heat in IDCs via Free Cooling with Turbo Blowers
  • Alexander Chen
  [G-Drive]
[Dropbox]
Super Fluid Technology Application in High Density Server Product
  • Brant Chang
  [G-Drive]
[Dropbox]
Superfluid Technology: Redefining AI Cooling with Air-Infused Dielectric Fluids
  • Willie TY Chen
  [G-Drive]
[Dropbox]
The Cooling Solution for the Next Era: Advancements in Pumped Two-Phase Solutions
  • Ken Cheng; Frank Chen
  [G-Drive]
[Dropbox]
The Evolution of Direct Liquid Cooling — From Single-phase to Two-phase
  • CE Liu
  [G-Drive]
[Dropbox]
UQDv2 – Enabling Liquid at Scale
  • Elizabeth Langer
  [G-Drive]
[Dropbox]
Waste Heat Recovery and Reuse Opportunities
  • Dr. Chen Chih-Hao
  [G-Drive]
[Dropbox]

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Future Technologies Symposium (Alphabetical order)

Title Speaker(s) Video Slides
A Novel Design for Enhancing Spreading Capability of Vapor Chamber
  • Chi-Chuan Wang
  [G-Drive]
[Dropbox]
Fluid of the Future – Liquid Cooling for the AI Boom
  • Peter Huang
  [G-Drive]
[Dropbox]
From Silicon to AI Serving: Optimizing Inference and Engineering What’s Next
  • Donggun Kim
  [G-Drive]
[Dropbox]
Pioneering AI Cooling: High Power Cold Plates with 200W/cm² Heat Flux for Next-Gen AI ASICs
  • Jeff CA Chen; Jake Hsieh
  [G-Drive]
[Dropbox]
Power. Speed. Scale. Enabling AI Infrastructure with PCIe Gen 7 and High-Voltage Connectivity – Sponsored by TE Connectivity
  • Michelle Ku; Mayank Jain
    
Resource Disaggregation Using PCI Express Network
  • Tzi-cker Chiueh
  [G-Drive]
[Dropbox]
Thermal-Safe Operation for GPU Under Power Constraints Using Reinforcement Learning
  • Jia-Han Li
  [G-Drive]
[Dropbox]
UltraFast Large Data Transfer for Next Generation AI Data Center
  • Peter Wu
    
Unibody Leakproof Cold Plates for Single- and Two-Phase Direct-to-Chip Liquid Cooling
  • PS Lee
  [G-Drive]
[Dropbox]

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Networking (Alphabetical order)

Title Speaker(s) Video Slides
Adaptive Multi-Tenant Orchestration of AI Fabric
  • Stefan Bokaie
  [G-Drive]
[Dropbox]
Architecting the AI Fabric: Scalable Networking for Next-Generation AI Servers, Racks, and Clusters
  • Jalpa Patel
  [G-Drive]
[Dropbox]
Dynamic ECN Threshold Testing Methodology and the Importance of qp-fairness
  • Avik Bhattacharya
  [G-Drive]
[Dropbox]
e-Tube Technology – Breaking Interconnect Barriers To Accelerate AI Cluster Scale Up
  • David Kuo
  [G-Drive]
[Dropbox]
Evolving FBOSS to support Generative AI network workloads
  • Mehak Mahajan; Jasmeet Bagga; Shrikrishna Khare
  [G-Drive]
[Dropbox]
Multi-tenancy Layer 2 Network on DCI
  • Chun-Chieh Huang
  [G-Drive]
[Dropbox]
Panel: End-to-End Observability Across Network and Compute Layers for AI Workload Optimization
  • Tim ZhouStefan Bokaie; William Chiang; Hasan Siraj; Amir Elbaz; Tim Zhou
    
Proactive Link Management in AI Networks: Lessons from Meta
  • Harshit Gulati; Bruno Novais
  [G-Drive]
[Dropbox]
Revisit RoCEv2 issues in large scale deployment and the future that UEC promise
  • PoWen Tsai; Azeem Suleman
  [G-Drive]
[Dropbox]
Scale-up AI Networking Alternatives – Comparing UALink, SUE and NVLink
  • Sharada Yeluri
  [G-Drive]
[Dropbox]

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Optical Communication Networks (Alphabetical order)

Title Speaker(s) Video Slides
A New OCP Subproject on OCS
  • Iwan Kartawira
  [G-Drive]
[Dropbox]
Accelerating AI Inference with Optimized Infrastructure
  • Kevin Chen
  [G-Drive]
[Dropbox]
APN-T 400G Muxponder for Cloud Edge Computing
  • Victor Yen; ArthurSH Chang
  [G-Drive]
[Dropbox]
Enhancing Financial Intercommunication through IOWN/APN: The Future of Data Center Connectivity
  • Hiroshi Miura; Masayoshi Namba
  [G-Drive]
[Dropbox]
Ideal AI/ML optical interconnect solution for sustainable data centers
  • Taeyong Kim
  [G-Drive]
[Dropbox]
Introduction of IOWN Global Forum
  • Masahisa Kawashima
    
Introduction to OCP for (new) IOWN audience
  • Cliff Grossner; James Kelly
    
KV Cache Sharing over IOWN APN: Building a Sustainable and High-Performance Nation-Wide Distributed AI for LLM Inference
  • Kenji Tanaka
  [G-Drive]
[Dropbox]
Operational challenges for realizing a multi-vendor CDI configuration
  • Kensuke Koda
  [G-Drive]
[Dropbox]
Optical circuit switching technology for future AI clusters
  • Kenji Mizutani
  [G-Drive]
[Dropbox]
Reference Implementation of an SDN Controller for Open Optical-circuit-switched AI Clusters
  • Kazuya Anazawa
  [G-Drive]
[Dropbox]
State of the Debate: Pluggable, Linear vs Copackaged Optics
  • Vlad Kozlov
  [G-Drive]
[Dropbox]
Towards Energy-Efficient AI Infrastructure through the Integration of Computing and Networking
  • Hirochika Asai
  [G-Drive]
[Dropbox]
World first international APN and RDMA-over-APN evaluation
  • Jhih-Heng Yan
  [G-Drive]
[Dropbox]

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Rack & Power (Alphabetical order)

Title Speaker(s) Video Slides
Beyond ORv3 HPR Busbars: Enabling Next Gen AI Rack Power Levels with Liquid Cooling
  • Ray Lin
  [G-Drive]
[Dropbox]
Comprehensive Solutions for ORV3 Ecosystem: Ship-loadable Packaging and Essential Accessories
  • Intheiranath Subramaniam
  [G-Drive]
[Dropbox]
Data Center High Voltage DC Distribution
  • Kelvin Huang
  [G-Drive]
[Dropbox]
Electromechanical Interconnect Solutions for Enabling High-Density AI/ML Racks with +/-400V DC Power
  • Nrupathunga Chakravarthy SR
  [G-Drive]
[Dropbox]
Empowering the AI Era: The Evolution of Data Centers and Delta’s Strategic Response
  • Chihming Wu
  [G-Drive]
[Dropbox]
Introduction to OCP R&R Project and Overview of Morning
  • Harry Soin
    
Liteon Powering the Future: Scalable Solutions for AI GPU Infrastructure
  • Frank Hung
  [G-Drive]
[Dropbox]
Optimizing Bus Bar Systems for High-Current, High-Voltage AI/ML Power Distribution
  • Nrupathunga Chakravarthy SR
  [G-Drive]
[Dropbox]
Panel: AI Datacenter Meets HVDC for Scalability and Performance
  • Peter BarbosaNrupathunga Chakravarthy SR; Peter Barbosa; Ray Lin; Frank Hung; Steven Lang
    
Panel: Evolution of Higher and Higher Power Racks – Path to 1MW and Beyond
  • Harry SoinThomas Schreiner; Kelvin Huang; Chris Pai; Jakrapong Wong; Harry Soin
    
Rack Architecture for Next Generation AI Server
  • Chris Pai
  [G-Drive]
[Dropbox]
Requirements & Considerations of Next Gen ORv3/HVDC PSU’s and Power Shelves
  • Harry Soin
    
Requirements/Considerations of Next Generation ORv3 PSU and Power Shelves
  • Jakrapong Wong
  [G-Drive]
[Dropbox]
Solid-State-Transformers for AI/ML Datacenter Power Infrastructure
  • Peter Barbosa
  [G-Drive]
[Dropbox]
Tray-Level 48V Two-Stage Power Delivery Challenges
  • Jesse Chang; Chris Peng
  [G-Drive]
[Dropbox]
Zero-Bias TLVR Exploration for Future Datacenter Computing Applications
  • Chi Hsu
  [G-Drive]
[Dropbox]

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Server (Alphabetical order)

Title Speaker(s) Video Slides
Accelerating AI from Semiconductor to Data Center Infrastructure
  • Wai Chung Ngai
  [G-Drive]
[Dropbox]
Advanced Server Management on Arm to track: Latest Technological Advances in General Server Architecture
  • Ann Cheng
  [G-Drive]
[Dropbox]
Advancing Data Center Innovation: Architectures Designed for Scalable Performance and Seamless Compatibility
  • Jatin Upadhyay
  [G-Drive]
[Dropbox]
Advancing Data Center Performance: Design Considerations for Immersion Cooling of High-Speed Signals
  • Jimmy Hsu
  [G-Drive]
[Dropbox]
APEC (Advanced PCIe Enclosure Compatible) for future HSIO interconnection
  • Eric Chang
  [G-Drive]
[Dropbox]
Architecting Open-Scale Efficiency: A Modern OCP Server Blueprint from Design to Deployment
  • ChaoLi Wang
  [G-Drive]
[Dropbox]
Deployment of an ORv3 Architecture Server Within Intel Open IP Single-Phase Immersion Cooling Tank
  • Jerry NC Chang
  [G-Drive]
[Dropbox]
Edge-MHS Overview
  • Rick Liou
  [G-Drive]
[Dropbox]
Low Carbon Emission Chassis Solution with Innovative Patterned Design
  • Garrett Liu
    
M-HPM SDNO 1.1 Spec Update
  • Jim Kuo
    
Mixing PCIe 5 and PCIe 6 in AI Platforms: Benefits and Challenges
  • Caleb Shetland
  [G-Drive]
[Dropbox]
OCP Modularity Standards (DC_MHS) – A Powerful Industry Inflection Point
  • Sean Varley
  [G-Drive]
[Dropbox]
Panel: Architecting the Future: Server Design in the Age of AI
  • Jatin UpadhyaySean Varley; Chris Petersen; Debendra Das Sharma; Jatin Upadhyay; Wai Chung Ngai; Jim Kuo
  [G-Drive]
[Dropbox]
Scaling the Next Generation of Inference Servers with PCIe Gen6
  • Chris Petersen
  [G-Drive]
[Dropbox]
Strategic Innovations in Intel Server Design: Enhancing Compatibility and Performance in 19 inches High-Density Rack Server
  • Thonas Su
  [G-Drive]
[Dropbox]
Thermal Design Considerations for High-Density DIMM System in Dual-Socket Datacenter Server Platforms
  • Jay Wu
  [G-Drive]
[Dropbox]
Trending on Next Generation: Hardware Partitioning Boot with Assistant BMC
  • Louis Chen
  [G-Drive]
[Dropbox]

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Storage (Alphabetical order)

Title Speaker(s) Video Slides
AI-Driven Mass Storage Interface
  • Mohamad H El-Batal
  [G-Drive]
[Dropbox]
AI-Era Mass Storage Evolution
  • Mohamad H El-Batal
  [G-Drive]
[Dropbox]
Architecting AI Storage: A Strategy for High-Performance and Tenant Object Storage
  • Wenyu Chen
  [G-Drive]
[Dropbox]
Best-of-Breed Synergy: Silicon Precision Meets Operational Excellence Revolutionizing Data Infrastructure w/ FADU x TRUSTA
  • Joseph Sung; Rick Hsieh
  [G-Drive]
[Dropbox]
From M.2 to EDSFF: Evolving NVMe Form Factors in OCP Compute Servers
  • Charles Chen
  [G-Drive]
[Dropbox]
High Efficiency Mass Storage Cooling Innovation
  • Mohamad H El-Batal
  [G-Drive]
[Dropbox]
OCP APAC Storage Open Discussion & Meetup
  • Mohamad H El-Batal; Jungsoo Kim
  [G-Drive]
[Dropbox]
Opening Track Overview / APAC Based Project
  • Mohamad H El-Batal; Jungsoo Kim
    
Optimizing I/O for AI Workloads and Boosting Checkpointing with FDP
  • Jungsoo Kim
    
Use Cases for CXL RAS Firmware-First Error Handling
  • Arvin Chen
  [G-Drive]
[Dropbox]

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Welcome Reception

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A special thank you to our sponsors


Diamond

Lanyards

Tote Bags

Media & Event

Lunch

Welcome Reception

Symposium Sponsors

Community Lounge

Beverage Sponsor