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Description:
Hyperscale data center operators are racing to build even larger accelerator-based compute clusters for AI training. This is driving an acceleration in the market due to a very large increase in spending. Deploying large scale AI clusters requires innovation across many domains including power distribution within the rack and cooling technologies to keep the accelerator chips powered and cooled. The power consumptions and cooling requirements of CPU and accelerator chips is increasing rapidly from generations to generation. There are many technology challenges in developing 100kW+ racks including selecting cooling technologies and fluids, and evolving current ORv3 power infrastructure. This webinar will discuss the challenges of powering and cooling large-scale high-density 250kW+ per rack AI clusters including emerging solutions for two phase direct to chip cooling and 400VDC power sidecars.
During the webinar, you’ll learn:
- Challenges for power density and cooling in AI clusters
- Technologies for Cooling and Powering 250kW racks
- The reality of modern two-phase cooling liquids
- AI clusters – How big is the market opportunity?
- Liquid and Liquid to Air, when to we expect market transitions to occur
Who should attend?
Switch System Vendors, Silicon Vendors, DC Cooling Equipment, Rack and Power systems vendors, Cloud and Telecom Service Providers, IT buyers and Decision Makers, and Enterprise CIO and CTO
Speakers:
Cliff Grossner, Ph.D.
Chief Innovation Officer, Open Compute Project Foundation (OCP)
At the Open Compute Project Foundation, Dr. Grossner leads its market intelligence function and is responsible for driving awareness of OCP, training and certification programs, and guiding inventors presenting their early-stage company ideas to potential investors. Dr. Grossner has more than 25 years of telecommunications industry experience encompassing scientific research, market analysis, corporate and product strategy, product management and marketing. His current interests includeIT Ecosystems from cloud to the edge looking at the equipment [servers, IT networking and storage] and software, and physical infrastructure [power and cooling] needed for computation, with a focus on edge computing, silicon components included in IT equipment including coprocessors for AI and ML. Previously, Dr. Grossner was head of the Cloud and Data Center Research Practice, which he launched at Infonetics research and followed through transitions to IHS, IHS Markit and Informa Group. Prior to Infonetics, he held senior positions, including heading strategic marketing for Alcatel-Lucent’s enterprise network business, tenures at Bell Labs, several startups and Nortel. He earned his Ph.D. at McGill University, and his Master of Science in Computer Science at Concordia University, winning national scholarships to support his graduate work. He holds more than 10 patents in computer networking, networking embedded security and telecommunications applications.
Dr. Richard Bonner
Chief Technology Officer, Accelsius
Dr. Richard Bonner is a distinguished heat transfer researcher with 18 years in thermal product development, specializing in two-phase cooling. He has authored over fifty papers and holds five U.S. patents, having designed cooling products for 125+ clients in various sectors. He is a former AIChE Transport and Energy Processes Division Director and holds a B.S., M.S., and Ph.D. in Chemical Engineering from Lehigh University. Currently, he serves as the Chief Technology Officer for Accelsius, a two-phase, direct-to-chip liquid cooling company.
Chris Drake
Senior Research Director, Compute Infrastructure and Service Provider Trends, Worldwide Infrastructure Research, IDC
Chris Drake is Senior Research Director within IDC’s worldwide infrastructure research organization and part of the compute infrastructure and service provider trends practice. As part of the compute infrastructure research, Chris covers key trends in the computing systems, platforms, and technologies markets. This includes high-end, accelerated, in-memory and heterogeneous computing infrastructure systems, platforms, and technologies. These include servers with discrete and embedded accelerators (e.g., GPUs, FPGAs, and ASICs) deployed in the cloud, at the core, and at the edge. Chris’s research spans mission-critical computing platforms, mainframes, and RISC-based systems as well as their associated operating environments (e.g., Linux, z/OS, UNIX). As part of the service provider research, Chris covers global and regional xSP buy side adoption trends and strategies complementing IDC’s research on xSP infrastructure supply chain and ODM Direct, and OEM vendor strategies. Chris’s research – delivered via syndicated and special intelligence services – provides insights that enable IT vendors, providers, and buyers to develop strategies and investment plans for digital infrastructure to power their internal and external services portfolio.
Will Stewart
Senior Industry Segment Manager – Smart Infrastructure and Mobility, HARTING
Will Stewart is the Senior Industry Segment Manager – Smart Infrastructure and Mobility, at HARTING. In his role for the last 8 years, Will has led the growth of HARTING’s Data Center market segment. As a member organization of OCP, Will has represented HARTING in the OCP Rack & Power Project subgroup, co-authored the specification for the ORV3 rack input power connector, and participated in power design & rack architecture for Project Olympus and Project Adams.