OCP Educational Webinar: Evolving AI Data Center Building Block Solutions with Sustainability and Standards

Date:
April 10, 2025
Time:
7:00 AM – 8:00 AM

Click Here to View the Recorded Webinar
(Registration is still required to view this FREE Webinar)


Description:

The AI race is on. The time to act is now: as data centers are being planned, designed, and built. New challenges arise from the needed increase in compute and memory density with a complex web of new requirements as we attempt to manage AI clusters at scale in an environmentally responsible, efficient, yet high-performance manner.

This webinar delves into the concept of Data Center Building Block Solutions (DCBBS) as a new paradigm for AI cluster design from a portfolio of interoperable infrastructure elements designed to scale rapidly, supporting liquid cooling, air cooling, or fanless environments. We will examine AI GPU-based server trends in data centers, and look at how evolving data center design thinking from per-server, to complete rack and cluster kits, and now to AI cluster building blocks, reduces deployment times, total cost of ownership, and environmental impact while allowing for enhancing performance.

From AI innovators seeking competitive advantage to steadfast IT priorities like efficiency and sustainability, we’ll showcase real-world examples, including Supermicro’s 122-day massive AI cluster deployment. We will demonstrate how the DCBBS approach accelerates day 0, 1 planning and set up as well as day-2 operations. Attendees will gain insights into managing fleet-based servers on advanced fabrics, optimizing for power and cooling, and leveraging Open Compute Project (OCP) standards for compatibility and decreased time to productivity.

Whether you’re minimizing risk, accelerating processing, or navigating complex hybrid environments, this interoperable, operator-centric approach ensures flexibility and performance. Join us to see how OCP Community and Supermicro are redefining computing for the AI era.

During the webinar, you’ll learn:

  • AI is accelerating the need for large scale computational clusters tuned for AI
  • Integration challenges getting the systems to hit performance targets
  • AI & high-performance computing’s and other enterprise workload effect on data center design and management
  • Innovative AI cluster building block designs reducing total cost of ownership and improved sustainability
  • Environmentally sustainable and water-conservation alternatives in the data center
  • Aligning and optimizing a data center’s IT infrastructure, configuration/workload co-design, thermal management for minimal environmental impact
  • Industry and market trends impacting data center resource consumption

Who should attend?

Data Center IT and Physical Infrastructure Vendors, Silicon Vendors, Colocation, Cloud and Telecom Service Providers, IT buyers and Decision Makers, and Enterprise CIO and CTO.

Meet the Speakers:

James Kelly

James Kelly

VP Market Intelligence and Innovation, Open Compute Project Foundation (OCP)

James joined the OCP Foundation staff in 2024 as VP Market Intelligence and Innovation, working with technology leaders in the community and augmenting the foundation’s directional strategy, innovation efforts and marketing. His contributions to the OCP proceed from over two decades of experience in technology research, engineering, product management and marketing.
 


Alan Weckel

Alan Weckel

Founder and Technology Analyst, 650 Group

Alan is a recognized data center networking, enterprise, and Cloud market expert. He publishes quarterly market share and forecast data for switching, routing, and Cloud markets. His research spans verticals, use case, and speed transitions. In addition to specific technology reports, Alan publishes on adjacent markets such as AI Networking, DCI, and Data Center Semiconductors and is a market influencer in the financial community and standards bodies. Alan is at the forefront in market methodology and segmentation, pioneering research in areas such as white box, data center switching, AI, Cloud CAPEX, and merchant silicon.


Rich Lappenbusch

Rich Lappenbusch

Senior Principal, Supermicro

Rich Lappenbusch serves on the Advisory Board of OCP. Rich also volunteers at OCP in the Immersion Liquid Cooling working group as Community Enablement Chair.

As a Senior Principal at Supermicro, he leverages his extensive industry experience in data science, business planning, technical operations, and risk assessment. Most of his days are spent working with customers on AI and HPC deployment sizing and planning with a focus on liquid cooling infrastructure solutions. He has had the pleasure to work in a wide variety of technology leaders including; DXC, HPE, Microsoft, & MSNBC.

Rich holds a master’s degree in interactive telecommunications from New York University and a BS in Business Administration with a minor in Political Science from the University of Redlands. He is also a Certified Master of Competitive Intelligence CIP-II. Rich is based in Seattle and enjoys cycling.