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Description:
As the demand for high-performance computing continues to escalate, particularly with the advent of Nvidia’s B300 GPU boasting a thermal design power (TDP) exceeding 1400W, the need for advanced thermal management solutions has never been more critical. The adoption of liquid cooling technologies is rapidly gaining momentum, evidenced by Supermicro’s announcement that it shipped approximately 2000 liquid-cooled AI racks by September 2024, with plans to ramp up production to 5000 racks per month. This shift signals a significant transformation in how data centers manage heat, paving the way for a substantial increase in liquid cooling implementations.
In this webinar, we will explore innovative fluid transfer solutions that cater specifically to the needs of modern data centers. Our focus will be on space-saving fluid transfer products designed for both single-phase and two-phase liquid cooling applications, which are essential for achieving higher flow rates while minimizing pressure drops.
Key Topics Covered:
- Understanding Fluid Transfer Systems: Gain insights into the latest innovations in fluid transfer products that are specifically tailored for space-constrained environments. Learn how these systems can be integrated into existing infrastructures to enhance cooling efficiency.
- Efficiency Improvements: Discover strategies to improve the efficiency of fluid transfer systems at the component level. We will discuss best practices and cutting-edge technologies that contribute to better thermal management.
- Design Strategies: Explore design strategies that optimize cooling solutions in smaller spaces while accommodating higher flow rates. This section will focus on practical approaches to maximize cooling performance without compromising space.
- Pressure Drop Minimization: Understand the critical importance of minimizing pressure drop in fluid transfer applications. We will delve into techniques and methodologies to combat pressure drop challenges, ensuring effective and reliable cooling solutions.
Join us for this informative session as we navigate the complexities of thermal management in high-density AI data centers and uncover the latest advancements in liquid cooling technologies. Whether you are an engineer, designer, or data center operator, this webinar will equip you with the knowledge to tackle the thermal challenges of today and tomorrow’s data centers.
Who should attend?
Cloud services and Enterprise technology leaders, architects and operators, data center cooling engineers, buyers and decision makers for servers, switches, silicon, rack and power systems
Speakers:
James Kelly
VP Market Intelligence and Innovation, Open Compute Project Foundation (OCP)
James joined the OCP Foundation staff in 2024 as VP Market Intelligence and Innovation, working with technology leaders in the community and augmenting the foundation’s directional strategy, innovation efforts and marketing. His contributions to the OCP proceed from over two decades of experience in technology research, engineering, product management and marketing.
Yulin Wang
Senior Technology Analyst, IDTechEx
Yulin Wang is a Senior Technology Analyst at IDTechEx. His research area is on thermal management for data centers, thermal interface materials, thermal management for power electronics, and semiconductor cooling. Yulin has presented his research at multiple leading international events and has supported many multi-billion-dollar companies to understand the market dynamics of data center cooling industry.
Elvis Leka
New Product Development Engineer, Parker Hannifin
Elvis Leka is a skilled mechanical engineer specializing in thermal management solutions, with a strong background in product development and project management. Currently serving as a New Product Development Engineer for Parker’s Sporlan Division, he leverages his expertise to design and implement innovative thermal management systems that enhance performance and reliability across various applications. Passionate about continuous improvement and emerging technologies, Elvis is dedicated to delivering high-quality engineering solutions that meet the evolving needs of the industry.
Josh Coe
Market Manager, Parflex Division, Parker Hannifin
Josh Coe is a results-driven professional with extensive experience in thermal management sales and business development within the technology sector. Currently serving as a Sales Executive, Josh excels in building strong client relationships and driving revenue growth through strategic sales initiatives. His expertise lies in understanding customer needs and delivering tailored solutions that enhance business performance. With a solid background in account management and a proven track record of exceeding sales targets, Josh is skilled at identifying market opportunities and fostering partnerships that lead to long-term success. His analytical mindset and effective communication skills enable him to navigate complex sales cycles and close deals efficiently. Josh is passionate about leveraging fluid conveyance technology to solve real-world problems and is committed to continuous personal and professional development.