Server/DC-MHS

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Welcome[edit]

Welcome to the OCP Data Center – Modular Hardware System (DC-MHS) Sub-Project.

DC-MHS R1 envisions interoperability between key elements of datacenter, edge and enterprise infrastructure by providing consistent interfaces and form factors among modular building blocks.

DC-MHS R1 standardizes a collection of HPM (Host Processor Modules) form-factors and supporting ingredients to allow interoperability of HPMs and platforms.

There are five workstreams that comprise DC-MHS. The objectives of the five workstreams are the following:

  • M-HPM (Host Processor Modules) Workstream which involves three specifications:
    • M-FLW (FulL Width HPM)
      • Specify the requirements of a Full Width Host Processor Module (HPM). This is for use within products designed for minimum 19” rack, also known as compliant with EIA-310-E but can also accommodate larger 21” racks. This form factor enables a full width HPM usage for CPUs, DIMMs, and related features.
    • M-DNO (DeNsity Optimized HPM)
      • Outline the requirements of a family of partial width, DeNsity Optimized Host Processor Module (HPM) form factors within the OCP Modular 240 hardware system group of specifications (M-DNO for short). This M-DNO specification embodies design considerations for CPU, DIMMs, and other server processor related features commonly used by the industry today but is not limited to only those functions.
    • M-HPM.next
      • Next HPM form factors under consideration
  • M-XIO/PESTI (eXtended I/O Connectivity/PEripheral SideBand Tunneling Interface)
    • Outline the Modular Extensible I/O (M-XIO) source connector hardware strategy. An M-XIO source connector enables entry and exit points between sources such as Motherboards, Host Processor Modules & RAID Controllers, and peripheral subsystems such as PCIe risers, backplanes, etc. M-XIO includes the connector, high speed and management signal interface details and supported pinouts. Additionally, the workstream defines Interface (M-PESTI) base requirements for electrical and protocol compatibility between components of a DC-MHS platform. The M-PESTI protocol overloads a common PRSNT# signal with additional capabilities beyond simple presence/absence of a peripheral.
  • M-PIC (Platform Infrastructure Connectivity)
    • Defines and standardizes common elements needed to interface a Host Processor Module (HPM) to the platform/chassis infrastructure elements/subsystems within the DC-MHS 1.0 family of OCP servers. Standardization of the common interfaces and connectors enables hardware compatibility between DC-MHS HPMs and various DC-MHS system components.
  • M-CRPS (Common Redundant Power Supply)
    • Defines all the requirements for an M-CRPS internal redundant power supply used in Open Compute Project that could be used in different environments like home/office, datacenter, and high-performance computing, hence harmonizing the server power supply requirements used in the industry with the purpose of creating a standard specification that the customers and vendors of Enterprise and Hyperscale can use for their products.
  • M-SIF (Shared InFrastructure)
    • Improve interoperability related to shared infrastructure enclosures with multiple, serviceable modules. Modules containing elements (HPMs, DC-SCM, peripherals, etc.) are blind-matable and hot-pluggable into a shared infrastructure enclosure.


Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found on the OCP Policies page. If you have any questions please contact OCP.

Project Leadership[edit]

Sub-Project Leads[edit]

Spec. Authors[edit]

DC-MHS Wiki Administrator[edit]

Current Status[edit]

DC-MHS R1 v1.0 specs have been approved by the OCP Incubation Committee in November 2022.

DC-MHS workstreams are working the DC-MHS R1 v1.1 specifications. Note: M-SIF is a workstream new to DC-MHS. An early version of the M-SIF specification (version 0.3) is included in the Latest DC-MHS Specification section.

A link to a Readme file explaining how to use the following tables (Latest DC-MHS Specifications, Errata and Supporting Documentation, and Inactive Documents) is here: Link

Latest Released DC-MHS Specifications[edit]

Type Description Version Submit Date Contributor Link Notes
Specification (Directional) M-DNO Specification Updates for HPM Types 5-7 0p3 RC2 v0.3 RC2 5/16/23 Michael Gregoire Link (Directional) M-DNO Specification Updates for HPM Types 5-7
Specification M-XIO Base Specification 1.02 3/16/23 Javier Lasa Version 1.02
Link
  • Version 1.02 of the Specification with the Change Bar.
  • Added a compliance table.
Specification M-PIC Base Specification 1.02 3/13/23 Clifford DuBay Version 1.02
Link
  • Version 1.02 of the Specification with the Change Bar.
  • Improved compliance requirement visibility, clarified OR-ing requirement for +12V sources, & added contributors.
Specification M-SIF Base Specification 0.3 3/9/23 Dirk Blevins Link Early version (0.3) of the M-SIF specification
Specification M-FLW Base Specification 1.0 RC5 9/28/22 Corey Hartman Link Reviewed in Oct meeting. Approved by the IC on 11/4/2022
Specification M-DNO Base Specification 1.0 RC5 9/28/22 Michael Gregoire Link Reviewed in Oct meeting. Approved by the IC on 11/4/2022
Specification M-PESTI Base Specification 1.0 RC2 9/28/22 Javier Lasa Link Reviewed in Oct meeting. Approved by the IC on 11/4/2022
Specification M-CRPS Base Specification 1.0 RC4 9/28/22 Aurelio Rodriguez Echevarria Link Reviewed in Oct meeting. Approved by the IC on 11/4/2022

Latest Released DC-MHS MCAD[edit]

Spec. Impacted Name Format Version Submit Date Contributor Link Notes
(Directional) M-DNO Types 5-7 0p3 RC2 Updated CAD Files for Type 7 STP CAD 6/01/2023 Andrew Junkins Link Type 7 CAD Files - updated to match M-DNO v0.3 RC2 specification
(Directional) M-DNO Types 5-7 0p3 RC2 Updated CAD Files for Type 6 STP CAD 5/16/2023 Brian Aspnes Link Type 6 CAD Files
(Directional) M-DNO Types 5-7 0p3 RC2 Updated CAD Files for Type 5 STP CAD 5/16/2023 Brian Aspnes Link Type 5 CAD Files

Errata and Supporting Documentation[edit]

This section includes Errata and ECNs that have not been moved into a public spec release yet (these files supersede anything in the current released specs).

Spec. Impacted Name Format Version Submit Date Contributor Link Notes
CRPS Errata PDF v2 4/25/2023 Aurelio Rodriguez Echevarria Link Corrections in Rev 1.0 RC4 of the M-CRPS specification.
PIC Current Connector List Document 1 2/1/2023 Cliff DuBay Link M-PIC Connector List
DNO M-DNO_R1_v1p0 Errata Document Document 1 1/30/2023 Michael Gregoire Link Corrected dimensioning in Figure 35 of the M-DNO Spec.
DNO Updated T4 CAD Errata All Connectors STP 1.0 2/15/2023 Dirk Blevins Link Updates to earlier CAD file. File name: m-dno-pba-assy-type-4-all-connectors-02-15-2023.stp
DNO Updated T4 CAD Errata 2nd NIC STP 1.0 120/2023 Dirk Blevins Link Updates to earlier CAD file. File name: m-dno-pba-assy-type-4-std-2nd-ocp-01-20-2023.stp
DNO Updated T4 CAD Errata E1v1 STP 1.0 1/20/2023 Dirk Blevins Link Updates to earlier CAD file. File name: m-dno-pba-assy-type-4-e1-conn-01-20-2023.stp
DNO Updated T4 CAD Errata E1v2 STP 1.0 1/20/2023 Dirk Blevins Link Updates to earlier CAD file. File name: m-dno-pba-assy-type-4-e1s-01-20-2023.stp

Inactive Documents[edit]

This section includes Workstream specification errata and any other working documents.

Spec Impacted Name Format Version Submit Date Contributor Link Notes
CRPS Errata PDF RC4 Rev 1 4/3/2023 Aurelio Rodriguez Echevarria Link Fixes typos and drawing errors.
PIC M-PIC Base Specification PDF 1.01 2/3/2023 Clifford DuBay Version 1.01
Change Bar
  • Version 1.01 of the Specification with the Change Bar.
  • Update Figures and Tables, add Errata content, include Hot Plug information.
PIC M-PIC Errata 1 and 2 PDF 1.0 2/1/2023 Clifford DuBay Link
  • Errata 1: Update Section 9.1 to Avoid High Current in Partial-Mate Conditions
  • Errata 2: Update Section 9.1.7.6 to increase the Power Rating from 1080W to 2000W.
XIO M-XIO Base Specification PDF 1.01 RC1 1/24/2023 Javier Lasa Link Incorporated Errata #1. ECN: Addition of cable construction considerations, incorporated cable considerations (alignment with PCI-SIG internal cable spec), clarification on P3V3_MGMT usage.
XIO Errata PDF 1.0 12/12/2022 Javier Lasa Link Update SFF-TA-1016 and SFF-TA-1033 pinouts.
XIO M-XIO Specification PDF 1.0 RC4 9/28/2022 Javier Lasa Link Reviewed in Oct meeting. Approved by the IC on 11/4/2022
PIC M-PIC Specification PDF 1.0 RC7 9/28/2022 Clifford DuBay Link Reviewed in Oct meeting. Approved by the IC on 11/4/2022


Get Involved[edit]


Communication[edit]


Meeting Schedule[edit]

For monthly public meetings:

  • Schedule is the third Wednesday of every month at 0800 PST.
  • Each workstream has its own weekly meeting for companies that have signed the DC-MHS R1 CLA.
  • OCP DC-MHS Project Calendar


Recordings from Past Monthly Meeting Calls[edit]

Presenter (Company) Title Recording Slides
DC-MHS HPM Workstream Updates and New Spec (Corey Hartman, Mike Gregoire, Aurelio Rodriguez Echevarria) May 2023 Public Call HPM WS Update Recording HPM WS Update

New HPM Spec

DC-MHS HPM Workstream Update (Corey Hartman, Mike Gregoire) and Delta and Artesyn Representatives April 2023 Public Call Recording HPM WS Update

Artesyn Presentation

DC-MHS Workstream and Subproject Leads March 2023 Public Call Recording Slides

Slides from April 2022 OCP Tech Talks[edit]

Presenter (Company) Title Recording Slides
Shawn Dube (Dell)
Brian Aspnes (Intel)		 DC-MHS Rev 1.0: Introduction and Overview (Datacenter - Modular Hardware System) Recording Slides
Corey Hartman (Dell)
Brian Aspnes (Intel)		 DC-MHS: FulL Width HPMs (M-FLW) Recording Slides
Mike Gregoire (Dell)
Dirk Blevins (Intel)		 DC-MHS: DeNsity Optimized HPMs (M-DNO) Recording Slides
Cliff DuBay (Intel)
Tim Lambert (Dell)		 DC-MHS: Peripheral Infrastructure Connectivity (M-PIC) Recording Slides
Charlie Ziegler (Dell)
Javier Lasa (Intel)		 DC-MHS: eXtensible I/O (M-XIO) Recording Slides
Tim Lambert (Dell)
Javier Lasa (Intel)		 DC-MHS: PEripheral Sideband Tunneling Interface (M-PESTI) Recording Slides
Aurelio Rodriguez (Intel)
Jon Lewis (Dell)		 DC-MHS: Common Redundant Power Supply (M-CRPS) Recording Slides


Slides/Recordings from October 2022 OCP Global Summit[edit]

Presenter (Company) Title Recording Slides
Michael Leung (Google)
Aurelio Rodriguez Echevarria (Intel)
Corey Hartman (Dell)
Tim Lambert (Dell)
Eduardo Estrada (Intel)		 PANEL: DC-MHS R1 report-out and timeline Recording Slides
Siamak Tavallaei (Google)
Brian Aspnes (Intel)
Shawn Dube (Dell)
Jean-Marie Verdun (HPE)
Dharmesh Jani (Meta)		 PANEL: Datacenter Modular Hardware System (DC-MHS) Recording Slides
Dirk Blevins (Intel)
Todd Westhauser (Meta)
Vincent Nguyen (HPE)		 Practical Usage of DC-MHS M-DNO Concepts Recording Slides
Siamak Tavallaei (Google)
Dirk Blevins (Intel)		 Multi-host Modular Systems (M-SIF) Recording Slides

OCP Marketplace Entries[edit]

The most recent documents will always be in the OCP Marketplace, Specifications & Design Collateral

or the OCP Marketplace, Orderable Products

Entries below are for ease of use and historical reference. Please use the marketplace links for the most recent documents.

Type Description Version Submit Date Contributor License Notes
             
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