Server/DC-MHS

From OpenCompute
Revision as of 18:14, 21 November 2022 by Kevin.kifer (talk | contribs) (→‎Welcome)
Jump to navigation Jump to search
OCP-servers-v1-17a3x.png

Welcome

Welcome to the OCP DC-MHS Sub-Project.

DC-MHS R1 envisions interoperability between key elements of datacenter, edge and enterprise infrastructure by providing consistent interfaces and form factors among modular building blocks.

DC-MHS R1 standardizes a collection of HPM (Host Processor Modules) form-factors and supporting ingredients to allow interoperability of HPMs and platforms.

There are seven workstreams that comprise DC-MHS:

  • M-FLW (FulL Width HPM)
  • M-DNO (DeNsity Optimized HPM)
  • M-XIO (eXtended I/O Connectivity)
  • M-PIC (Platform Infrastructure Connectivity)
  • M-CRPS (Common Redundant Power Supply)
  • M-PESTI (PEripheral SideBand Tunneling Interface)
  • M-SIF (Shared InFrastructure)

Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found on the OCP Policies page. If you have any questions please contact OCP.

Project Leadership

Sub-Project Leads

Incubation Committee Representative

DC-MHS Wiki Administrator


Current Status

DC-MHS R1 v1.0 specs have been approved by the OCP Incubation Committee in November 2022.

DC-MHS workstreams are working the DC-MHS R1 v1.1 specifications. Note: M-SIF is a workstream new to DC-MHS. M-SIF is working on v1.0 specification.


Incubation Committee Approved Contributions

Workstream Version IC Approval Base Specification
M-FLW v1.0 RC5 11/04/2022 DC-MHS M-FLW Base Specification
M-DNO v1.0 RC5 11/04/2022 DC-MHS M-DNO Base Specification
M-XIO v1.0 RC4 11/04/2022 DC-MHS M-XIO Base Specification
M-PIC v1.0 RC7 11/04/2022 DC-MHS M-PIC Base Specification
M-CRPS v1.0 RC4 11/04/2022 DC-MHS M-CRPS Base Specification
M-PESTI v1.0 RC2 11/04/2022 DC-MHS M-PESTI Base


Get Involved


Meeting Schedule

For monthly public meetings:

  • Schedule is TBD
  • Each workstream has its own weekly meeting for companies that have signed the DC-MHS R1 CLA.


Slides from April 2022 OCP Tech Talks

Presenters (Company) Title Video Slides
Shawn Dube (Dell), Brian Aspnes (Intel) DC-MHS Rev 1.0: Introduction and Overview (Datacenter - Modular Hardware System) Video Slides
Corey Hartman (Dell), Brian Aspnes (Intel) DC-MHS: FulL Width HPMs (M-FLW) Video Slides
Mike Gregoire (Dell), Dirk Blevins (Intel) DC-MHS: DeNsity Optimized HPMs (M-DNO) Video Slides
Cliff DuBay (Intel), Tim Lambert (Dell) DC-MHS: Peripheral Infrastructure Connectivity (M-PIC) Video Slides
Charlie Ziegler (Dell), Javier Lasa (Intel) DC-MHS: eXtensible I/O (M-XIO) Video Slides
Tim Lambert (Dell), Javier Lasa (Intel) DC-MHS: PEripheral Sideband Tunneling Interface (M-PESTI) Video Slides
Aurelio Rodriguez (Intel), Jon Lewis (Dell) DC-MHS: Common Redundant Power Supply (M-CRPS) Video Slides


Slides/Recordings from October 2022 OCP Global Summit

Presenter Title Video Slides
Aurelio Rodriguez Echevarria (Intel Corporation) | Corey Hartman (Dell) | Tim Lambert (Dell Inc.) | Eduardo Estrada (Intel Corporation) PANEL: DC-MHS R1 report-out and timeline Video Slides
Brian Aspnes (Intel Corporation) | Shawn Dube (Dell) | Jean-Marie Verdun (HPE) | Dharmesh Jani (Meta) PANEL: Datacenter Modular Hardware System (DC-MHS) Video Slides
Todd Westhauser (Meta) | Vincent Nguyen (HPE) Practical Usage of DC-MHS M-DNO Concepts Video Slides
Dirk Blevins (Intel Corporation) Multi-host Modular Systems Video Slides


OCP Marketplace Entries

  • TBD