Server/DC-MHS

Welcome

Welcome to the OCP DC-MHS Sub-Project.

DC-MHS R1 envisions interoperability between key elements of datacenter, edge and enterprise infrastructure by providing consistent interfaces and form factors among modular building blocks.

DC-MHS R1 standardizes a collection of HPM (Host Processor Modules) form-factors and supporting ingredients to allow interoperability of HPMs and platforms.

There are seven workstreams that comprise DC-MHS:

• M-FLW (FulL Width HPM)
• M-DNO (DeNsity Optimized HPM)
• M-XIO (eXtended I/O Connectivity)
• M-PIC (Platform Infrastructure Connectivity)
• M-CRPS (Common Redundant Power Supply)
• M-PESTI (PEripheral SideBand Tunneling Interface)
• M-SIF (Shared InFrastructure)

Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found on the OCP Policies page. If you have any questions please contact OCP.

Project Leadership

Sub-Project Leads

• Brian Aspnes (Intel)
• Shawn Dube (Dell)

Incubation Committee Representative

• Siamak Tavallaei (Google)

DC-MHS Wiki Administrator

• John Dinsmoor (Intel)

Current Status

DC-MHS R1 v1.0 specs have been approved by the OCP Incubation Committee in November 2022.

DC-MHS workstreams are working the DC-MHS R1 v1.1 specifications. Note: M-SIF is a workstream new to DC-MHS. M-SIF is working on v1.0 specification.

Incubation Committee Approved Contributions

Workstream	Version	IC Approval	Base Specification
M-FLW	v1.0 RC5	11/04/2022	DC-MHS M-FLW Base Specification
M-DNO	v1.0 RC5	11/04/2022	DC-MHS M-DNO Base Specification
M-XIO	v1.0 RC4	11/04/2022	DC-MHS M-XIO Base Specification
M-PIC	v1.0 RC7	11/04/2022	DC-MHS M-PIC Base Specification
M-CRPS	v1.0 RC4	11/04/2022	DC-MHS M-CRPS Base Specification
M-PESTI	v1.0 RC2	11/04/2022	DC-MHS M-PESTI Base

Get Involved

• Mailing List
• OCP Calendar

Meeting Schedule

For monthly public meetings:

• Schedule is TBD
• Each workstream has its own weekly meeting for companies that have signed the DC-MHS R1 CLA.

Slides from April 2022 OCP Tech Talks

Presenters (Company)	Title	Video	Slides
Shawn Dube (Dell), Brian Aspnes (Intel)	DC-MHS Rev 1.0: Introduction and Overview (Datacenter - Modular Hardware System)	Video	Slides
Corey Hartman (Dell), Brian Aspnes (Intel)	DC-MHS: FulL Width HPMs (M-FLW)	Video	Slides
Mike Gregoire (Dell), Dirk Blevins (Intel)	DC-MHS: DeNsity Optimized HPMs (M-DNO)	Video	Slides
Cliff DuBay (Intel), Tim Lambert (Dell)	DC-MHS: Peripheral Infrastructure Connectivity (M-PIC)	Video	Slides
Charlie Ziegler (Dell), Javier Lasa (Intel)	DC-MHS: eXtensible I/O (M-XIO)	Video	Slides
Tim Lambert (Dell), Javier Lasa (Intel)	DC-MHS: PEripheral Sideband Tunneling Interface (M-PESTI)	Video	Slides
Aurelio Rodriguez (Intel), Jon Lewis (Dell)	DC-MHS: Common Redundant Power Supply (M-CRPS)	Video	Slides

Slides/Recordings from October 2022 OCP Global Summit

Presenter	Title	Video	Slides
Aurelio Rodriguez Echevarria (Intel Corporation) | Corey Hartman (Dell) | Tim Lambert (Dell Inc.) | Eduardo Estrada (Intel Corporation)	PANEL: DC-MHS R1 report-out and timeline	Video	Slides
Brian Aspnes (Intel Corporation) | Shawn Dube (Dell) | Jean-Marie Verdun (HPE) | Dharmesh Jani (Meta)	PANEL: Datacenter Modular Hardware System (DC-MHS)	Video	Slides
Todd Westhauser (Meta) | Vincent Nguyen (HPE)	Practical Usage of DC-MHS M-DNO Concepts	Video	Slides
Dirk Blevins (Intel Corporation)	Multi-host Modular Systems	Video	Slides

OCP Marketplace Entries

• TBD