Hardware Management/Hardware Management Module

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Welcome[edit]

Welcome to the OCP Hardware Management Module Sub-project. This is a sub-project of the OCP Hardware Management Project

This Project is open to the public and we welcome all those who would like to be involved.

Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP OCP Policies page. If you have any questions please contact OCP.

Charter[edit]

This Subproject creates designs and specifications to enable interoperable hardware for platform manageability, in the form of System on a Module (SOM) designs. Deliverables from this project will include:

  • Specification for the interface between the System on a Module and the underlying platform
  • Design guides for platform designers wanting to use the module
  • Designs for reference modules and carrier cards

Presentation Template[edit]

Project Overview[edit]

The management controller module separates the common platform management hardware and places them behind a connector. the module is specified by its connector pin-out The module may have one or more form-factors

Sub-Project Leadership[edit]

Active Documents and Specs[edit]

Documents and information collateral are in the Wiki links above. Documents from the main HW Management Module group are below.

Type Description Revision Submit Date Contributor License Notes
Specification OCP DC-SCM 2.1 VFF Drawings candidate


OCP DC-SCM 2.1 candidate

OCP DC-SCI Rev2.1 candidate

OCP DC-SCM LTPI Rev2.1 candidate

2.1 Advanced Micro Devices; AMI US Holdings Inc.; Ampere Computing; Arm, Ltd.; ASPEED Technology, Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Inspur Electronical Information Industry Co., Ltd.; Intel Corporation; Jabil, Inc.; Lattice Semiconductor Corporation; Lenovo, ISG; Microsoft Corporation; MiTAC Computing Technology Corporation; Nuvoton Technology Israel Ltd.; Oracle Americas, Inc. Modified OWFa 1.0 CLA (modified 07/2021) last updated October 2023
Specification OCP HPM Common Circuit Type 1 Pinlist Rev 1.0 Ver 0.95


OCP HPM Common Circuit Type 1 Spec Rev 1.0 Ver 0.5 RC3

1.0 Advanced Micro Devices; AMI US Holdings Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Intel Corporation; Lenovo, ISG; Nuvoton Technology Israel Ltd. Modified OWFa 1.0 CLA (modified 07/2021) last updated October 2023
Specification OCP DC-SCM Rev2.0 ver1.0 specification candidate


OCP DC-SCI Rev2.0 ver1.0 candidate

OCP DC-SCM Rev2.0 Security Considerations candidate

OCP LTPI specification ver1.0 specification candidate

OCP DC-SCM Rev2.0 mechanical files candidate

2.0 July 27, 2022 Advanced Micro Devices; AMI US Holdings Inc.; Ampere Computing; Arm, Ltd.; ASPEED Technology, Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Inspur Electronical Information Industry Co., Ltd.; Intel Corporation; Lattice Semiconductor Corporation; Lenovo, ISG; Microsoft Corporation; MiTAC Computing Technology Corporation; Oracle Americas, Inc. Modified OWFa 1.0 CLA (modified 07/2021) last updated July 2022
Approved by IC
Specification OCP DC-SCM Rev 1.0_release_to_OCP.pdf


OCP DC-SCM spec Rev 0.95_release_to_OCP.pdf

OCP DC-SCM spec Rev 0.8_release_to_OCP.pdf

1.0 3/26/2021


12/02/2020

11/10/2020

Microsoft & Google OWFa 1.0 CLA 05/26/2021
* approved by IC, available on the contributions portal

03/26/2021
* For submitting into the contribution database
12/02/2020
* For review in November IC calls
11/11/2020
* For review in November Server and HW-MGMT project calls

Specification RunBMC v1.5 pinout Candidate


RunBMC v1.5 Candidate

1.5 9/28/2023 Dropbox, Intel OWF CLA 1.0 Ready for review, please provide feedback to HWMM mailing list

Accepted & Inspired submissions, available in the Marketplace[edit]

The most recent documents will always be in the OCP Marketplace, Specifications & Design Collateral or the OCP Marketplace, Orderable Products

Entries below are for ease of use and historical reference. Please use the marketplace links for the most recent documents.

Type Description Version Submit Date Contributor License Notes
Specification RunBMC DaughterBoard I/O Specification 1.4.1 Final 08/15/2020 Dropbox & Salesforce OWFa 1.0 CLA Approved
Product + Design Pkg RunBMC ASPEED AST2500 32mm card following RunBMC 1.4.1 Specification
RunBMC AST2500 OpenBMC Repo
RunBMC AST200 Design Package and Quick Start Guide
v1.0 08/15/2020 Hyve OWFa 1.0 Marketplace Product Link

DC-SCM 2.0 Workgroup[edit]

Meetings

This workgroup currently meets on the first Monday of each Month.

Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)

This call is open to the public.

If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.

DC-SCM2.0 meeting agenda and minutes

Opens tracking

This is a live document, used to track and communicate open topics and feedbacks for the DC-SCM 2.0 specification This document contains pin definition revisions for the DC-SCM 2.0

DC-SCM Rev 2.0 Opens tracking sheet

Presentations

Get Involved[edit]

Past Call Recordings[edit]

DC-SCM[edit]

Mech.[edit]

Type1[edit]