Hardware Management/Hardware Management Module
Welcome
Welcome to the OCP Hardware Management Module Sub-project. This is a sub-project of the OCP Hardware Management Project
This Project is open to the public and we welcome all those who would like to be involved.
Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP OCP Policies page. If you have any questions please contact OCP.
Charter
This Subproject creates designs and specifications to enable interoperable hardware for platform manageability, in the form of System on a Module (SOM) designs. Deliverables from this project will include:
- Specification for the interface between the System on a Module and the underlying platform
- Design guides for platform designers wanting to use the module
- Designs for reference modules and carrier cards
Presentation Template
- OCP Presentation Template - please contact Michael Schill for a copy
Project Overview
The management controller module separates the common platform management hardware and places them behind a connector. the module is specified by its connector pin-out The module may have one or more form-factors
Sub-Project Leadership
- Eric Shobe (Dropbox)
Join the Mailing List
Active Documents and Specs
Documents and information collateral are in the Wiki links above. Documents from the main HW Management Module group are below.
Type | Description | Revision | Submit Date | Contributor | License | Notes |
---|---|---|---|---|---|---|
Specification | OCP DC-SCM 2.1 VFF Drawings candidate
|
2.1 | Advanced Micro Devices; AMI US Holdings Inc.; Ampere Computing; Arm, Ltd.; ASPEED Technology, Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Inspur Electronical Information Industry Co., Ltd.; Intel Corporation; Jabil, Inc.; Lattice Semiconductor Corporation; Lenovo, ISG; Microsoft Corporation; MiTAC Computing Technology Corporation; Nuvoton Technology Israel Ltd.; Oracle Americas, Inc. | Modified OWFa 1.0 CLA (modified 07/2021) | last updated July 2024 | |
Specification | OCP HPM Common Circuit Type 1 Pinlist Rev 1.0 Ver 1.0 RC2 |
1.0 | Advanced Micro Devices; AMI US Holdings Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Intel Corporation; Lenovo, ISG; Jabil Inc.; Microsoft Corporation; Nuvoton Technology Israel Ltd. | Modified OWFa 1.0 CLA (modified 07/2021) | last updated April 2024 | |
Specification | OCP DC-SCM Rev2.0 ver1.0 specification candidate
|
2.0 | July 27, 2022 | Advanced Micro Devices; AMI US Holdings Inc.; Ampere Computing; Arm, Ltd.; ASPEED Technology, Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Inspur Electronical Information Industry Co., Ltd.; Intel Corporation; Lattice Semiconductor Corporation; Lenovo, ISG; Microsoft Corporation; MiTAC Computing Technology Corporation; Oracle Americas, Inc. | Modified OWFa 1.0 CLA (modified 07/2021) | last updated July 2022 Approved by IC |
Specification | OCP DC-SCM Rev 1.0_release_to_OCP.pdf
|
1.0 | 3/26/2021
|
Microsoft & Google | OWFa 1.0 CLA | 05/26/2021 * approved by IC, available on the contributions portal 03/26/2021 |
Specification | RunBMC v1.5 Pinout |
1.5 | 9/28/2023 | Dropbox, Intel | OWF CLA 1.0 | Ready for review, please provide feedback to HWMM mailing list |
Accepted & Inspired submissions, available in the Marketplace
The most recent documents will always be in the OCP Marketplace, Specifications & Design Collateral or the OCP Marketplace, Orderable Products
Entries below are for ease of use and historical reference. Please use the marketplace links for the most recent documents.
Type | Description | Version | Submit Date | Contributor | License | Notes | ||
---|---|---|---|---|---|---|---|---|
Specification | RunBMC DaughterBoard I/O Specification | 1.4.1 Final | 08/15/2020 | Dropbox & Salesforce | OWFa 1.0 CLA | Approved | ||
Product + Design Pkg | RunBMC ASPEED AST2500 32mm card following RunBMC 1.4.1 Specification |
RunBMC AST2500 OpenBMC Repo |
RunBMC AST200 Design Package and Quick Start Guide |
v1.0 | 08/15/2020 | Hyve | OWFa 1.0 | Marketplace Product Link |
DC-SCM 2.0 Workgroup
Meetings
This workgroup currently meets on the first Monday of each Month.
Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)
This call is open to the public.
If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.
DC-SCM2.0 meeting agenda and minutes
Opens tracking
This is a live document, used to track and communicate open topics and feedbacks for the DC-SCM 2.0 specification This document contains pin definition revisions for the DC-SCM 2.0
DC-SCM Rev 2.0 Opens tracking sheet
Presentations
- Design specification proposal
- OCP summit 2020 Intel Cyclone V-based RunBMC solution.pptx
- OCP summit 2020Intel Cyclone V-based RunBMC solution video
- DC-SCM2 -- System Usage Examples -- 2021-02-01
- DC-SCM2 -- OpenFSI proposal -- 2021-03-25
- DC-SCM2 -- OpenFSI proposal -- 2021-05-31
- MCSI Electrical IO Specification Proposal 4-15-2021.pdf
- OCP summit 2021 DC-Stack Overview Executive Talk
- OCP summit 2021 DC-Stack Overview Expo Hall Talk
- OCP summit 2021 DC-Stack Software
- OCP summit 2021 DC-MHS
- OCP summit 2021 DC-XPI
- OCP summit 2021 DC-SCM 2.0 update
- OCP summit 2021 DC-SCM 1.0 update
- OCP summit 2019 DC-SCM concept introduction
- OCP Regional summit 2019: DC-SCM progress report
- OCP Regional summit 2019: DC-SCM for OAI
- 2021 OCP Global Summit: Introduction of DC-SCM 2.0 LVDS Tunneling Protocol & Interface (LTPI)
- 2021 OCP Global Summit: Intel CycloneV RunBMC v2 Demo
- 2021 OCP Global Summit: Intel DC SCM 2.0 Prototype Demo
- 2021 OCP Global Summit: Intel DC SCM 2 0 LTPI Demo
Get Involved
- Participate in the discussion, mailing list: Mailing List Info
- Participate in HW Management Module sub-project meetings
- OCP Calendar
Past Call Recordings
DC-SCM
- HWMM update March, 2024
- DC-SCM2.0 May 2nd, 2022
- DC-SCM2.0 April 4, 2022
- DC-SCM2.0 March 7, 2022
- DC-SCM2.0 Feb 7, 2022
- DC-SCM2.0 Dec 6, 2021
- October 4th, 2021
- June 7th, 2021
- May 10th, 2021
- May 3rd, 2021
- April 26th, 2021
- April 19th, 2021
- April 12th, 2021
- April 5th, 2021
- March 29th, 2021
- March 15th, 2021
- March 8th, 2021
- March 1st, 2021
- February 22nd, 2021
- February 8th, 2021
- February 1st, 2021
- January 25th, 2021