Storage/Thermal Sim Methodology

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Welcome to the OCP Thermal Sim Methodology workstream page

The Thermal Sim Methodology goal is to standardize aspects of thermal characterizations of drives and systems to enable drive and system designers to use common methods, metrics, and assumptions when designing for thermal targets required by end-users. Goal is to enable both "apples-to-apples" comparison of drives in a system, and also to enable the ecosystem to better anticipate thermal requirements of new form factors being considered by the ecosystem.

Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP OCP Policies page. If you have any questions please contact OCP.


- Storage Project Mailing List
- OCP website
- OCP Calendar


- Dave Landsman (Western Digital)


- Thermal Workgroup Goals
- E3 Thermal Methodology Slides
- EDSFF Thermal Sim Spec Outline Doc
- Intel-WDC-Microsoft - SSD Thermal Simulation Standardization


Meeting Information: Every Thursday at 3pm-4pm US Pacific Time, though Thursday, August-27

You can also dial in using your phone. United States: +1 (646) 749-3122

Access Code: 881-571-341

Recordings from Past Calls

- July 23rd, 2020
- July 16th, 2020
- June 25th, 2020
- February 27th, 2020
- February 20th, 2020
- February 13th, 2020
- February 6th, 2020