Storage/Thermal Sim Methodology
Welcome to the OCP Thermal Sim Methodology workstream page
The Thermal Sim Methodology goal is to standardize aspects of thermal characterizations of drives and systems to enable drive and system designers to use common methods, metrics, and assumptions when designing for thermal targets required by end-users. Goal is to enable both "apples-to-apples" comparison of drives in a system, and also to enable the ecosystem to better anticipate thermal requirements of new form factors being considered by the ecosystem.
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- - Dave Landsman (Western Digital)
- - Thermal Workgroup Goals
- - E3 Thermal Methodology Slides
- - EDSFF Thermal Sim Spec Outline Doc
- - Intel-WDC-Microsoft - SSD Thermal Simulation Standardization
Meeting Information: Every Thursday at 3pm-4pm US Pacific Time, though Thursday, August-27
You can also dial in using your phone. United States: +1 (646) 749-3122
Access Code: 881-571-341