Difference between revisions of "Storage/Thermal Sim Methodology"
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Revision as of 22:45, 24 July 2020
Welcome to the OCP Thermal Sim Methodology workstream page
Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP OCP Policies page. If you have any questions please contact OCP.
- - Dave Landsman (Western Digital)
- - Thermal Workgroup Goals
- - E3 Thermal Methodology Slides
- - EDSFF Thermal Sim Spec Outline Doc
- - Intel-WDC-Microsoft - SSD Thermal Simulation Standardization
Meeting Information: Every Thursday at 3pm-4pm US Pacific Time, though Thursday, August-27
You can also dial in using your phone. United States: +1 (646) 749-3122
Access Code: 881-571-341