Storage/Thermal Sim Methodology: Difference between revisions

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Welcome to the OCP '''Thermal Sim Methodology''' workstream page
Welcome to the OCP '''Thermal Sim Methodology''' workstream page
The Thermal Sim Methodology will try to standardize aspects of the thermal characterization of drives and systems to enable drive and system designers to use common methods, metrics, and assumptions when designing for thermal targets required by end-users.  The goal of the methodology is to enable both "apples-to-apples" comparison of drives in a system, and also to enable the ecosystem to better anticipate thermal requirements of new form factors being considered by the ecosystem.


Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP [http://www.opencompute.org/about/ocp-policies/ OCP Policies] page.  If you have any questions please contact OCP.
Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP [http://www.opencompute.org/about/ocp-policies/ OCP Policies] page.  If you have any questions please contact OCP.
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:- [http://opencompute.org/projects/projects-calendar/ OCP Calendar]
:- [http://opencompute.org/projects/projects-calendar/ OCP Calendar]


==Workstream Leadership==
==Leads==


'''Workstream Leads'''
:- [mailto:dave.landsman@wdc.com Dave Landsman] (Western Digital)
:- [mailto:dave.landsman@wdc.com Dave Landsman] (Western Digital)


==Documents==
==Documents==
:- [http://files.opencompute.org/oc/public.php?service=files&t=976372ab6b04df5b24ee68b9509cc85d&download Thermal Workgroup Goals]
:- [http://files.opencompute.org/oc/public.php?service=files&t=828242f79f96acab22bc31c19060027&download3 E3 Thermal Methodology Slides]
:- [http://files.opencompute.org/oc/public.php?service=files&t=1fd321b9b0a295bafe6fa41765bdf9a0&download EDSFF Thermal Sim Spec Outline Doc]
:- [http://files.opencompute.org/oc/public.php?service=files&t=2d4847fd8fc6ee1cbd48221adf29e7ed&download Intel-WDC-Microsoft - SSD Thermal Simulation Standardization]


==Meetings==
==Meetings==


Meeting Information: Every Thursday at 3pm Pacific Time
Meeting Information: Every Thursday at 3pm-4pm US Pacific Time, though Thursday, August-27


* [https://global.gotomeeting.com/join/881571341 Call Link]
* [https://global.gotomeeting.com/join/881571341 Call Link]
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==Recordings from Past Calls==
==Recordings from Past Calls==
:- [https://www.youtube.com/watch?v=fk5pfqcn3Uk&feature=youtu.be Tape Durability Modeling Workstream: February 26th, 2019]
:- [https://www.youtube.com/watch?v=JgNR1iP_Gc8 July 23rd, 2020]
:- [https://www.youtube.com/watch?v=6wkXJiy_3ZE&feature=youtu.be Tape Durability Modeling Workstream: February 12th, 2019]
:- [https://www.youtube.com/watch?v=K8TW-LMCDCI July 16th, 2020]
:- [https://www.youtube.com/watch?v=9K84IH8yPrc&feature=youtu.be Tape Durability Modeling Workstream: January 8th, 2019]
:- [https://www.youtube.com/watch?v=SSGFPa7SvlI June 25th, 2020]
:- [https://www.youtube.com/watch?v=YqhtNpjk6aw&feature=youtu.be Tape Durability Modeling Workstream: December 18th, 2018]
:- [https://www.youtube.com/watch?v=mUUQl0ANPpE&feature=youtu.be February 27th, 2020]
:- [https://www.youtube.com/watch?v=wzjJvzjEEkk&feature=youtu.be Tape Durability Modeling Workstream: December 4th, 2018]
:- February 20th, 2020
:- [https://www.youtube.com/watch?v=bHZ3T7rPbrg&feature=youtu.be Archival Storage Kickoff call: September 4th, 2018]
:- [https://www.youtube.com/watch?v=yJd80c4XHGU&feature=youtu.be February 13th, 2020]
:- [https://www.youtube.com/watch?v=PkyVGFyxK3M&feature=youtu.be February 6th, 2020]

Revision as of 22:48, 24 July 2020

OCP-Open-compute-archival-storage-1x-v1-38a.png

WELCOME

Welcome to the OCP Thermal Sim Methodology workstream page

The Thermal Sim Methodology will try to standardize aspects of the thermal characterization of drives and systems to enable drive and system designers to use common methods, metrics, and assumptions when designing for thermal targets required by end-users. The goal of the methodology is to enable both "apples-to-apples" comparison of drives in a system, and also to enable the ecosystem to better anticipate thermal requirements of new form factors being considered by the ecosystem.

Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP OCP Policies page. If you have any questions please contact OCP.

Links

- Storage Project Mailing List
- OCP website
- OCP Calendar

Leads

- Dave Landsman (Western Digital)

Documents

- Thermal Workgroup Goals
- E3 Thermal Methodology Slides
- EDSFF Thermal Sim Spec Outline Doc
- Intel-WDC-Microsoft - SSD Thermal Simulation Standardization

Meetings

Meeting Information: Every Thursday at 3pm-4pm US Pacific Time, though Thursday, August-27

You can also dial in using your phone. United States: +1 (646) 749-3122

Access Code: 881-571-341

Recordings from Past Calls

- July 23rd, 2020
- July 16th, 2020
- June 25th, 2020
- February 27th, 2020
- February 20th, 2020
- February 13th, 2020
- February 6th, 2020