Editing Storage/Thermal Sim Methodology

Jump to navigation Jump to search
Warning: You are not logged in. Your IP address will be publicly visible if you make any edits. If you log in or create an account, your edits will be attributed to your username, along with other benefits.

The edit can be undone. Please check the comparison below to verify that this is what you want to do, and then publish the changes below to finish undoing the edit.

Latest revision Your text
Line 4: Line 4:
Welcome to the OCP '''Thermal Sim Methodology''' workstream page
Welcome to the OCP '''Thermal Sim Methodology''' workstream page


The Thermal Sim Methodology will standardize aspects of the thermal characterization of drives in systems, defining common methods, metrics, and assumptions.  The goal of the methodology is to enable system and device vendors to better target new form factors such that the form factors meet the thermal requirements of the systems for which the form factors are being defined.   
Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP [http://www.opencompute.org/about/ocp-policies/ OCP Policies] page.  If you have any questions please contact OCP.


==Links==
==Links==
Line 15: Line 15:


:- [mailto:dave.landsman@wdc.com Dave Landsman] (Western Digital)
:- [mailto:dave.landsman@wdc.com Dave Landsman] (Western Digital)
:- [mailto:amber.huffman@ocproject.net Amber Huffman] (Google)


==Documents==
==Documents==


Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See [http://www.opencompute.org/about/ocp-policies/ OCP Policies].  If you have any questions please contact OCP.
==Meetings==
 
Meeting Information: Every Thursday at 3pm Pacific Time
 
* [https://global.gotomeeting.com/join/881571341 Call Link]


{| class="wikitable"
You can also dial in using your phone.
|+ style="text-align: left;" | Thermal Sim Workstream Documents
United States: +1 (646) 749-3122
|-
! Topic
! Speaker
! Company
! Date Presented
|-
| [https://docs.google.com/document/d/1qflj3kHEYXb0PCi3dP2AjS76l_Vi0gZ0QljM94HLTBI/edit?usp=sharing OCP Thermal Modeling Methodology 2020.11.07 (Draft)]
| David Wright & Paul Gwinn
| Western Digital & Intel
| 2020-11-05
|-
| [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/026f92ca984b83fe8859db3f97e8e40829c15381.pdf Initial EDSFF Thermal]
|
| NGD Systems
| 2020-10-28
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=7012cffb68ba9292eb54b5bb51ec598c&download E1.S Thermals Data]
| Dave Landsman & David Wright
| Western Digital
| 2019-10-28
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=d70dfaa48f298b3680a65e83eb293447&download Datacenter SSD FF Thermal Issues]
| Jason Adrian
| Microsoft
| 2019-10-28
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=29c871d95a76534439ff8c44d923932e&download E1.S Power Methodology]
| Brandon Gary
| Microsoft
| 2019-12-12
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=6c23bd27be247cf239f76576f7f29a86&download EDSFF Thermal Methodology E1.S FF Width]
| Paul Gwin
| Intel
| 2020-01-16
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=976372ab6b04df5b24ee68b9509cc85d&download Thermal Workgroup Goals]
| Paul Gwin
| Intel
| 2020-02-13
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=2d4847fd8fc6ee1cbd48221adf29e7ed&download SSD Thermal Simulation Standardization for OCP Summit]
| Paul Gwin, Dave Landsman
| Intel-Microsoft-WDC
| 2020-05-14
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=828242f79f96acab22bc31c190600273&download E3 Thermal Methodology Slides]
| Bill Lynn
| DellEMC
| 2020-07-09
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=1fd321b9b0a295bafe6fa41765bdf9a0&download EDSFF Thermal Sim Spec Outline Doc v1]
| Bill Lynn
| DellEMC
| 2020-07-23
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=b915c9e26360fcfed68ffbb59f54564b&download Thermal Methodology Revisit Discussion]
| Paul Gwin
| Intel
| 2020-07-30
|}


==Meetings==
Access Code: 881-571-341


==Recordings from Past Calls==
==Recordings from Past Calls==
:- [https://www.youtube.com/watch?v=ZIayR44gwdA November 19th, 2020]
:- [https://www.youtube.com/watch?v=fk5pfqcn3Uk&feature=youtu.be Tape Durability Modeling Workstream: February 26th, 2019]
:- [https://www.youtube.com/watch?v=7PXcGPkOGJI November 5th, 2020]
:- [https://www.youtube.com/watch?v=6wkXJiy_3ZE&feature=youtu.be Tape Durability Modeling Workstream: February 12th, 2019]
:- [https://www.youtube.com/watch?v=89aEL1_PwEo August 6th, 2020]
:- [https://www.youtube.com/watch?v=9K84IH8yPrc&feature=youtu.be Tape Durability Modeling Workstream: January 8th, 2019]
:- [https://www.youtube.com/watch?v=dhLTnFGKCus July 30th, 2020]
:- [https://www.youtube.com/watch?v=YqhtNpjk6aw&feature=youtu.be Tape Durability Modeling Workstream: December 18th, 2018]
:- [https://www.youtube.com/watch?v=JgNR1iP_Gc8 July 23rd, 2020]
:- [https://www.youtube.com/watch?v=wzjJvzjEEkk&feature=youtu.be Tape Durability Modeling Workstream: December 4th, 2018]
:- [https://www.youtube.com/watch?v=K8TW-LMCDCI July 16th, 2020]
:- [https://www.youtube.com/watch?v=bHZ3T7rPbrg&feature=youtu.be Archival Storage Kickoff call: September 4th, 2018]
:- [https://www.youtube.com/watch?v=SSGFPa7SvlI June 25th, 2020]
:- [https://www.youtube.com/watch?v=mUUQl0ANPpE&feature=youtu.be February 27th, 2020]
:- February 20th, 2020
:- [https://www.youtube.com/watch?v=yJd80c4XHGU&feature=youtu.be February 13th, 2020]
:- [https://www.youtube.com/watch?v=PkyVGFyxK3M&feature=youtu.be February 6th, 2020]
Please note that all contributions to OpenCompute may be edited, altered, or removed by other contributors. If you do not want your writing to be edited mercilessly, then do not submit it here.
You are also promising us that you wrote this yourself, or copied it from a public domain or similar free resource (see OpenCompute:Copyrights for details). Do not submit copyrighted work without permission!
Cancel Editing help (opens in new window)
Retrieved from "https://www.opencompute.org/w/index.php?title=Storage/Thermal_Sim_Methodology"