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{| class="wikitable"
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! Topic
! Speaker
! Affiliation
! Slides
|-
| Welcome/Logistics
| Jim Finnegan
| Netronome
|
|-
| Intel Welcome
| Ahmad Zaidi
| Intel
|
|-
| Intel Chiplets and Packaging
| Ramune Nagisetti and Ravi Mahajan
| Intel
|
|-
| ODSA Technical Intro
| Bapi Vinnakota
| Netronome
|
|-
| PHY Review/BoM Interface Update
|Ramin Farjad/Mark Kuemerle
|Aquantia/Avera Semi
|
|-
| AIB/Link Layer/Call to Action
| David Kehlet
| Intel
|
|-
| Chiplet Design Experience
| Panel
| Intel/AMD/Cisco/eSilicon/Xilinx
|
|-
| CDX - Chiplet Design Exchange
| Jawad Nasrullah/Alex
| zGlue/Ayar Labs
|
|-
| Advanced Packaging for Chiplets
|
| IME Singapore
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|-
|
|
| Xerox PARC
|
|-
| POC Update
| JP/Quinn/Manish/Jawad/Mark
| Cisco/Achronix/Samtec/zGlue
|
|-
| Chiplet Workflow Experience
| Panel
| NXP/Avera Semi/Ayar Labs/Facebook/ Granite RIver Labs/Kandou
|-




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