The Open Compute Project Foundation (OCP), is proud to host the inaugural 2025 OCP APAC Summit in Taipei, Taiwan, on August 5-6, along with local partners AITA, CIAT and IOWN. The event will feature 20 deep-dive presentations dedicated to AI, and well over 100 total sessions, most of which also address AI clusters as a use case.
This new two-day event brings together global leaders, engineers and innovators to accelerate the development of open AI data center infrastructure, addressing the unprecedented global demands and regional relevance in meeting them. Taiwan’s dominance in semiconductors, its active OCP Community, and its strategic role in global supply chains, combined with APAC’s growing data center market and collaborative innovation, make them indispensable to OCP’s mission of building Open Systems for AI.
The OCP Community has made significant progress toward Open Systems for AI this year that will be covered in more detail at the APAC Summit:
The OCP will host over 100 AI-focused breakout sessions throughout its 2025 in-person Summits and Tech Day events, all of which will be available from the OCP AI events page.
The OCP will host at least 10 virtual three-hour technical workshops, featuring dozens of presenters on specific focus areas, covering Physical Infrastructure, IT Infrastructure and Systems Management, within Open Systems for AI. The first four workshops had over 1,700 registered attendees in total.
The OCP launched the AI segment of the OCP Marketplace, featuring over 100 OCP-recognized products and growing rapidly.
The Open Systems for AI Strategic initiative published its v1.0 whitepaper, “Blueprint for Scalable Infrastructure” and will have an eLearning format of this material soon. Connect with the experts that worked on the white paper at OCP APAC Summit.
The OCP has solidified alliances in key areas for open standards for AI cluster infrastructure, including UALink and UEC. UEC and UALink representatives will be presenting at the 2025 OCP APAC Summit.
The OCP is home to open source specifications for groundbreaking innovations in the area of AI clusters: Catalina, Mount Diablo, HGX and MGX, as well as Deschutes Cooling Distribution Unit and Scale-up Ethernet (SUE) and much more. All will be discussed in detail at the OCP APAC Summit.
The OCP Ready™ checklist is getting a new version for OCP Ready™ for AI. Get a chance to provide input as this is still work in progress.
OCP is welcoming many new members focused on AI, from startup vendors to the neocloud providers.
“AI workload needs are different from typical cloud-native applications, causing increased hardware-software co-design, even down to the silicon. That specialization boosts performance, but risks fragmenting the supply chain, increasing costs, and reducing efficiency, compounded by hardware innovation that is more rapid and more expensive than ever before. The industry must find commonalities and an evolvable approach to AI infrastructure. OCP addresses this by open-sourcing data center physical facilities and IT hardware specifications and standardizing AI cluster building blocks,” said George Tchaparian, CEO of the Open Compute Project Foundation. “Our trusted IP model, core tenets, and community-led approach is time tested for the secure vendor collaboration, performance, efficiency, interoperability, and composability that are needed by vendors and customers alike. OCP’s Open Systems for AI Strategic Initiative spans and consolidates our project efforts, and is squarely focused on tackling AI’s scale and workload needs.”
The upcoming OCP APAC Summit will feature keynote presentations from industry experts AMD, ASE, Broadcom, Digitimes, Google, Meta, NTT, Seagate, Supermicro, TSMC, and 10 breakout sessions, including OCP’s Future Technologies Symposium. On the exhibition floor, attendees will explore cutting-edge solutions from OCP members and sponsors, including Diamond Sponsors Auras and Y.S. Tech, showcasing smart controlled liquid cooling systems to support the thermal levels of modern AI clusters.
With an expected 36% of OCP-recognized equipment shipped in 2025 to the Asia-Pacific region, and nearly as much of the OCP membership base also in the region, the APAC Summit underscores the region’s critical role in driving AI from semiconductor innovation to all kinds of server, cooling and power systems infrastructure development.
Join us at the 2025 OCP APAC Summit to witness the momentum of open source hardware collaboration in shaping the future of AI infrastructure. The 2025 OCP APAC Summit in Taipei will further solidify this synergy, driving advancements in AI infrastructure. For more information or to register, visit the OCP APAC Summit page.