Difference between revisions of "Storage/Thermal Sim Methodology"
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Revision as of 17:15, 31 July 2020
Welcome to the OCP Thermal Sim Methodology workstream page
The Thermal Sim Methodology will try to standardize aspects of the thermal characterization of drives and systems to enable drive and system designers to use common methods, metrics, and assumptions when designing for thermal targets required by end-users. The goal of the methodology is to enable both "apples-to-apples" comparison of drives in a system, and also to enable the ecosystem to better anticipate thermal requirements of new form factors being considered by the ecosystem.
- - Dave Landsman (Western Digital)
Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See OCP Policies. If you have any questions please contact OCP.
|Initial EDSFF Thermal||NGD Systems||2020-10-28|
|E1.S Thermals Data||Dave Landsman & David Wright||Western Digital||2019-10-28|
|Datacenter SSD FF Thermal Issues||Jason Adrian||Microsoft||2019-10-28|
|E1.S Power Methodology||Brandon Gary||Microsoft||2019-12-12|
|EDSFF Thermal Methodology E1.S FF Width||Paul Gwin||Intel||2020-01-16|
|Thermal Workgroup Goals||Paul Gwin||Intel||2020-02-13|
|SSD Thermal Simulation Standardization for OCP Summit||Paul Gwin, Dave Landsman||Intel-Microsoft-WDC||2020-05-14|
|E3 Thermal Methodology Slides||Bill Lynn||DellEMC||2020-07-09|
|EDSFF Thermal Sim Spec Outline Doc v1||Bill Lynn||DellEMC||2020-07-23|
|Thermal Methodology Revisit Discussion||Paul Gwin||Intel||2020-07-30|
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