Storage/Thermal Sim Methodology: Difference between revisions

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==WELCOME==
==WELCOME==


:Welcome to the OCP '''Archival Storage''' Subproject.
Welcome to the OCP '''Thermal Sim Methodology''' workstream page


Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP [http://www.opencompute.org/about/ocp-policies/ OCP Policies] page.  If you have any questions please contact OCP.
The Thermal Sim Methodology will try to standardize aspects of the thermal characterization of drives and systems to enable drive and system designers to use common methods, metrics, and assumptions when designing for thermal targets required by end-users.  The goal of the methodology is to enable both "apples-to-apples" comparison of drives in a system, and also to enable the ecosystem to better anticipate thermal requirements of new form factors being considered by the ecosystem.


==Get Involved==
==Links==


:- [https://ocp-all.groups.io/g/OCP-Storage Storage Project Mailing List]
:- [https://ocp-all.groups.io/g/OCP-Storage Storage Project Mailing List]
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:- [http://opencompute.org/projects/projects-calendar/ OCP Calendar]
:- [http://opencompute.org/projects/projects-calendar/ OCP Calendar]


==Project Leadership==
==Leads==


'''Project Leads'''
:- [mailto:dave.landsman@wdc.com Dave Landsman] (Western Digital)
:- [mailto:jason.adrian@ocproject.net Jason Adrian] (Microsoft)
:- [mailto:dave.landsman@ocproject.net Dave Landsman] (Western Digital)


==Documents==
==Documents==
Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See [http://www.opencompute.org/about/ocp-policies/ OCP Policies].  If you have any questions please contact OCP.
{| class="wikitable"
|+ style="text-align: left;" | Thermal Sim Workstream Documents
|-
! Topic
! Speaker
! Company
! Date Presented
|-
| [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/026f92ca984b83fe8859db3f97e8e40829c15381.pdf Initial EDSFF Thermal]
|
| NGD Systems
| 2020-10-28
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=7012cffb68ba9292eb54b5bb51ec598c&download E1.S Thermals Data]
| Dave Landsman & David Wright
| Western Digital
| 2019-10-28
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=d70dfaa48f298b3680a65e83eb293447&download Datacenter SSD FF Thermal Issues]
| Jason Adrian
| Microsoft
| 2019-10-28
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=29c871d95a76534439ff8c44d923932e&download E1.S Power Methodology]
| Brandon Gary
| Microsoft
| 2019-12-12
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=6c23bd27be247cf239f76576f7f29a86&download EDSFF Thermal Methodology E1.S FF Width]
| Paul Gwin
| Intel
| 2020-01-16
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=976372ab6b04df5b24ee68b9509cc85d&download Thermal Workgroup Goals]
| Paul Gwin
| Intel
| 2020-02-13
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=2d4847fd8fc6ee1cbd48221adf29e7ed&download SSD Thermal Simulation Standardization for OCP Summit]
| Paul Gwin, Dave Landsman
| Intel-Microsoft-WDC
| 2020-05-14
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=828242f79f96acab22bc31c190600273&download E3 Thermal Methodology Slides]
| Bill Lynn
| DellEMC
| 2020-07-09
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=1fd321b9b0a295bafe6fa41765bdf9a0&download EDSFF Thermal Sim Spec Outline Doc v1]
| Bill Lynn
| DellEMC
| 2020-07-23
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=b915c9e26360fcfed68ffbb59f54564b&download Thermal Methodology Revisit Discussion]
| Paul Gwin
| Intel
| 2020-07-30
|}


==Meetings==
==Meetings==


Meeting Information: Every Thursday at 3pm Pacific Time
Meeting Information: Every Thursday at 3pm-4pm US Pacific Time, though Thursday, August-27


* [https://global.gotomeeting.com/join/881571341 Call Link]
* [https://global.gotomeeting.com/join/881571341 Call Link]
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==Recordings from Past Calls==
==Recordings from Past Calls==
:- [https://www.youtube.com/watch?v=fk5pfqcn3Uk&feature=youtu.be Tape Durability Modeling Workstream: February 26th, 2019]
:- [https://www.youtube.com/watch?v=89aEL1_PwEo August 6th, 2020]
:- [https://www.youtube.com/watch?v=6wkXJiy_3ZE&feature=youtu.be Tape Durability Modeling Workstream: February 12th, 2019]
:- [https://www.youtube.com/watch?v=dhLTnFGKCus July 30th, 2020]
:- [https://www.youtube.com/watch?v=9K84IH8yPrc&feature=youtu.be Tape Durability Modeling Workstream: January 8th, 2019]
:- [https://www.youtube.com/watch?v=JgNR1iP_Gc8 July 23rd, 2020]
:- [https://www.youtube.com/watch?v=YqhtNpjk6aw&feature=youtu.be Tape Durability Modeling Workstream: December 18th, 2018]
:- [https://www.youtube.com/watch?v=K8TW-LMCDCI July 16th, 2020]
:- [https://www.youtube.com/watch?v=wzjJvzjEEkk&feature=youtu.be Tape Durability Modeling Workstream: December 4th, 2018]
:- [https://www.youtube.com/watch?v=SSGFPa7SvlI June 25th, 2020]
:- [https://www.youtube.com/watch?v=bHZ3T7rPbrg&feature=youtu.be Archival Storage Kickoff call: September 4th, 2018]
:- [https://www.youtube.com/watch?v=mUUQl0ANPpE&feature=youtu.be February 27th, 2020]
:- February 20th, 2020
:- [https://www.youtube.com/watch?v=yJd80c4XHGU&feature=youtu.be February 13th, 2020]
:- [https://www.youtube.com/watch?v=PkyVGFyxK3M&feature=youtu.be February 6th, 2020]

Revision as of 16:29, 7 August 2020

OCP-Open-compute-archival-storage-1x-v1-38a.png

WELCOME

Welcome to the OCP Thermal Sim Methodology workstream page

The Thermal Sim Methodology will try to standardize aspects of the thermal characterization of drives and systems to enable drive and system designers to use common methods, metrics, and assumptions when designing for thermal targets required by end-users. The goal of the methodology is to enable both "apples-to-apples" comparison of drives in a system, and also to enable the ecosystem to better anticipate thermal requirements of new form factors being considered by the ecosystem.

Links

- Storage Project Mailing List
- OCP website
- OCP Calendar

Leads

- Dave Landsman (Western Digital)

Documents

Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See OCP Policies. If you have any questions please contact OCP.

Thermal Sim Workstream Documents
Topic Speaker Company Date Presented
Initial EDSFF Thermal NGD Systems 2020-10-28
E1.S Thermals Data Dave Landsman & David Wright Western Digital 2019-10-28
Datacenter SSD FF Thermal Issues Jason Adrian Microsoft 2019-10-28
E1.S Power Methodology Brandon Gary Microsoft 2019-12-12
EDSFF Thermal Methodology E1.S FF Width Paul Gwin Intel 2020-01-16
Thermal Workgroup Goals Paul Gwin Intel 2020-02-13
SSD Thermal Simulation Standardization for OCP Summit Paul Gwin, Dave Landsman Intel-Microsoft-WDC 2020-05-14
E3 Thermal Methodology Slides Bill Lynn DellEMC 2020-07-09
EDSFF Thermal Sim Spec Outline Doc v1 Bill Lynn DellEMC 2020-07-23
Thermal Methodology Revisit Discussion Paul Gwin Intel 2020-07-30

Meetings

Meeting Information: Every Thursday at 3pm-4pm US Pacific Time, though Thursday, August-27

You can also dial in using your phone. United States: +1 (646) 749-3122

Access Code: 881-571-341

Recordings from Past Calls

- August 6th, 2020
- July 30th, 2020
- July 23rd, 2020
- July 16th, 2020
- June 25th, 2020
- February 27th, 2020
- February 20th, 2020
- February 13th, 2020
- February 6th, 2020