Storage/Thermal Sim Methodology: Difference between revisions

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Welcome to the OCP '''Thermal Sim Methodology''' workstream page
Welcome to the OCP '''Thermal Sim Methodology''' workstream page


Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP [http://www.opencompute.org/about/ocp-policies/ OCP Policies] page.  If you have any questions please contact OCP.
The Thermal Sim Methodology will try to standardize aspects of the thermal characterization of drives and systems to enable drive and system designers to use common methods, metrics, and assumptions when designing for thermal targets required by end-users.  The goal of the methodology is to enable both "apples-to-apples" comparison of drives in a system, and also to enable the ecosystem to better anticipate thermal requirements of new form factors being considered by the ecosystem.


==Links==
==Links==
Line 17: Line 17:


==Documents==
==Documents==
:- [http://files.opencompute.org/oc/public.php?service=files&t=976372ab6b04df5b24ee68b9509cc85d&download Thermal Workgroup Goals]
 
:- [http://files.opencompute.org/oc/public.php?service=files&t=828242f79f96acab22bc31c19060027&download3 E3 Thermal Methodology Slides]
Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See [http://www.opencompute.org/about/ocp-policies/ OCP Policies].  If you have any questions please contact OCP.
:- [http://files.opencompute.org/oc/public.php?service=files&t=1fd321b9b0a295bafe6fa41765bdf9a0&download EDSFF Thermal Sim Spec Outline Doc]
 
:- [http://files.opencompute.org/oc/public.php?service=files&t=2d4847fd8fc6ee1cbd48221adf29e7ed&download Intel-WDC-Microsoft - SSD Thermal Simulation Standardization]
{| class="wikitable"
|+ style="text-align: left;" | Thermal Sim Workstream Documents
|-
! Topic
! Speaker
! Company
! Date Presented
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=976372ab6b04df5b24ee68b9509cc85d&download Thermal Workgroup Goals]
| Paul Gwin
| Intel
| 2020-02-13
|-
| [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/026f92ca984b83fe8859db3f97e8e40829c15381.pdf Initial EDSFF Thermal]
|
| NGD Systems
|
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=2d4847fd8fc6ee1cbd48221adf29e7ed&download Intel-WDC-Microsoft - SSD Thermal Simulation Standardization]
| Paul Gwin, Dave Landsman
| Intel, WDC
| 2020-05-14
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=828242f79f96acab22bc31c19060027&download3 E3 Thermal Methodology Slides]
| Bill Lynn
| DellEMC
| 2020-07-09
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=1fd321b9b0a295bafe6fa41765bdf9a0&download EDSFF Thermal Sim Spec Outline Doc v1]
| Bill Lynn
| DellEMC
| 2020-07-23
|}
 


==Meetings==
==Meetings==

Revision as of 16:58, 27 July 2020

OCP-Open-compute-archival-storage-1x-v1-38a.png

WELCOME

Welcome to the OCP Thermal Sim Methodology workstream page

The Thermal Sim Methodology will try to standardize aspects of the thermal characterization of drives and systems to enable drive and system designers to use common methods, metrics, and assumptions when designing for thermal targets required by end-users. The goal of the methodology is to enable both "apples-to-apples" comparison of drives in a system, and also to enable the ecosystem to better anticipate thermal requirements of new form factors being considered by the ecosystem.

Links

- Storage Project Mailing List
- OCP website
- OCP Calendar

Leads

- Dave Landsman (Western Digital)

Documents

Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See OCP Policies. If you have any questions please contact OCP.

Thermal Sim Workstream Documents
Topic Speaker Company Date Presented
Thermal Workgroup Goals Paul Gwin Intel 2020-02-13
Initial EDSFF Thermal NGD Systems
Intel-WDC-Microsoft - SSD Thermal Simulation Standardization Paul Gwin, Dave Landsman Intel, WDC 2020-05-14
E3 Thermal Methodology Slides Bill Lynn DellEMC 2020-07-09
EDSFF Thermal Sim Spec Outline Doc v1 Bill Lynn DellEMC 2020-07-23


Meetings

Meeting Information: Every Thursday at 3pm-4pm US Pacific Time, though Thursday, August-27

You can also dial in using your phone. United States: +1 (646) 749-3122

Access Code: 881-571-341

Recordings from Past Calls

- July 23rd, 2020
- July 16th, 2020
- June 25th, 2020
- February 27th, 2020
- February 20th, 2020
- February 13th, 2020
- February 6th, 2020