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==Welcome==
==Welcome==


Welcome to the OCP Mezzanine NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in Mezzanine NIC space, under OCP framework.
Welcome to the OCP NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in OCP NIC space, under OCP framework.


===Guideline===
===Guideline===
Line 27: Line 27:
==Get Involved==
==Get Involved==


===Updated Specification Docs===


===Updates===
{| class="wikitable"
'''6/20/2017'''
|-
! Doc
! Version
! Date
! Contributor
! Notes
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=36c523d1b0ab146350da5f13a61ec94c OCP NIC 3.0 rev_tracking_20180905]
| 20180905
| 9/5/2018
| OCP NIC subgroup
| This spreadsheet tracks the changes being discussed; Please follow this closely if you have design in pipeline.
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=68f7f9748a4af4095924eb055890d102 OCP_NIC_3.0_draft_0v83_20180829d_TN_no_CB]
| 0v83
| 8/29/2018
| Intel
| 0v83 Specification(clean)
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=0d13122d42d86a8cdf0cdfa9814963cd OCP_NIC_3.0_draft_0v83_20180829d_TN_CB]
| 0v83
| 8/29/2018
| Intel
| 0v83 Specification(with comment bar)
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=aca375810e3787c00a2f4bbf004f8f8a OCP 3.0 Pinout 0v82_20180802a_TN]
| 0v82
| 8/2/2018
| Intel
| Pinout table
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=b24780951288fdae2431c1ab44df3cd4 OCP_NIC_3.0_thermal_models_0v80_20180604]
| 0v80
| 6/4/2018
| OCP NIC subgroup
| Thermal CFD model (Icepack) with Mechanical model (STEP) extracted
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=3d2c62369df9cdc4eb33424af0a203b6 OCP_NIC_3.0_thermal_TestFixture_0v80_20180604]
| 0v80
| 6/4/2018
| OCP NIC subgroup
| Thermal test fixture mechanical model(STEP) for small and large form factor NIC
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=ebaec8a30591a0ecb483a45a5e37a8a8 OCP_NIC_3.0_3D_CAD_0v80_20180525]
| 0v80
| 5/25/2018
| OCP NIC subgroup
| Mechanical 3D CAD models
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=32b40716c2e1953666e43dd7d06b4d1e NIC_OCPv3_Drawings_rev0.8_20180601]
| 0v80
| 6/1/2018
| OCP NIC Subgroup
| Mechanical 2D Drawings
 
|}
 
===Supporting docs and presentations===
 
{| class="wikitable"
|-
! Doc
! Version
! Date
! Contributor
! Notes
 
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=fb6459537cb2cf7a77a02b0b86247bec OCP_NIC_3.0_discussion_r12_20180123]
| v12
| 1/23/2018
| OCP NIC Subgroup
| Presentation to Server WG/IC
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=6b94014ed393a1229c0d3c296c0fc3a0 Mezz3.0 schedule v7_20180123]
| v7
| 1/23/2018
| Facebook
| OCP NIC 3.0 spec project schedule
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=e4c9401b56215bd33ea4f37336710c48 OCP NIC 3.0_Mechanical Discussion_v5_20171201_d]
| v5
| 12/01/2017
| Facebook
| Mechanical Deck


See below for material for tomorrow's call:


[http://files.opencompute.org/oc/public.php?service=files&t=c6cd05fb6c2046c878ac7c9ddb010e31 Summary of simulation results under stand-by power]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=420aabdf9be26d4d3c90cb199a4cd369 Thermal Deck_v7_20171115]
| v7
| 11/15/2017
| Facebook
| Thermal deck


[http://files.opencompute.org/oc/public.php?service=files&t=76c7973c379d6849e7bc0d96eeb95a73 Presentation slides]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=6e30e729b094d6c5f3a2eb49c7611901 Updated thermal Simulation Results_v7_20171103]
| v7
| 11/3/2017
| Facebook
| Thermal simulation result update


--- '''Agenda'''


1. Review latest round of simulation results
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=bf394a4b8394ece800712a690a06bf57 HPE_Comments_on_OCP_Mezz_v3_20170816]
| N/A
| 8/16/2017
| HPE
| Presentation from HPE on 8/16/2017 call


2. Go over a few topics for discussion
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=7d48739a75eb23c5ad5805f5451233df Dell EMC - OCP NIC Presntation v1_20170906]
| v1
| 9/6/2017
| Dell-EMC
| Presentation from Dell-EMC on 9/6/2017 call


|-
| [http://files.opencompute.org/oc/public.php?service=files&t=ad9c60f6e25a5d2eaa38cc72f8b22069 Lenovo OCP Mezz3.0 Recommendations - 20170901]
| N/A
| 9/1/2017
| Lenovo
| A mechanical focused presentation from Lenovo on 9/6/2017 call


'''6/6/2017'''
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=a4f6fee57057e7e888f0f39b5661c8cf 9/25/2017 Workshop decks]
| N/A
| 9/25/2017
| Microsoft / TE / Amphenol / Broadcom / Intel / Facebook
| 9/25/2017 workshop slides from multiple contributors 


See below for material for tomorrow's call:
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=79d8d76c1942bc15d65776392c5fd411 9/25/2017 Workshop recording (large file 908MB)]
| N/A
| 9/25/2017
| Microsoft / TE / Amphenol / Broadcom / Intel / Facebook
| 9/25/2017 workshop recording from multiple contributors 


[http://files.opencompute.org/oc/public.php?service=files&t=7d19f143ec3f3109117904caf4a198cc Updated thermal model: Cases A1-A5]
|}


[http://files.opencompute.org/oc/public.php?service=files&t=776e636799258da85c562f69e22e05ae Updated thermal model: Cases A6-A10]
===0v70 Release Candidate Package ===


[http://files.opencompute.org/oc/public.php?service=files&t=7018dd736da61bf1a44030d4a582ce26 Updated thermal model: Cases D1-D8]
{| class="wikitable"
|-
! Specification Package
! Version
! Date
! Contributor
! Notes


[http://files.opencompute.org/oc/public.php?service=files&t=b86d25485cf6f4c191c9c2fec2806e73 Summary of simulation results using updated thermal models]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=03b815ef7595fca0e20b5c27b07f992b OCP_NIC_3.0_draft_0v70_20180125c_TN_no_CB]
| 0v70
| 1/25/2018
| OCP NIC subgroup
| Specification without comment bar for Server WG and IC review


[http://files.opencompute.org/oc/public.php?service=files&t=0f43d212fb481bca0efd5befbed07af1 Presentation slides]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=ed2b9296d00618efbe4c8216a6bb1b77 OCP_NIC_3.0_3D_CAD_0v70_20180122]
| 0v70
| 1/22/2018
| OCP NIC subgroup
| Mechanical 3D CAD models


--- '''Agenda'''
|-  
| [http://files.opencompute.org/oc/public.php?service=files&t=04ab98afb725e17401c17c0f72d9044b OCP_NIC_3.0_2D_Drawings_0v70_20180124]
| 0v70
| 1/24/2018
| OCP NIC Subgroup
| Mechanical 2D Drawings


1. Review changes to thermal models based on feedback from the community
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=3c2813cb2539c0dd9b279de5327ec220 OCP_NIC_3.0_thermal_models_0v70_20180124]
| 0v70
| 1/24/2018
| OCP NIC Subgroup
| Thermal CFD model(PACK) with Mechanical model(STEP) extracted


2. Review latest round of simulation results
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=ea4bfe9d5e2399e8f4135e6c48cafe38 OCP_NIC_3.0_thermal_TestFixture_0v70_20180124]
| 0v70
| 1/24/2018
| OCP NIC Subgroup
| Thermal test fixture mechanical model(STEP) for small form factor add-in-card


3. Go over a few topics for discussion
|}




'''5/16/2017'''
===Updates===


Here are the update in the past 2x weeks, and material for tomorrow's call:


[http://files.opencompute.org/oc/public.php?service=files&t=5fd1d10bed7d85c6876478a975b7c867 Updated thermal simulation case deck:Thermal Simulation Feedback_20170517]
'''1/19/2018 update'''


[http://files.opencompute.org/oc/public.php?service=files&t=9e5450687380a5c97feab23a3c0ccaf3 Update thermal simulation case spreadsheet: Updated Thermal Simulation Cases_20170511]
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=663f885d9dbbf9bcee8bab0e6adbe77f OCP_NIC_3.0_draft_0v63_20180119e_TN]


Additional questions to NIC suppliers:


- Standby(S5) power of NIC, or ratio of P_Standby / P_Max


- P_standby of Optical modules
'''1/18/2018 update'''


1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=7cd6c3ed5710b9c36e77eb164fe44718 OCP_NIC_3.0_draft_0v62_20180118f_TN]




'''4/28/2017'''


As we kicked off the discussion of Mezz thermal simulation on 4/19, here are the updates: 
'''1/16/2018 update'''


[http://files.opencompute.org/oc/public.php?service=files&t=cd97fcf9d20789a0128cdb4380f26f69 OCP Mezz 3.0 Thermal Simulation Description]
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=2ab0d4e234abf29f37e6298c72d1c236 OCP_NIC_3.0_draft_0v60_20180116e_TN]


[http://files.opencompute.org/oc/public.php?service=files&t=1a8ba4c5533db8696ea9fd1f5a9d8a8b OCP Mezz 3.0 Thermal Simulation Package]


Please give your feedback in mailing list and we will talk about it on next call on 5/3.


'''4/17/2017'''
'''1/15/2018 update'''


We have an updated schedule for comment and feedback:
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=f1a9f7e9027c24418f0d10a830e882ae OCP_NIC_3.0_draft_0v57_20180109c_TN]
[http://files.opencompute.org/oc/public.php?service=files&t=85117a6af40281399d13b87745f2c1ae Schedule Update V2]


Mezz 3.0 Survey is closed with 5 participants; Summary with company names masked can be found here:
[http://files.opencompute.org/oc/public.php?service=files&t=2f76191e6e3f7af67373148de827db77 Mezz 3.0 Survey filled 201704016]


A few updates were made to the master deck:
'''1/2/2018 update'''
[http://files.opencompute.org/oc/public.php?service=files&t=a906c9f2492d3d74e1053a4a82ba8331 Mezz 3.0 General Update]


Our next call is on 4/19/2017 Wednesday 9am PDT(2nd call of the month). As always, call-in info can be found [http://opencompute.org/community/ocp-calendars here].
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=fad43541dfd5abb8265663ec93164e99 OCP_NIC_3.0_draft_0v50_20171222i_TN]


--- '''Agenda'''
2. Move updates before 12/1/2017 to [http://www.opencompute.org/wiki/Server/Mezz/Update_Archive archive]


1. Sync with community about schedule refresher and get feedback for schedule and milestone


2. Summary of survey
'''12/20/2017 update'''


3. John Fernandes will share methodology for thermal simulation
1. Updated spec draft, overview deck, and mechanical deck


4. Call for more feedback on a few options (9,10,11,12)


'''12/5/2017 update'''


1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN


2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN


3. Specification draft complete rate (Estimation)


'''3/29/2017'''
{| class="wikitable"
|-
! Chapter
! Draft complete rate
! Status


1. Ramp NIC survey template version to v03 to have more exact wording.  [http://files.opencompute.org/oc/public.php?service=files&t=888e8eb91172c13653c0bf733ca3b27f Template v03]
|-
|1. Overview
| 70% drafted
| finishing up / under review


2. Due to the limitation of mailing-list with attachment, please send the filled template to [mailto:jia.ning@ocproject.net jia.ning@ocproject.net]. Jia will aggregate and update to the wiki based on your selection of the confidential level (cell B6,B7 of the template v03)
|-
|2. Card form factor
| 60+% drafted
| finishing up / under review


3. [http://files.opencompute.org/oc/public.php?service=files&t=399a90213e5fe9004c79e7bd0be5041e Schedule proposal v01] is available for review and comment. A few notes:
|-
|3. Card Edge and baseboard interface
| 80+ % drafted
| Under review


- Overall it includes 3x stages: Information collection => Narrow down direction => work out details and 1st draft
|-
|4. Management
|0% drafted
|Need to work on


- The v01 schedule is on the aggressive side, i.e. the best case scenario when everything goes as expected.  
|-
|5. Data Network requirement
|TBD
|Same content as Mezz 2.0; check for need to keep this chapter


- Please review it, give inputs in mailing-list, and discuss in the call next week.
|-
|6. Card routing guideline and SI consideration
|TBD
|NC-SI specified on card; PCIe TBD


|-
|7. Thermal and Environmental
|TBD
|Need edit based on Mezz 2.0


|}


'''3/24/2017'''
4. Key mechanical updates:


An [http://files.opencompute.org/oc/public.php?service=files&t=4baf98af7f736844e149508321370650 improved version of survey template v02] is created.
- Agreed on guiding feature and card sizes
All NIC suppliers are strongly recommend to participate to influence Mezz 3.0.
Inputs from System supplier and Hyper-scale/CSP are welcome as well.


Agenda for next meeting (4/5)
- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)


1. Review overall Mezz 3.0 work schedule
To be closed:


2. Review the boundary with the context of major options
- Front bracket / latching mechanism design for small and large form factors


3. Pick major option branches to perform more detailed study
- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis


- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study


'''3/22/2017'''


A survey of boundary condition of typical use cases is going on.
5. Coming working sessions and proposal of agenda:


Detail see [http://lists.opencompute.org/pipermail/opencompute-mezz-card/2017-March/000003.html here]
-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work


Please reply to mailing-list to share your boundary condition of Mezz3.0 or write to [mailto:jia.ning@ocproject.net Jia Ning]
-#8 12/13: 3-4hr: All draft work due for 1st pass of edit of all chapters. 1st cross review with changes suggested and agreed


'''3/14/2017'''
-#9 12/20: 3-4hr: Review changes and post 1st draft


1. [https://www.youtube.com/watch?v=M9vg974Ww_4 Video of 3/17/2017 OCP Server workshop talk - Mezz 2.0 and beyond]


2. [http://files.opencompute.org/oc/public.php?service=files&t=6f58019848967b203deefef128c0aa04 Slide deck of 3/9/2017 workshop ]


3. [http://files.opencompute.org/oc/public.php?service=files&t=98ba555198e7083741fefbbf6794c12d Visco file for placement study]




Line 178: Line 352:
===Meetings===
===Meetings===


This project meets - 2 times a Month; Defaults to 1st and 3rd Wednesday of the Month.
This project meets - 1 times a Month; Defaults to 1st Wednesday of the Month.


Call-in info and source of truth @ http://opencompute.org/community/ocp-calendars (Time zone shown: Eastern Time)  
Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)  


This call is open to the public.
This call is open to the public.
Line 188: Line 362:
Meeting minutes is sent out in mailing list and can be found at [http://lists.opencompute.org/pipermail/opencompute-mezz-card/ archive]
Meeting minutes is sent out in mailing list and can be found at [http://lists.opencompute.org/pipermail/opencompute-mezz-card/ archive]


===Recordings from Past Calls===
:- [https://www.youtube.com/watch?v=89F5yU5neP0&feature=youtu.be September 5th, 2018]
:- [https://www.youtube.com/watch?v=NrODQ5L6-F0&feature=youtu.be August 1st, 2018]
:- [http://files.opencompute.org/oc/public.php?service=files&t=fb67c22fc935d197a84a7a23898d5912 May 2nd, 2018]
:- [http://files.opencompute.org/oc/public.php?service=files&t=6296c3d7ebed645accc69b5a5668c09e April 18th, 2018]
:- [http://files.opencompute.org/oc/public.php?service=files&t=ac2976a35455b6870f9b0090ad84ffee April 4th, 2018]


===Events===
===Events===

Revision as of 15:43, 6 September 2018

Welcome

Welcome to the OCP NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in OCP NIC space, under OCP framework.

Guideline

We are here to build a supportive, informative and inclusive community:


Supportive

- Support implementation questions

- Evaluate new use cases

Informative

- Share the latest topics and trends related to OCP Mezz NIC spec

- Share both challenges and opportunities

Inclusive

- Take community feedback and make iterations to proposal before submitting major revision to work group and IC

- Open to both adopters, and observers

Get Involved

Updated Specification Docs

Doc Version Date Contributor Notes
OCP NIC 3.0 rev_tracking_20180905 20180905 9/5/2018 OCP NIC subgroup This spreadsheet tracks the changes being discussed; Please follow this closely if you have design in pipeline.
OCP_NIC_3.0_draft_0v83_20180829d_TN_no_CB 0v83 8/29/2018 Intel 0v83 Specification(clean)
OCP_NIC_3.0_draft_0v83_20180829d_TN_CB 0v83 8/29/2018 Intel 0v83 Specification(with comment bar)
OCP 3.0 Pinout 0v82_20180802a_TN 0v82 8/2/2018 Intel Pinout table
OCP_NIC_3.0_thermal_models_0v80_20180604 0v80 6/4/2018 OCP NIC subgroup Thermal CFD model (Icepack) with Mechanical model (STEP) extracted
OCP_NIC_3.0_thermal_TestFixture_0v80_20180604 0v80 6/4/2018 OCP NIC subgroup Thermal test fixture mechanical model(STEP) for small and large form factor NIC
OCP_NIC_3.0_3D_CAD_0v80_20180525 0v80 5/25/2018 OCP NIC subgroup Mechanical 3D CAD models
NIC_OCPv3_Drawings_rev0.8_20180601 0v80 6/1/2018 OCP NIC Subgroup Mechanical 2D Drawings

Supporting docs and presentations

Doc Version Date Contributor Notes


OCP_NIC_3.0_discussion_r12_20180123 v12 1/23/2018 OCP NIC Subgroup Presentation to Server WG/IC
Mezz3.0 schedule v7_20180123 v7 1/23/2018 Facebook OCP NIC 3.0 spec project schedule
OCP NIC 3.0_Mechanical Discussion_v5_20171201_d v5 12/01/2017 Facebook Mechanical Deck


Thermal Deck_v7_20171115 v7 11/15/2017 Facebook Thermal deck
Updated thermal Simulation Results_v7_20171103 v7 11/3/2017 Facebook Thermal simulation result update


HPE_Comments_on_OCP_Mezz_v3_20170816 N/A 8/16/2017 HPE Presentation from HPE on 8/16/2017 call
Dell EMC - OCP NIC Presntation v1_20170906 v1 9/6/2017 Dell-EMC Presentation from Dell-EMC on 9/6/2017 call
Lenovo OCP Mezz3.0 Recommendations - 20170901 N/A 9/1/2017 Lenovo A mechanical focused presentation from Lenovo on 9/6/2017 call
9/25/2017 Workshop decks N/A 9/25/2017 Microsoft / TE / Amphenol / Broadcom / Intel / Facebook 9/25/2017 workshop slides from multiple contributors
9/25/2017 Workshop recording (large file 908MB) N/A 9/25/2017 Microsoft / TE / Amphenol / Broadcom / Intel / Facebook 9/25/2017 workshop recording from multiple contributors

0v70 Release Candidate Package

Specification Package Version Date Contributor Notes
OCP_NIC_3.0_draft_0v70_20180125c_TN_no_CB 0v70 1/25/2018 OCP NIC subgroup Specification without comment bar for Server WG and IC review
OCP_NIC_3.0_3D_CAD_0v70_20180122 0v70 1/22/2018 OCP NIC subgroup Mechanical 3D CAD models
OCP_NIC_3.0_2D_Drawings_0v70_20180124 0v70 1/24/2018 OCP NIC Subgroup Mechanical 2D Drawings
OCP_NIC_3.0_thermal_models_0v70_20180124 0v70 1/24/2018 OCP NIC Subgroup Thermal CFD model(PACK) with Mechanical model(STEP) extracted
OCP_NIC_3.0_thermal_TestFixture_0v70_20180124 0v70 1/24/2018 OCP NIC Subgroup Thermal test fixture mechanical model(STEP) for small form factor add-in-card


Updates

1/19/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v63_20180119e_TN


1/18/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v62_20180118f_TN


1/16/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v60_20180116e_TN


1/15/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v57_20180109c_TN


1/2/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v50_20171222i_TN

2. Move updates before 12/1/2017 to archive


12/20/2017 update

1. Updated spec draft, overview deck, and mechanical deck


12/5/2017 update

1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN

2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN

3. Specification draft complete rate (Estimation)

Chapter Draft complete rate Status
1. Overview 70% drafted finishing up / under review
2. Card form factor 60+% drafted finishing up / under review
3. Card Edge and baseboard interface 80+ % drafted Under review
4. Management 0% drafted Need to work on
5. Data Network requirement TBD Same content as Mezz 2.0; check for need to keep this chapter
6. Card routing guideline and SI consideration TBD NC-SI specified on card; PCIe TBD
7. Thermal and Environmental TBD Need edit based on Mezz 2.0

4. Key mechanical updates:

- Agreed on guiding feature and card sizes

- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)

To be closed:

- Front bracket / latching mechanism design for small and large form factors

- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis

- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study


5. Coming working sessions and proposal of agenda:

-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work

-#8 12/13: 3-4hr: All draft work due for 1st pass of edit of all chapters. 1st cross review with changes suggested and agreed

-#9 12/20: 3-4hr: Review changes and post 1st draft




Find Archive of updates here

Find archive of mailing-list here


Meetings

This project meets - 1 times a Month; Defaults to 1st Wednesday of the Month.

Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)

This call is open to the public.

If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.

Meeting minutes is sent out in mailing list and can be found at archive

Recordings from Past Calls

- September 5th, 2018
- August 1st, 2018
- May 2nd, 2018
- April 18th, 2018
- April 4th, 2018

Events

2017/3/9

OCP Engineering Workshop Sessions https://ocpussummit2017.sched.com/event/9SAa/ocp-mezzanine-nic-20-and-beyond

More information about OCP events can be found at: http://www.opencompute.org/community/events/ocp-events-calendar


Communication

- Project communication is done through the opencompute-mezz-card mailing list.

- Please make sure following the steps until you receive confirmation email and welcome email from Opencompute-mezz-card@lists.opencompute.org.

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Specifications and Designs

All these accepted by the IC

Specification Version Submit Date Contributor License Notes
OCP Mezzanine card v2.0

OCP_Mezz_2.0_rev1.00_20151215b_pub_release.pdf(2.2MB)

OCP_Mezz_2.0_rev1.00_20151215b_pub_release_3D_package.zip (88MB)

Mechanical 20151023_P1-P9_K1-K5 zip file (57MB)

V2.0-1.0 Dec 15, 2015 Facebook OWFa 1.0 Added support for x16 (quad x4), NCSI, dual QSFP+, & Quad SDP+

Accepted by OCP IC 2/24/2016

OCP Mezzanine card v0.5, original standard

Mezzanine Card (rev 0.5)

V0.5 Oct 8, 2012 Facebook OWFa 1.0 Defacto standard for the original network mezzanine with a x8 PCIe Gen3 interface