Server/DC-MHS: Difference between revisions

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==Get Involved==
==Get Involved==
*[mailto:dcmhs@opencompute.org Mailing List]
*[mailto:dcmhs@opencompute.org Mailing List]
*[https://www.opencompute.org/projects/server OCP Calenar]
*[https://www.opencompute.org/projects/server OCP Calendar]
 


==Meeting Schedule==
==Meeting Schedule==

Revision as of 22:35, 14 November 2022

OCP-servers-v1-17a3x.png

Welcome

Welcome to the OCP DC-MHS Sub-Project.

DC-MHS R1 envisions interoperability between key elements of datacenter, edge and enterprise infrastructure by providing consistent interfaces and form factors among modular building blocks.

DC-MHS R1 standardizes a collection of HPM (Host Processor Modules) form-factors and supporting ingredients to allow interoperability of HPMs and platforms.

There are seven workstreams that comprise DC-MHS:

  • M-FLW (FulL Width HPM)
  • M-DNO (DeNsity Optimized HPM)
  • M-XIO (eXtended I/O Connectivity)
  • M-PIC (Platform Infrastructure Connectivity)
  • M-CRPS (Common Redundant Power Supply)
  • M-PESTI (PEripheral SideBand Tunneling Interface)
  • M-SIF (Shared InFrastructure)

Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found on the OCP Policies page. If you have any questions please contact OCP.


Project Leadership

Sub-Project Leads

Incubation Committee Representative

DC-MHS Wiki Administrator


Current Status

DC-MHS R1 specs have been approved by the OCP Incubation Committee in November 2022.

Approved Contributions

Workstream Spec
M-FLW SPEC, DC-MHS M-FLW
M-DNO SPEC, DC-MHS M-DNO
M-XIO SPEC, DC-MHS M-XIO
M-PIC SPEC, DC-MHS M-PIC
M-CRPS SPEC, DC-MHS M-CRPS
M-PESTI SPEC, DC-MHS M-PESTI
M-SIF Workstream new to DC-MHS in October 2022. Spec is in progress.


Get Involved

Meeting Schedule

For public meetings:

  • Schedule is TBD

Each workstream has its own weekly meeting. Only members in the workstream will receive the meeting invitation:

  • Related info to be sent to each workstream mailing list.


Slides/Recordings from Global Summit

Title Presenter Video Slides
PANEL: DC-MHS R1 report-out and timeline Aurelio Rodriguez Echevarria (Intel Corporation) | Corey Hartman (Dell) | Tim Lambert (Dell Inc.) | Eduardo Estrada (Intel Corporation) Video Slides
PANEL: Datacenter Modular Hardware System (DC-MHS) Brian Aspnes (Intel Corporation) | Shawn Dube (Dell) | Jean-Marie Verdun (HPE) | Dharmesh Jani (Meta) Video Slides
Practical Usage of DC-MHS M-DNO Concepts Todd Westhauser (Meta) | Vincent Nguyen (HPE) Video Slides
Multi-host Modular Systems Dirk Blevins (Intel Corporation) Video Slides