Hardware Management/Hardware Management Module

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Welcome to the OCP Hardware Management Module Sub-project. This is a sub-project of the OCP Hardware Management Project
This Project is open to the public and we welcome all those who would like to be involved.
Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP OCP Policies page. If you have any questions please contact OCP.


This Subproject creates designs and specifications to enable interoperable hardware for platform manageability, in the form of System on a Module (SOM) designs. Deliverables from this project will include:

  • Specification for the interface between the System on a Module and the underlying platform
  • Design guides for platform designers wanting to use the module
  • Designs for reference modules and carrier cards

Presentation Template

- OCP Presentation Template - please contact Michael Schill or Archna Haylock for a copy

Project Overview

The management controller module separates the common platform management hardware and places them behind a connector. the module is specified by its connector pin-out The module may have one or more form-factors

Sub-Project Leadership

- Eric Shobe (Dropbox)
- Jared Mednick (Dropbox)
- Mailing List

Active Documents and Specs

Documents and information collateral are in the Wiki links above. Documents from the main HW Management Module group are below.

Type Description Version Submit Date Contributor License Notes
Specification OCP DC-SCM spec Rev 0.8_release_to_OCP.pdf 0.8 11/10/2020 Microsoft & Google OWFa 1.0 CLA 11/11/2020
* For review in November Server and HW-MGMT project calls
Presentation Intel Cyclone V-based RunBMC solution n/a 4/24/2020 Intel n/a Presented at OCP 2020

Accepted & Inspired submissions, available in the Marketplace

The most recent documents will always be in the OCP Marketplace, Specifications & Design Collateral or the OCP Marketplace, Orderable Products

Entries below are for ease of use and historical reference. Please use the marketplace links for the most recent documents.

Type Description Version Submit Date Contributor License Notes
Specification RunBMC DaughterBoard I/O Specification 1.4.1 Final 08/15/2020 Dropbox & Salesforce OWFa 1.0 CLA Approved
Product + Design Pkg RunBMC ASPEED AST2500 32mm card following RunBMC 1.4.1 Specification

RunBMC AST2500 OpenBMC Repo
RunBMC AST200 Design Package and Quick Start Guide

v1.0 08/15/2020 Hyve OWFa 1.0 Marketplace Product Link

Get Involved

Participate in the discussion, mailing list: Mailing List Info
Participate in HW Management Module sub-project meetings
- OCP Calendar