Hardware Management/Hardware Management Module: Difference between revisions

From OpenCompute
Jump to navigation Jump to search
No edit summary
 
(97 intermediate revisions by 6 users not shown)
Line 1: Line 1:
[[File:OCP-hardware-management-v1-17a3x.png|right]]
[[File:OCP-hardware-management-v1-17a3x.png|right]]
==Welcome==
==Welcome==


:Welcome to the OCP '''Hardware Management Module''' Sub-project. This is a sub-project of the [https://www.opencompute.org/projects/hardware-management OCP Hardware Management Project]
Welcome to the OCP '''Hardware Management Module''' Sub-project. This is a sub-project of the [https://www.opencompute.org/projects/hardware-management OCP Hardware Management Project]


:This Project is open to the public and we welcome all those who would like to be involved.
This Project is open to the public and we welcome all those who would like to be involved.
 
'''Disclaimer''': Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP [http://www.opencompute.org/about/ocp-policies/ OCP Policies] page.  If you have any questions please contact OCP.


:'''Disclaimer''': Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP [http://www.opencompute.org/about/ocp-policies/ OCP Policies] page.  If you have any questions please contact OCP.
==Charter==
==Charter==


This Subproject creates designs and specifications to enable interoperable hardware for platform manageability, in the form of System on a Module (SOM) designs. Deliverables from this project will include:  
This Subproject creates designs and specifications to enable interoperable hardware for platform manageability, in the form of System on a Module (SOM) designs. Deliverables from this project will include:
 
* Specification for the interface between the System on a Module and the underlying platform
* Specification for the interface between the System on a Module and the underlying platform
* Design guides for platform designers wanting to use the module
* Design guides for platform designers wanting to use the module
Line 15: Line 18:


==Presentation Template==
==Presentation Template==
:- OCP Presentation Template - please contact [mailto:michael@opencompute.org Michael Schill] or [mailto:archna@opencompute.org Archna Haylock] for a copy
 
* OCP Presentation Template - please contact [mailto:michael@opencompute.org Michael Schill] for a copy


==Project Overview==
==Project Overview==
The management controller module separates the common platform management hardware and places them behind a connector.
The management controller module separates the common platform management hardware and places them behind a connector.
the module is specified by its connector pin-out
the module is specified by its connector pin-out
Line 24: Line 29:
==Sub-Project Leadership==
==Sub-Project Leadership==


:- [mailto:eric.shobe@ocproject.net Eric Shobe] (Dropbox)
* [mailto:eric.shobe@ocproject.net Eric Shobe] (Dropbox)
:- [mailto:qian.wang@ocproject.net Qian Wang] (Intel)
* [mailto:qian.wang@ocproject.net Qian Wang] (Intel)
:- [mailto:OCP-HWMgt-Module@OCP-All.groups.io Mailing List]
* [mailto:OCP-HWMgt-Module@OCP-All.groups.io Mailing List]


==Active Documents and Specs==
==Active Documents and Specs==
Documents and information collateral are in the Wiki links above.  Documents from the main HW Management Module group are below.  
Documents and information collateral are in the Wiki links above.  Documents from the main HW Management Module group are below.  


Line 35: Line 41:
! Type
! Type
! Description
! Description
! Version
! Revision
! Submit Date
! Submit Date
! Contributor
! Contributor
Line 42: Line 48:
|-  
|-  
| Specification
| Specification
| [https://drive.google.com/file/d/1W59RMW7qdk6-vwKguOlehnuqzfOZ5cSD/view?usp=sharing OCP DC-SCM Rev 2.0 WIP spec]
| [https://drive.google.com/file/d/1JgcyV7cpO7hWGEfXFyQntb_Wd8XlzVFb/view?usp=sharing OCP DC-SCM 2.1 VFF Drawings candidate] <br>
| WIP 2.0
<br>[https://drive.google.com/file/d/11svaATDlTM83ZpQn8igNsJerIqtkbtKv/view?usp=drive_link OCP DC-SCM 2.1 candidate] <br>
| 1/11/2021
<br>[https://docs.google.com/spreadsheets/d/1z5PGqLqpGcdBancRXnPuoM6dvAst4uXB/edit?usp=sharing&ouid=105253787898679256966&rtpof=true&sd=true OCP DC-SCI Rev2.1 candidate] <br>
| N/A
<br>[https://drive.google.com/file/d/1XX5PTTd_rSwYCa0aRel2zOJoQ2QlhdiU/view?usp=drive_link OCP DC-SCM LTPI Rev2.1 candidate]<br>
| N/A
| 2.1
| 1/11/2021 <br> * For open specification development
|
| Advanced Micro Devices; AMI US Holdings Inc.; Ampere Computing; Arm, Ltd.; ASPEED Technology, Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Inspur Electronical Information Industry Co., Ltd.; Intel Corporation; Jabil, Inc.; Lattice Semiconductor Corporation; Lenovo, ISG; Microsoft Corporation; MiTAC Computing Technology Corporation; Nuvoton Technology Israel Ltd.; Oracle Americas, Inc.
| Modified OWFa 1.0 CLA (modified 07/2021)
| last updated October 2023 <br>
|-
| Specification
| [https://docs.google.com/spreadsheets/d/12ol0UGrBUqYrSsvis9ZAxPIfKi31ngPK/edit?usp=drive_link&ouid=105253787898679256966&rtpof=true&sd=true OCP HPM Common Circuit Type 1 Pinlist Rev 1.0 Ver 0.95] <br>
<br>[https://drive.google.com/file/d/1c2xcKEZeBsHyErmqzFNbSUjfyZiX892I/view?usp=drive_link OCP HPM Common Circuit Type 1 Spec Rev 1.0 Ver 0.5 RC3] <br>
| 1.0
|  
| Advanced Micro Devices; AMI US Holdings Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Intel Corporation; Lenovo, ISG; Nuvoton Technology Israel Ltd.
| Modified OWFa 1.0 CLA (modified 07/2021)
| last updated October 2023 <br>
|-
| Specification
| [https://drive.google.com/file/d/13BxuseSrKo647hjIXjp087ei8l5QQVb0/view?usp=sharing OCP DC-SCM Rev2.0 ver1.0 specification candidate] <br>
<br>[https://docs.google.com/spreadsheets/d/1hVDo6bPOfGd_guz-ERi5scG4Z2poZ2WK/edit?usp=sharing&ouid=105253787898679256966&rtpof=true&sd=true OCP DC-SCI Rev2.0 ver1.0 candidate] <br>
<br>[https://drive.google.com/file/d/17euR-9KYaPrjDnaF1WJ7p4e9vudVRk3Y/view?usp=sharing OCP DC-SCM Rev2.0 Security Considerations candidate] <br>
<br>[https://drive.google.com/file/d/1qo3ZVEtWUtg7tULW7kpMHCg7OUNkWOOR/view?usp=sharing OCP LTPI specification ver1.0 specification candidate] <br>
<br>[https://drive.google.com/file/d/1CUJFhHFzrvIji-16Av9NjjxWjJQgt9iA/view?usp=sharing OCP DC-SCM Rev2.0 mechanical files candidate] <br>
| 2.0
| July 27, 2022
| Advanced Micro Devices; AMI US Holdings Inc.; Ampere Computing; Arm, Ltd.; ASPEED Technology, Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Inspur Electronical Information Industry Co., Ltd.; Intel Corporation; Lattice Semiconductor Corporation; Lenovo, ISG; Microsoft Corporation; MiTAC Computing Technology Corporation; Oracle Americas, Inc.
| Modified OWFa 1.0 CLA (modified 07/2021)
| last updated July 2022 <br> Approved by IC <br>
|-  
|-  
| Specification
| Specification
| [https://www.opencompute.org/documents/ocp-dc-scm-spec-rev-0-95-pdf OCP DC-SCM spec Rev 0.95_release_to_OCP.pdf]
| [https://drive.google.com/file/d/13Uvmhknf8MZlN709uuP9I-MhlCmYGpuq/view?usp=sharing OCP DC-SCM Rev 1.0_release_to_OCP.pdf]
<br> [https://www.opencompute.org/documents/ocp-dc-scm-spec-rev-0-95-pdf OCP DC-SCM spec Rev 0.95_release_to_OCP.pdf]<br>
<br> [http://files.opencompute.org/oc/public.php?service=files&t=8a7616ead193abac8d309733ae556578&download OCP DC-SCM spec Rev 0.8_release_to_OCP.pdf]<br>
<br> [http://files.opencompute.org/oc/public.php?service=files&t=8a7616ead193abac8d309733ae556578&download OCP DC-SCM spec Rev 0.8_release_to_OCP.pdf]<br>
| 0.95
| 1.0
<br> 0.8 <br>
|3/26/2021
| 12/02/2020
<br> 12/02/2020 <br>
<br> 11/10/2020 <br>
<br> 11/10/2020 <br>
| Microsoft & Google
| Microsoft & Google
| OWFa 1.0 CLA
| OWFa 1.0 CLA
| 12/02/2020 <br> * For review in November IC calls <br>
| 05/26/2021 <br> * approved by IC, available on the contributions portal
03/26/2021 <br> * For submitting into the contribution database <br>
12/02/2020 <br> * For review in November IC calls <br>
11/11/2020 <br> * For review in November Server and HW-MGMT project calls <br>
11/11/2020 <br> * For review in November Server and HW-MGMT project calls <br>
|-  
|-  
| Presentation
| Specification
| [https://www.opencompute.org/documents/ewp172s2-intel-cyclone-v-based-runbmc-solution-with-openbmc-firmware-pptx Intel Cyclone V-based RunBMC solution]
| [https://docs.google.com/spreadsheets/d/1ZT9CW_g29edO5fk8FmXM5oQ7Fbc4hNu2/edit?usp=drive_link&ouid=105253787898679256966&rtpof=true&sd=true RunBMC v1.5 pinout Candidate]<br>
| n/a
<br>[https://drive.google.com/file/d/1qxoL8E4IwG3CJVcwOPrmgXAuyigQXRhw/view?usp=drive_link RunBMC v1.5 Candidate]<br>
| 4/24/2020
| 1.5
| Intel
| 9/28/2023
| n/a
| Dropbox, Intel
| Presented at OCP 2020
| OWF CLA 1.0
| Ready for review, please provide feedback to HWMM mailing list
|}
|}


==Accepted & Inspired submissions, available in the Marketplace==
==Accepted & Inspired submissions, available in the Marketplace==
The most recent documents will always be in the [http://www.opencompute.org/contributions OCP Marketplace, Specifications & Design Collateral]
 
or the [http://www.opencompute.org/products OCP Marketplace, Orderable Products]
The most recent documents will always be in the [http://www.opencompute.org/contributions OCP Marketplace, Specifications & Design Collateral] or the [http://www.opencompute.org/products OCP Marketplace, Orderable Products]


Entries below are for ease of use and historical reference.  Please use the marketplace links for the most recent documents.
Entries below are for ease of use and historical reference.  Please use the marketplace links for the most recent documents.
Line 97: Line 131:
| Product + Design Pkg
| Product + Design Pkg
| RunBMC ASPEED AST2500 32mm card following [https://www.opencompute.org/documents/ocp-runbmc-daughterboard-card-design-specification-v1-4-1-pdf RunBMC 1.4.1 Specification] <br>
| RunBMC ASPEED AST2500 32mm card following [https://www.opencompute.org/documents/ocp-runbmc-daughterboard-card-design-specification-v1-4-1-pdf RunBMC 1.4.1 Specification] <br>
[https://github.com/hyvedesignsolutions/openbmc RunBMC AST2500 OpenBMC Repo] <br>
| [https://github.com/hyvedesignsolutions/openbmc RunBMC AST2500 OpenBMC Repo] <br>
[https://www.opencompute.org/documents/runbmc-rev1-1-qsg-zip RunBMC AST200 Design Package and Quick Start Guide]
| [https://www.opencompute.org/documents/runbmc-rev1-1-qsg-zip RunBMC AST200 Design Package and Quick Start Guide] <br>
| v1.0
| v1.0
| 08/15/2020
| 08/15/2020
Line 108: Line 142:


==DC-SCM 2.0 Workgroup==
==DC-SCM 2.0 Workgroup==
'''Meetings'''
'''Meetings'''


This workgroup currently meets every Monday.
This workgroup currently meets on the first Monday of each Month.


Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)  
Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)  
Line 119: Line 154:


[https://docs.google.com/document/d/1JDePBrWVJ8q_0P7NhdfigQceBDrvBVwlMS9RidcnEQc/edit?usp=sharing DC-SCM2.0 meeting agenda and minutes]
[https://docs.google.com/document/d/1JDePBrWVJ8q_0P7NhdfigQceBDrvBVwlMS9RidcnEQc/edit?usp=sharing DC-SCM2.0 meeting agenda and minutes]
'''Specification'''
This is a live document, please contact [mailto:qian.wang@ocproject.net Qian Wang] if you would like to contribute as an author.
[https://drive.google.com/file/d/1g-IIiB1pj_DeZXTOQD96my-Djbik0f3Q/view?usp=sharing OCP DC-SCM Rev 2.0 WIP spec.docx]
This PDF version will be updated regularly and is available for comment
[https://drive.google.com/file/d/1W59RMW7qdk6-vwKguOlehnuqzfOZ5cSD/view?usp=sharing OCP DC-SCM Rev 2.0 WIP spec.pdf]


'''Opens tracking'''
'''Opens tracking'''
Line 136: Line 161:


[https://docs.google.com/spreadsheets/d/1PjMwjql1Dmcw8TzyvyaFFV2_3MHOAH-T8gK4wUQOSVs/edit?usp=sharing DC-SCM Rev 2.0 Opens tracking sheet]
[https://docs.google.com/spreadsheets/d/1PjMwjql1Dmcw8TzyvyaFFV2_3MHOAH-T8gK4wUQOSVs/edit?usp=sharing DC-SCM Rev 2.0 Opens tracking sheet]
'''Presentations'''
* [https://drive.google.com/file/d/19cuAlqqNhDJquRXciaV9RUpNMUfuNKoT/view?usp=sharing Design specification proposal]
* [https://www.opencompute.org/documents/ewp172s2-intel-cyclone-v-based-runbmc-solution-with-openbmc-firmware-pptx OCP summit 2020 Intel Cyclone V-based RunBMC solution.pptx]
* [https://www.youtube.com/watch?v=xkF42fTJFhg OCP summit 2020Intel Cyclone V-based RunBMC solution video]
* [https://drive.google.com/file/d/1smy7mkDTxuxlxQ0GcZ_pA4mcR5firYpP/view?usp=sharing DC-SCM2 -- System Usage Examples -- 2021-02-01]
* [https://drive.google.com/file/d/1RP3mLP_CUupJgkl6I9zh07hocp5W3TBK/view?usp=sharing DC-SCM2 -- OpenFSI proposal -- 2021-03-25]
* [https://drive.google.com/file/d/1FnIwJBhY68mVbf3RQA_7IZJqMe-saLSg/view?usp=sharing DC-SCM2 -- OpenFSI proposal -- 2021-05-31]
* [https://drive.google.com/file/d/1zsnXuHNL32N3U8IvmLmDIJdfVRcSMKeQ/view?usp=sharing MCSI Electrical IO Specification Proposal 4-15-2021.pdf]
* [https://www.youtube.com/watch?v=hE-R6OmL-rQ&t=4s OCP summit 2021 DC-Stack Overview Executive Talk]
* [https://www.youtube.com/watch?v=r7R7syteoqg OCP summit 2021 DC-Stack Overview Expo Hall Talk]
* [https://www.youtube.com/watch?v=b9-MrNwjoCw OCP summit 2021 DC-Stack Software]
* [https://www.youtube.com/watch?v=bd0aToWpOiM OCP summit 2021 DC-MHS]
* [https://www.youtube.com/watch?v=7gcYNPuhg84 OCP summit 2021 DC-XPI]
* [https://www.youtube.com/watch?v=ANgrfAuJhyU OCP summit 2021 DC-SCM 2.0 update]
* [https://www.youtube.com/watch?v=ECMKomGihxE OCP summit 2021 DC-SCM 1.0 update]
* [https://www.youtube.com/watch?v=wVJrabz3kYw OCP summit 2019 DC-SCM concept introduction]
* [https://www.youtube.com/watch?v=XbDhn88VvEk OCP Regional summit 2019: DC-SCM progress report]
* [https://www.youtube.com/watch?v=kcxwFGigW0Q OCP Regional summit 2019: DC-SCM for OAI]
* [https://www.youtube.com/watch?v=r1LAjt_JFN8z 2021 OCP Global Summit: Introduction of DC-SCM 2.0 LVDS Tunneling Protocol & Interface (LTPI)]
* [https://www.youtube.com/watch?v=mY3AjsquggY 2021 OCP Global Summit: Intel CycloneV RunBMC v2 Demo]
* [https://www.youtube.com/watch?v=3mq2xYnlr4k 2021 OCP Global Summit: Intel DC SCM 2.0 Prototype Demo]
* [https://www.youtube.com/watch?v=SQy7Ztf3nGU 2021 OCP Global Summit: Intel DC SCM 2 0 LTPI Demo]


==Get Involved==
==Get Involved==


:Participate in the discussion, mailing list: [https://ocp-all.groups.io/g/OCP-HWMgt-Module Mailing List Info]
* Participate in the discussion, mailing list: [https://ocp-all.groups.io/g/OCP-HWMgt-Module Mailing List Info]
:Participate in HW Management Module sub-project meetings
* Participate in HW Management Module sub-project meetings
: - [http://opencompute.org/projects/projects-calendar/ OCP Calendar]
* [https://www.opencompute.org/projects/project-and-ic-meetings-calendar/ OCP Calendar]
 
==Past Call Recordings==
 
===DC-SCM===
* [https://drive.google.com/file/d/1QYy1mUOMotphV3u7NBp_ljtLb9_xJg21/view?usp=sharing HWMM update March, 2024]
* [https://www.youtube.com/watch?v=NTmXtWq6BG8 DC-SCM2.0 May 2nd, 2022]
* [https://www.youtube.com/watch?v=-DsYm4wsRj0 DC-SCM2.0 April 4, 2022]
* [https://www.youtube.com/watch?v=d9W7T5cAjzQ DC-SCM2.0 March 7, 2022]
* [https://www.youtube.com/watch?v=xFnYeXxdtUg DC-SCM2.0 Feb 7, 2022]
* [https://www.youtube.com/watch?v=OInzH7Ob5CI DC-SCM2.0 Dec 6, 2021]
* [https://www.youtube.com/watch?v=toroFKx3VQo October 4th, 2021]
* [https://www.youtube.com/watch?v=Xfv5c3mGyio June 7th, 2021]
* [https://www.youtube.com/watch?v=w1njzN_VTKI May 10th, 2021]
* [https://www.youtube.com/watch?v=csHSHYeuCBA May 3rd, 2021]
* [https://www.youtube.com/watch?v=Io5Iu2Ah5E4 April 26th, 2021]
* [https://www.youtube.com/watch?v=LweZPDCxaoo April 19th, 2021]
* [https://www.youtube.com/watch?v=fnaL4e6S0AY April 12th, 2021]
* [https://www.youtube.com/watch?v=1XAzWEJxdws April 5th, 2021]
* [https://www.youtube.com/watch?v=0Wq7YVydgHk March 29th, 2021]
* [https://www.youtube.com/watch?v=WSOSaR2Agn8 March 15th, 2021]
* [https://www.youtube.com/watch?v=zU2y9wzswVY March 8th, 2021]
* [https://www.youtube.com/watch?v=kHu8i-bFbOo&feature=youtu.be March 1st, 2021]
* [https://www.youtube.com/watch?v=T9QM2veT_fE February 22nd, 2021]
* [https://www.youtube.com/watch?v=0ITzta35TAs February 8th, 2021]
* [https://www.youtube.com/watch?v=fwT1Ej2vCHY February 1st, 2021]
* [https://www.youtube.com/watch?v=hdo308ss_tc January 25th, 2021]

Latest revision as of 02:27, 11 March 2024

OCP-hardware-management-v1-17a3x.png

Welcome[edit]

Welcome to the OCP Hardware Management Module Sub-project. This is a sub-project of the OCP Hardware Management Project

This Project is open to the public and we welcome all those who would like to be involved.

Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP OCP Policies page. If you have any questions please contact OCP.

Charter[edit]

This Subproject creates designs and specifications to enable interoperable hardware for platform manageability, in the form of System on a Module (SOM) designs. Deliverables from this project will include:

  • Specification for the interface between the System on a Module and the underlying platform
  • Design guides for platform designers wanting to use the module
  • Designs for reference modules and carrier cards

Presentation Template[edit]

Project Overview[edit]

The management controller module separates the common platform management hardware and places them behind a connector. the module is specified by its connector pin-out The module may have one or more form-factors

Sub-Project Leadership[edit]

Active Documents and Specs[edit]

Documents and information collateral are in the Wiki links above. Documents from the main HW Management Module group are below.

Type Description Revision Submit Date Contributor License Notes
Specification OCP DC-SCM 2.1 VFF Drawings candidate


OCP DC-SCM 2.1 candidate

OCP DC-SCI Rev2.1 candidate

OCP DC-SCM LTPI Rev2.1 candidate

2.1 Advanced Micro Devices; AMI US Holdings Inc.; Ampere Computing; Arm, Ltd.; ASPEED Technology, Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Inspur Electronical Information Industry Co., Ltd.; Intel Corporation; Jabil, Inc.; Lattice Semiconductor Corporation; Lenovo, ISG; Microsoft Corporation; MiTAC Computing Technology Corporation; Nuvoton Technology Israel Ltd.; Oracle Americas, Inc. Modified OWFa 1.0 CLA (modified 07/2021) last updated October 2023
Specification OCP HPM Common Circuit Type 1 Pinlist Rev 1.0 Ver 0.95


OCP HPM Common Circuit Type 1 Spec Rev 1.0 Ver 0.5 RC3

1.0 Advanced Micro Devices; AMI US Holdings Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Intel Corporation; Lenovo, ISG; Nuvoton Technology Israel Ltd. Modified OWFa 1.0 CLA (modified 07/2021) last updated October 2023
Specification OCP DC-SCM Rev2.0 ver1.0 specification candidate


OCP DC-SCI Rev2.0 ver1.0 candidate

OCP DC-SCM Rev2.0 Security Considerations candidate

OCP LTPI specification ver1.0 specification candidate

OCP DC-SCM Rev2.0 mechanical files candidate

2.0 July 27, 2022 Advanced Micro Devices; AMI US Holdings Inc.; Ampere Computing; Arm, Ltd.; ASPEED Technology, Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Inspur Electronical Information Industry Co., Ltd.; Intel Corporation; Lattice Semiconductor Corporation; Lenovo, ISG; Microsoft Corporation; MiTAC Computing Technology Corporation; Oracle Americas, Inc. Modified OWFa 1.0 CLA (modified 07/2021) last updated July 2022
Approved by IC
Specification OCP DC-SCM Rev 1.0_release_to_OCP.pdf


OCP DC-SCM spec Rev 0.95_release_to_OCP.pdf

OCP DC-SCM spec Rev 0.8_release_to_OCP.pdf

1.0 3/26/2021


12/02/2020

11/10/2020

Microsoft & Google OWFa 1.0 CLA 05/26/2021
* approved by IC, available on the contributions portal

03/26/2021
* For submitting into the contribution database
12/02/2020
* For review in November IC calls
11/11/2020
* For review in November Server and HW-MGMT project calls

Specification RunBMC v1.5 pinout Candidate


RunBMC v1.5 Candidate

1.5 9/28/2023 Dropbox, Intel OWF CLA 1.0 Ready for review, please provide feedback to HWMM mailing list

Accepted & Inspired submissions, available in the Marketplace[edit]

The most recent documents will always be in the OCP Marketplace, Specifications & Design Collateral or the OCP Marketplace, Orderable Products

Entries below are for ease of use and historical reference. Please use the marketplace links for the most recent documents.

Type Description Version Submit Date Contributor License Notes
Specification RunBMC DaughterBoard I/O Specification 1.4.1 Final 08/15/2020 Dropbox & Salesforce OWFa 1.0 CLA Approved
Product + Design Pkg RunBMC ASPEED AST2500 32mm card following RunBMC 1.4.1 Specification
RunBMC AST2500 OpenBMC Repo
RunBMC AST200 Design Package and Quick Start Guide
v1.0 08/15/2020 Hyve OWFa 1.0 Marketplace Product Link

DC-SCM 2.0 Workgroup[edit]

Meetings

This workgroup currently meets on the first Monday of each Month.

Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)

This call is open to the public.

If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.

DC-SCM2.0 meeting agenda and minutes

Opens tracking

This is a live document, used to track and communicate open topics and feedbacks for the DC-SCM 2.0 specification This document contains pin definition revisions for the DC-SCM 2.0

DC-SCM Rev 2.0 Opens tracking sheet

Presentations

Get Involved[edit]

Past Call Recordings[edit]

DC-SCM[edit]