Cooling Environments/Hardware Management for Liquid Cooling: Difference between revisions
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Revision as of 19:28, 6 May 2022
Welcome to the OCP Hardware Management for Liquid Cooling Workstream under the Cooling Environments Project
This Project is open to the public and we welcome all those who would like to be involved.
Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP OCP Policies page. If you have any questions please contact OCP.
Lead: Mick Jones email@example.com
If you would like to get more involved in the project, please sign-up on the mailing list. This is the primary method that we use to communicate project status, meeting schedules, and agendas.