Innovation Village

Added in 2019, the Innovation Village (previously Experience Center) has become an extremely popular attraction in the Exhibit Hall where engineers showcase best-in-class product demos, solution stacks, software and hardware tools, and technologies under development or recently released by the various OCP Projects.

This area gives the OCP Community a venue to showcase OCP-recognized product offerings, discuss Community-authored specifications and emerging technology in the pipeline, while receiving direct feedback from Summit attendees. This is hands-on, engineering lab experience.

Make sure to visit the Innovation Village Stations at the upcoming 2025 OCP EMEA Summit in Dublin April 29-30!

Server / Composable Memory System:

Better Together: Advancing AI and Hyperscale Workloads with Collaborative Memory Solutions
ZeroPoint Technologies & Rambus
This demonstration showcases the collaborative efforts of OCP community members Rambus and ZeroPoint Technologies, leveraging OCP Community assets and illustrating how community solutions can be "Better Together" to address the challenges of hyperscale data centers. By integrating CXL-based memory expansion, real-time compression, and open-source software, this prototype exemplifies the OCP Hyperscale CXL Tiered Memory Expander specification.

Server / DC-MHS:

Server/MHS: DC-SCM LTPI Switch for Multi-Node Designs
Intel Corporation
Multi-HPM management with a single DC-SCM face design challenges such as how to fan out multiple interfaces from single DC-SCM to multiple HPMs. In this demo, we will show a solution that addresses LTPI interface fanout problem in a fully functional demo integrated on the DC-SCM 2 modules and with OpenBMC firmware.

DC-MHS System Display
Jabil
Our station will display a new 2U DC-MHS inspired chassis.  Multiple DC-HPMs, DC-SCMs, NICs, and E3.S FF modules will be available to be swapped in/out of the chassis.  Videos showing demo's and exploded views of other DC-MHS Chassis will be available for display on the monitor.

Single SCM and Dual HPM LTPI Solution
Lattice Semiconductor
The demo will show dual node LTPI solution. The LTPI is designed to support two separate HPMs with a single SCM. It also can support two independent LVDS Tunneling Protocols and Interfaces (LTPI) over a single Secure Control Module (SCM) CPLD Design. 

Future Technologies Symposium / Tech Demos:

Plasma-Based Cooling: DBD Actuators for Efficient Thermal Management
Yplasma
This station showcases an experimental demonstration of a Dielectric Barrier Discharge (DBD) plasma actuator as an alternative to conventional cooling fans. Attendees will see real-time comparisons of heat dissipation efficiency, airflow patterns, and power consumption. The setup includes visualization tools, simulation data, and insights into optimizing plasma actuators for electronic cooling.

Extreme Storage Media Reliability Test
Cerabyte, Inc.
Submerging Cerabyte media in boiling water and baking it in an oven, with full data recovery;  demonstrating the resilience, reliability and longevity of ceramic on glass media technology.

SiPho Based SM AOC Solution for PCIe Fabric
Silith Technology
demo silicon photonic based active optical cable for PCIe 6.0/CXL3.0 connectivity, linear drive and retimed options, with good performance. as a POC for SiPho based SM AOC

MODRAD - Modular Open RAN Radio Unit Development Platform
Massive Beams GmbH
Live demonstration of our Modular Open RAN Radio Unit Platform MODRAD with O-DU emulator and RF spectrum analyser to showcase the downlink performance, flexibility, transparency and modifiability of our platform.

CLICK HERE to see the Innovation Village hours at the OCP EMEA Summit.

Questions? Contact rob@opencompute.org.

Innovation Village Archives

• 2020 Global Summit
• 2020 Virtual Summit
• 2021 Global Summit
• 2022 Global Summit
• 2023 Global Summit
• 2024 EMEA Summit
• 2024 Global Summit
• 2025 EMEA Summit