By the Numbers: 2019 OCP Global Summit

The 2019 OCP Global Summit was a huge success! Thank you to our amazing team, Members, Sponsors, Partners and Community!

Here are some of the numbers:

  • We had 3,600 attendees this year, a 5% increase over last year.
  • The attendee breakdown by organizational role was as follows:
    • 30% Engineers
    • 19% Senior Executives
    • 17% Business Development Managers
    • 13% Product Managers
    • 11% Technology Architects
    • 7% Marketers
    • 3% Media and Analysts

  • There were team members from 727 organizations, from 42 countries around the world.
    • 84% of attendees were from the US, from 39 states, the most coming from California (72%), Washington (6%), Texas (4%) Oregon (3%) and Illinois (2%).
    • 16% of attendees were international representatives, including the following countries who had the largest representation:
      • Taiwan
      • China
      • Japan
      • France
      • Israel
      • South Korea
      • Canada
      • Germany
      • United Kingdom
      • Netherlands
      • Belgium
      • India
      • Spain

  • Our two-day event was packed full with exclusive content, including two mornings of high-level keynote presentations from industry titans. You can view these sessions here.
  • There were 13 Engineering Workshop tracks, comprised of 135 sessions – our most ever.
    • Topics included: Advanced Cooling, Data Center Facility, HPC & GPU/FPGA Technology, Hardware Management, Networking – Hardware & Software, NIC 3.0 Development, OSF/Security, Rack & Power, Server, Storage, SONiC, Telco & openEDge.
    • To view the ongoing work all of these groups are doing, check out the OCP Projects here.

  • THANK YOU to the 77 companies participating as sponsors and/or exhibitors. These organizations hosted 23 Executive Tracks and 25 expo hall talks.

  • OCP Future Technologies Symposium - This event invited students and researchers from around the world to submit posters as a new addition to OCP Global Summit. The inaugural Symposium was a great launch to this new pathway into long-term academia and innovation-focused industry ideas. We are so proud of the diversity and global reach of this Summit’s submissions including authors from:
  • MIT
  • UC Berkeley
  • Princeton Northwestern
  • Smith College
  • UC Santa Cruz
  • UC San Diego
  • UC Santa Barbara
  • University of New Hampshire
  • Vienna University of Technology
  • Qazvin IA University
  • University of Manitoba
  • Osaka University

Winning Poster: Congratulations to Tian Gu from MIT on his innovative concept of High-performance Polymer Optic and Photonic Devices for Chip-scale Optical Interconnects. For winning, he received an Oculus Rift.

All papers will be posted on the OCP website shortly.

 

  • OCP Experience Lab - As a new addition to the Summit, OCP had a dedicated space where Members, Solution Providers and Partners showcased a variety of solutions built on OCP hardware. These solutions included both static and live demonstrations. The solutions showcased included: OSF, NVMe Value Prop, NIC 3.0, Edge cloud capability, and ESA Chassis with participants from: Facebook, Intel, Google, Mellanox, QCT, Broadcom, TE Connectivity, Nokia, OpenStack, and MiTAC. For more information about the Experience Lab, contact rajeev@opencompute.org
  • New projects announced at the Summit: Open Domain-Specific Architecture (ODSA) sub-project under the Server Project and Open Accelerator Infrastructure (OAI) sub-project under the Server Project.

  • Did you get your OCP stickers? Share your photos with us using #OCPStickers
  • There were nearly 100 media and analysts onsite at the event, including staff from some of the world’s leading news and analyst organizations including:
    • 451 Research
    • 650 Group
    • AO Asset Management
    • AWH Capital
    • Beijing E7Academy Co.
    • Bloomberg Intelligence
    • China Fiber Optics Online
    • Citigroup
    • Cleveland Research
    • Coughlin Associates, Inc.
    • CRAIG-HALLUM CAPITAL GROUP
    • Data Center Knowledge
    • Dell'Oro Group Inc
    • Design Exquisite/ NASA
    • East Peak Media
    • EE Times
    • Events for Gamers
    • Extension Media/Chip Design Magazine
    • Forward Insights
    • G2M Research
    • Gartner
    • Global Equities Research
    • Goldman Sachs
    • GreenM3
    • IDC
    • IEEE
    • IHS Markit Technology
    • Inflection Point Research, LLC
    • Infrastructure Masons
    • Insight 64
    • Intersect360 Research
    • Invest in Denmark
    • ITBM
    • JP Morgan
    • KeyBanc Capital Markets
    • Lord Abbett
    • Nikkei Business Publications, Inc.
    • Odeon Capital
    • OpenSupport
    • PowerRox
    • Real World Insights
    • Rosenblatt Securities
    • SDxCentral
    • Semiwiki.com
    • SiliconAngle
    • TechTarget
    • The Next Platform
    • TIRIAS Research
    • TRENDFOCUS
    • UBS
    • Vector Data
    • www.convergedigest.com

All the sessions were recorded and videos can be found here along with the speaker slides.

OCP also shared dates for the 2019 OCP Regional Summit, which will be held in Amsterdam 26-27 September, 2019. Sponsorship sales are open, and more information can be found here. Sponsor and exhibit spots are sold on a first-come, first-served basis so act quickly to reserve your spot!

Sponsorship sales are also underway for the 2020 OCP Global Summit, to be held March 4-5, 2020 in San Jose. Click here to view the contract. Full prospectus coming soon! For more information, contact sponsor@opencompute.org