The Open Compute Project (OCP) is bringing together APAC communities for a very special two-day, in-person Summit to explore the many challenges and opportunities facing data center infrastructure, today and tomorrow.
The OCP APAC Summit will showcase the latest innovations and technical advancements from around the world. The Summit will feature talks from experts who are researching and designing the next generation of hyperscale data center facilities and infrastructure, as well as an exhibit bringing together buyers and vendors.
Registration and the Call for Presentations for the 2025 OCP APAC Summit will open in March/April.
From Ideas to Impact
The theme for OCP APAC Summit, from Ideas to Impact, encapsulates the OCP Community’s transformative journey to drive openness, efficiency, sustainability, scalability and growth in the data center industry. The theme reflects OCP’s commitment to fostering innovation that transcends theoretical discussions and manifests into real-world complete solutions. As the pace of technological evolution accelerates and development cycles shorten, our industry is forced to rapidly respond to emerging trends and needs.
The increasing complexity and demand of high-performance computing (HPC) and artificial intelligence (AI) applications, has created a critical need for transformative innovations. We are at an inflection point in the data center industry driven by a large investment in high density computational infrastructure. From a technology perspective, we see the need to rethink data center IT equipment, facilities and silicon supply chains. Previous inflection points moving from closed proprietary stacks to open ecosystems that drove the cloud era are still an important force, and will play an important role in shaping the next wave of data center development. Important technology advancements are needed in (1) chiplet technology and associated advanced packaging, (2) subsystems such as cooling and power distribution, networking and storage, server architectures, and optical communication networks, and (3) systems management delivering large scale AI clusters.
Looking further down the road, technologies that are still maturing will need to be leveraged to sustain the longer-term growth of AI and HPC systems. The Future Technologies Symposium, co-located at the OCP APAC Summit, includes academics, researchers and startup companies that are bringing technology to market that will impact products in the next 2-5 years and beyond.
Looking specifically to the silicon supply chain, the next inflection point is open, with innovation driven by a collaborative community, just as we have seen with the computing platforms of the cloud computing era. Developing an open stand-alone chiplet silicon supply chain will require a rethink. Many design decisions made by chiplet designers will impact packaging, test and verification, and the software stack, which will all be done by separate organizations, unlike today, where most silicon design is done in-house using proprietary processes. To establish this supply chain, work is being carried out to create open standards to describe chiplets and their D2D interfaces, and EDA tool design kits are needed to automate the design and packaging work that must be done by each organization participating in the delivery of a completed System in Package (SiP). Recently, the OCP has dedicated a section of its Marketplace to providing a catalog of stand-alone chiplets that are available for purchase, tools, and services to help the SiP and chiplet designers, and educational material to help engineers get started and have success with chiplet-based projects. Today, more than 25 suppliers offer stand-alone chiplets and services in the OCP Marketplace, and this continues to grow rapidly.
APAC has great technological prowess and concentration. APAC hosts some of the world's leading tech hubs like Silicon Valley's Asian counterpart in Taipei, Bangalore, and Tokyo. These areas are not only centers for technological innovation but also where major tech companies establish their data centers to reduce latency for tech services, support cloud computing, and leverage local talent for R&D. APAC, especially India, Taiwan, South Korea, and Japan, are leading in the manufacturing of semiconductors, servers, networking equipment, and other critical components for data centers. Companies like TSMC, Samsung, and SK Hynix are pivotal in providing the necessary hardware that powers data centers worldwide.
In planning the OCP APAC Summit in Taiwan, the OCP recognizes that APAC is experiencing an above average pace of digital transformation and economic growth than other regions. Thus, the OCP would like to bring together APAC communities for a very special two-day, in-person Summit to explore the many challenges and opportunities facing data center infrastructure today, and tomorrow. The OCP APAC Summit is intended to showcase the latest innovations and technical advancements from around the world. The Summit is expected to feature talks from experts around the world researching and designing the next generation of hyperscale data center facilities and infrastructure as well as an exhibit bringing together buyers and vendors.
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