The Nomination Period for the position of interim Co-Lead for the Rack & Power Project has ended. Below are the nominees. The winner of this election will serve as the Co-Lead of the Rack & Power Project alongside Caleb Lusk (Rittal) until the regularly scheduled 2020 election.
The voting period will run from September 4th to September 18th. Please click here to cast a vote in this election.*
For more information about a candidate, please click on their name below.
For more information on the OCP election process, click here.
Hamid has been leading various rack and power projects for the data center industry for several years with his previous employer, Google, and now with Facebook. He holds a Ph.D. degree in Power Engineering from Texas A&M University and currently he’s doing an MBA. He has been an active member of Rack & Power project group and was the main author of OCP Open Rack V2 Standard, power system, published in 2017. He’s currently leading power system development of Open Rack V3 Standard in collaboration with several hyperscale and supplier companies. Given the other project co-lead has mechanical engineering expertise, Hamid 20 years of background on Power can diversify and benefit the Rack & Power project.
Paul Artman is a Hardware Architect in the Lenovo Data Center Group with a background in Thermal and Power Design. He was a founding member or ASHRAE TC 9.9 and a primary contributor to the ASHRAE ITE Thermal Controls White Paper. Paul was also the Chair of Industry Standard Fan Spec for Performance Parameters for Air Moving Devices (IPC-9591). Paul has been involved in OCP for several years with early thermal and mechanical design input into the OCP Mezz 3.0 Specification. Paul presently participates the OCP Advanced Cooling Solutions and OCP Accelerator Infrastructure subgroups.
Paul represents the Lenovo Data Center Group Architecture Review Board for Power, Thermal, and Mechanical. Prior to his current position at Lenovo, Paul was the architect for the SD530 and the Lenovo high volume Intel Grantley programs. Previous to working at Lenovo he managed the Dell Enterprise Thermal and Acoustic Team. Paul brings 20 years of experience in thermal, power, and hardware packaging with the three major server ODMs (HPE, Dell, and Lenovo) and is presently leading Exascale and AI platform designs for Lenovo. Paul Artman is based in Morrisville, NC.
Rick Payne leads the global mechanical engineering team at flex with a primary focus on all things related to communications and storage (data center, edge, telecom, wireless). Working directly with customers, Rick and his team collaborate on innovative solutions that lead to new products that are optimized for “X” [manufacturing, cost, schedule, scale, function]. Flex's sketch to scale and global presence as it relates to designing and manufacturing Rack & Power solutions have enabled Rick to leverage these unique capabilities to provide comprehensive solutions to challenging problems as they relate to these growing markets.
Rick has been directly involved in rack and system level development since 1995 when joining Alcatel and later when he joined Fujitsu Networks. Since joining flex, Rick took on various roles including the responsibility of developing and managing a platform of racks and enclosure for various markets. Responsibilities at flex include leading design centers, focus led value engineering efforts, spearheading new technologies for flex, such as liquid cooling and driving mechanical efficiencies from conceptual development through product end-of-life.
*Please note that only votes cast from an email address belonging to an OCP Member organization will be counted.