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==Welcome==
==Welcome==


Welcome to the OCP Mezzanine NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in Mezzanine NIC space, under OCP framework.
Welcome to the OCP NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in OCP NIC space, under OCP framework.


===Guideline===
===Guideline===
Line 26: Line 26:


==Get Involved==
==Get Involved==
===0v70 Release Candidate Package ===
{| class="wikitable"
|-
! Specification Package
! Version
! Date
! Contributor
! Notes
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=03b815ef7595fca0e20b5c27b07f992b OCP_NIC_3.0_draft_0v70_20180125c_TN_no_CB]
| 0v70
| 1/25/2018
| OCP NIC subgroup
| Specification without comment bar for Server WG and IC review
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=ed2b9296d00618efbe4c8216a6bb1b77 OCP_NIC_3.0_3D_CAD_0v70_20180122]
| 0v70
| 1/22/2018
| OCP NIC subgroup
| Mechanical 3D CAD models
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=04ab98afb725e17401c17c0f72d9044b OCP_NIC_3.0_2D_Drawings_0v70_20180124]
| 0v70
| 1/24/2018
| OCP NIC Subgroup
| Mechanical 2D Drawings
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=3c2813cb2539c0dd9b279de5327ec220 OCP_NIC_3.0_thermal_models_0v70_20180124]
| 0v70
| 1/24/2018
| OCP NIC Subgroup
| Thermal CFD model(PACK) with Mechanical model(STEP) extracted
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=ea4bfe9d5e2399e8f4135e6c48cafe38 OCP_NIC_3.0_thermal_TestFixture_0v70_20180124]
| 0v70
| 1/24/2018
| OCP NIC Subgroup
| Thermal test fixture mechanical model(STEP) for small form factor add-in-card
|}
===Updated Supporting Doc===
{| class="wikitable"
|-
! Doc
! Version
! Date
! Contributor
! Notes
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=291993a49844b30e94cbe637a2e081c8 OCP_NIC_3.0_draft_0v72_20180221a_TN]
| 0v72
| 2/21/2018
| Intel
| 0v72
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=96d0f772b1677ceb327590c62b6f2a14 OCP 3.0 Pinout 0v72_20180222a_TN]
| 0v72
| 2/22/2018
| Intel
| Pinout table
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=fb6459537cb2cf7a77a02b0b86247bec OCP_NIC_3.0_discussion_r12_20180123]
| v12
| 1/23/2018
| OCP NIC Subgroup
| Presentation to Server WG/IC
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=6b94014ed393a1229c0d3c296c0fc3a0 Mezz3.0 schedule v7_20180123]
| v7
| 1/23/2018
| Facebook
| OCP NIC 3.0 spec project schedule
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=e4c9401b56215bd33ea4f37336710c48 OCP NIC 3.0_Mechanical Discussion_v5_20171201_d]
| v5
| 12/01/2017
| Facebook
| Mechanical Deck
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=420aabdf9be26d4d3c90cb199a4cd369 Thermal Deck_v7_20171115]
| v7
| 11/15/2017
| Facebook
| Thermal deck
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=6e30e729b094d6c5f3a2eb49c7611901 Updated thermal Simulation Results_v7_20171103]
| v7
| 11/3/2017
| Facebook
| Thermal simulation result update
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=260bfb5257a2466f6bd4490ff31f3358 OCP_Mezz_thermal_model_v3_20171103]
| v3
| 11/3/2017
| Facebook
| Thermal simulation model package
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=bf394a4b8394ece800712a690a06bf57 HPE_Comments_on_OCP_Mezz_v3_20170816]
| N/A
| 8/16/2017
| HPE
| Presentation from HPE on 8/16/2017 call
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=7d48739a75eb23c5ad5805f5451233df Dell EMC - OCP NIC Presntation v1_20170906]
| v1
| 9/6/2017
| Dell-EMC
| Presentation from Dell-EMC on 9/6/2017 call
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=ad9c60f6e25a5d2eaa38cc72f8b22069 Lenovo OCP Mezz3.0 Recommendations - 20170901]
| N/A
| 9/1/2017
| Lenovo
| A mechanical focused presentation from Lenovo on 9/6/2017 call
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=a4f6fee57057e7e888f0f39b5661c8cf 9/25/2017 Workshop decks]
| N/A
| 9/25/2017
| Microsoft / TE / Amphenol / Broadcom / Intel / Facebook
| 9/25/2017 workshop slides from multiple contributors 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=79d8d76c1942bc15d65776392c5fd411 9/25/2017 Workshop recording (large file 908MB)]
| N/A
| 9/25/2017
| Microsoft / TE / Amphenol / Broadcom / Intel / Facebook
| 9/25/2017 workshop recording from multiple contributors 
|}


===Updates===
===Updates===


'''3/14/2017'''


1. [https://www.youtube.com/watch?v=M9vg974Ww_4 Video of 3/17/2017 OCP Server workshop talk - Mezz 2.0 and beyond]
'''1/19/2018 update'''
 
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=663f885d9dbbf9bcee8bab0e6adbe77f OCP_NIC_3.0_draft_0v63_20180119e_TN]
 
 
 
'''1/18/2018 update'''
 
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=7cd6c3ed5710b9c36e77eb164fe44718 OCP_NIC_3.0_draft_0v62_20180118f_TN]
 
 
 
'''1/16/2018 update'''
 
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=2ab0d4e234abf29f37e6298c72d1c236 OCP_NIC_3.0_draft_0v60_20180116e_TN]
 
 
 
'''1/15/2018 update'''
 
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=f1a9f7e9027c24418f0d10a830e882ae OCP_NIC_3.0_draft_0v57_20180109c_TN]
 
 
'''1/2/2018 update'''
 
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=fad43541dfd5abb8265663ec93164e99 OCP_NIC_3.0_draft_0v50_20171222i_TN]
 
2. Move updates before 12/1/2017 to [http://www.opencompute.org/wiki/Server/Mezz/Update_Archive archive]
 
 
'''12/20/2017 update'''
 
1. Updated spec draft, overview deck, and mechanical deck
 
 
'''12/5/2017 update'''
 
1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN
 
2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN
 
3. Specification draft complete rate (Estimation)
 
{| class="wikitable"
|-
! Chapter
! Draft complete rate
! Status
 
|-
|1. Overview
| 70% drafted
| finishing up / under review
 
|-
|2. Card form factor
| 60+% drafted
| finishing up / under review
 
|-
|3. Card Edge and baseboard interface
| 80+ % drafted
| Under review
 
|-
|4. Management
|0% drafted
|Need to work on
 
|-
|5. Data Network requirement
|TBD
|Same content as Mezz 2.0; check for need to keep this chapter
 
|-
|6. Card routing guideline and SI consideration
|TBD
|NC-SI specified on card; PCIe TBD
 
|-
|7. Thermal and Environmental
|TBD
|Need edit based on Mezz 2.0
 
|}
 
4. Key mechanical updates:
 
- Agreed on guiding feature and card sizes
 
- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)
 
To be closed:
 
- Front bracket / latching mechanism design for small and large form factors
 
- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis
 
- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study
 
 
5. Coming working sessions and proposal of agenda:
 
-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work
 
-#8 12/13: 3-4hr: All draft work due for 1st pass of edit of all chapters. 1st cross review with changes suggested and agreed
 
-#9 12/20: 3-4hr: Review changes and post 1st draft
 


2. [http://files.opencompute.org/oc/public.php?service=files&t=6f58019848967b203deefef128c0aa04 Slide deck of 3/9/2017 workshop ]


3. [http://files.opencompute.org/oc/public.php?service=files&t=98ba555198e7083741fefbbf6794c12d Visco file for placement study]




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[http://lists.opencompute.org/pipermail/opencompute-mezz-card/ '''Find archive of mailing-list here''']
[http://lists.opencompute.org/pipermail/opencompute-mezz-card/ '''Find archive of mailing-list here''']
----
----
===Meetings===
This project meets - 2 times a Month; Defaults to 1st and 3rd Wednesday of the Month.
Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)
This call is open to the public.
If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.
Meeting minutes is sent out in mailing list and can be found at [http://lists.opencompute.org/pipermail/opencompute-mezz-card/ archive]


===Events===
===Events===
Line 49: Line 320:


OCP Engineering Workshop Sessions https://ocpussummit2017.sched.com/event/9SAa/ocp-mezzanine-nic-20-and-beyond
OCP Engineering Workshop Sessions https://ocpussummit2017.sched.com/event/9SAa/ocp-mezzanine-nic-20-and-beyond


More information about OCP events  can be found at: http://www.opencompute.org/community/events/ocp-events-calendar
More information about OCP events  can be found at: http://www.opencompute.org/community/events/ocp-events-calendar
===Meetings===
This project meets - 2 times a Month
Source of truth@ http://opencompute.org/community/ocp-calendars (Time zone shown: Eastern Time)
This call is open to the public.
Meeting minutes is sent out in mailing list and can be found at [http://lists.opencompute.org/pipermail/opencompute-mezz-card/ archive]




===Communication===
===Communication===


- Project communication is done through the opencompute-mezz-card mailing list.
- Project communication is done through the [http://lists.opencompute.org/mailman/listinfo/opencompute-mezz-card opencompute-mezz-card mailing list].
 
- To get on the mailing list or manage your subscription go to: http://lists.opencompute.org/mailman/listinfo/opencompute-mezz-card


- Please make sure following the steps until you receive confirmation email and welcome email from Opencompute-mezz-card@lists.opencompute.org.  
- Please make sure following the steps until you receive confirmation email and welcome email from Opencompute-mezz-card@lists.opencompute.org.  
Line 73: Line 333:


- To access the mailing list archives go to: http://lists.opencompute.org/pipermail/opencompute-mezz-card/
- To access the mailing list archives go to: http://lists.opencompute.org/pipermail/opencompute-mezz-card/
- For general discussion, please use mailing-list above by default; This is public domain and all discussion is archived
- Reach to [mailto:jia.ning@ocproject.net Jia Ning] if there is strong reason not to have public discussion


==Specifications and Designs==
==Specifications and Designs==

Revision as of 01:48, 10 March 2018

Welcome

Welcome to the OCP NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in OCP NIC space, under OCP framework.

Guideline

We are here to build a supportive, informative and inclusive community:


Supportive

- Support implementation questions

- Evaluate new use cases

Informative

- Share the latest topics and trends related to OCP Mezz NIC spec

- Share both challenges and opportunities

Inclusive

- Take community feedback and make iterations to proposal before submitting major revision to work group and IC

- Open to both adopters, and observers

Get Involved

0v70 Release Candidate Package

Specification Package Version Date Contributor Notes
OCP_NIC_3.0_draft_0v70_20180125c_TN_no_CB 0v70 1/25/2018 OCP NIC subgroup Specification without comment bar for Server WG and IC review
OCP_NIC_3.0_3D_CAD_0v70_20180122 0v70 1/22/2018 OCP NIC subgroup Mechanical 3D CAD models
OCP_NIC_3.0_2D_Drawings_0v70_20180124 0v70 1/24/2018 OCP NIC Subgroup Mechanical 2D Drawings
OCP_NIC_3.0_thermal_models_0v70_20180124 0v70 1/24/2018 OCP NIC Subgroup Thermal CFD model(PACK) with Mechanical model(STEP) extracted
OCP_NIC_3.0_thermal_TestFixture_0v70_20180124 0v70 1/24/2018 OCP NIC Subgroup Thermal test fixture mechanical model(STEP) for small form factor add-in-card

Updated Supporting Doc

Doc Version Date Contributor Notes


OCP_NIC_3.0_draft_0v72_20180221a_TN 0v72 2/21/2018 Intel 0v72


OCP 3.0 Pinout 0v72_20180222a_TN 0v72 2/22/2018 Intel Pinout table


OCP_NIC_3.0_discussion_r12_20180123 v12 1/23/2018 OCP NIC Subgroup Presentation to Server WG/IC
Mezz3.0 schedule v7_20180123 v7 1/23/2018 Facebook OCP NIC 3.0 spec project schedule
OCP NIC 3.0_Mechanical Discussion_v5_20171201_d v5 12/01/2017 Facebook Mechanical Deck


Thermal Deck_v7_20171115 v7 11/15/2017 Facebook Thermal deck
Updated thermal Simulation Results_v7_20171103 v7 11/3/2017 Facebook Thermal simulation result update
OCP_Mezz_thermal_model_v3_20171103 v3 11/3/2017 Facebook Thermal simulation model package
HPE_Comments_on_OCP_Mezz_v3_20170816 N/A 8/16/2017 HPE Presentation from HPE on 8/16/2017 call
Dell EMC - OCP NIC Presntation v1_20170906 v1 9/6/2017 Dell-EMC Presentation from Dell-EMC on 9/6/2017 call
Lenovo OCP Mezz3.0 Recommendations - 20170901 N/A 9/1/2017 Lenovo A mechanical focused presentation from Lenovo on 9/6/2017 call
9/25/2017 Workshop decks N/A 9/25/2017 Microsoft / TE / Amphenol / Broadcom / Intel / Facebook 9/25/2017 workshop slides from multiple contributors
9/25/2017 Workshop recording (large file 908MB) N/A 9/25/2017 Microsoft / TE / Amphenol / Broadcom / Intel / Facebook 9/25/2017 workshop recording from multiple contributors

Updates

1/19/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v63_20180119e_TN


1/18/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v62_20180118f_TN


1/16/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v60_20180116e_TN


1/15/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v57_20180109c_TN


1/2/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v50_20171222i_TN

2. Move updates before 12/1/2017 to archive


12/20/2017 update

1. Updated spec draft, overview deck, and mechanical deck


12/5/2017 update

1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN

2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN

3. Specification draft complete rate (Estimation)

Chapter Draft complete rate Status
1. Overview 70% drafted finishing up / under review
2. Card form factor 60+% drafted finishing up / under review
3. Card Edge and baseboard interface 80+ % drafted Under review
4. Management 0% drafted Need to work on
5. Data Network requirement TBD Same content as Mezz 2.0; check for need to keep this chapter
6. Card routing guideline and SI consideration TBD NC-SI specified on card; PCIe TBD
7. Thermal and Environmental TBD Need edit based on Mezz 2.0

4. Key mechanical updates:

- Agreed on guiding feature and card sizes

- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)

To be closed:

- Front bracket / latching mechanism design for small and large form factors

- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis

- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study


5. Coming working sessions and proposal of agenda:

-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work

-#8 12/13: 3-4hr: All draft work due for 1st pass of edit of all chapters. 1st cross review with changes suggested and agreed

-#9 12/20: 3-4hr: Review changes and post 1st draft




Find Archive of updates here

Find archive of mailing-list here


Meetings

This project meets - 2 times a Month; Defaults to 1st and 3rd Wednesday of the Month.

Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)

This call is open to the public.

If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.

Meeting minutes is sent out in mailing list and can be found at archive

Events

2017/3/9

OCP Engineering Workshop Sessions https://ocpussummit2017.sched.com/event/9SAa/ocp-mezzanine-nic-20-and-beyond

More information about OCP events can be found at: http://www.opencompute.org/community/events/ocp-events-calendar


Communication

- Project communication is done through the opencompute-mezz-card mailing list.

- Please make sure following the steps until you receive confirmation email and welcome email from Opencompute-mezz-card@lists.opencompute.org.

Please check your junk box and unblock Opencompute-mezz-card@lists.opencompute.org if you have trouble getting confirmation email.

- To access the mailing list archives go to: http://lists.opencompute.org/pipermail/opencompute-mezz-card/

- For general discussion, please use mailing-list above by default; This is public domain and all discussion is archived

- Reach to Jia Ning if there is strong reason not to have public discussion

Specifications and Designs

All these accepted by the IC

Specification Version Submit Date Contributor License Notes
OCP Mezzanine card v2.0

OCP_Mezz_2.0_rev1.00_20151215b_pub_release.pdf(2.2MB)

OCP_Mezz_2.0_rev1.00_20151215b_pub_release_3D_package.zip (88MB)

Mechanical 20151023_P1-P9_K1-K5 zip file (57MB)

V2.0-1.0 Dec 15, 2015 Facebook OWFa 1.0 Added support for x16 (quad x4), NCSI, dual QSFP+, & Quad SDP+

Accepted by OCP IC 2/24/2016

OCP Mezzanine card v0.5, original standard

Mezzanine Card (rev 0.5)

V0.5 Oct 8, 2012 Facebook OWFa 1.0 Defacto standard for the original network mezzanine with a x8 PCIe Gen3 interface