Difference between revisions of "Server/Mezz"

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==Get Involved==
 
==Get Involved==
  
 +
===0v70 Release Candidate Package ===
  
===Updated doc===
+
{| class="wikitable"
 +
|-
 +
! Specification Package
 +
! Version
 +
! Date
 +
! Contributor
 +
! Notes
 +
 
 +
|-
 +
| [http://files.opencompute.org/oc/public.php?service=files&t=03b815ef7595fca0e20b5c27b07f992b OCP_NIC_3.0_draft_0v70_20180125c_TN_no_CB]
 +
| 0v70
 +
| 1/25/2018
 +
| OCP NIC subgroup
 +
| Specification without comment bar for Server WG and IC review
 +
 
 +
|-
 +
| [http://files.opencompute.org/oc/public.php?service=files&t=ed2b9296d00618efbe4c8216a6bb1b77 OCP_NIC_3.0_3D_CAD_0v70_20180122]
 +
| 0v70
 +
| 1/22/2018
 +
| OCP NIC subgroup
 +
| Mechanical 3D CAD models
 +
 
 +
|-
 +
| [http://files.opencompute.org/oc/public.php?service=files&t=04ab98afb725e17401c17c0f72d9044b OCP_NIC_3.0_2D_Drawings_0v70_20180124]
 +
| 0v70
 +
| 1/24/2018
 +
| OCP NIC Subgroup
 +
| Mechanical 2D Drawings
 +
 
 +
|-
 +
| [http://files.opencompute.org/oc/public.php?service=files&t=3c2813cb2539c0dd9b279de5327ec220 OCP_NIC_3.0_thermal_models_0v70_20180124]
 +
| 0v70
 +
| 1/24/2018
 +
| OCP NIC Subgroup
 +
| Thermal CFD model(PACK) with Mechanical model(STEP) extracted
 +
 
 +
|-
 +
| [http://files.opencompute.org/oc/public.php?service=files&t=ea4bfe9d5e2399e8f4135e6c48cafe38 OCP_NIC_3.0_thermal_TestFixture_0v70_20180124]
 +
| 0v70
 +
| 1/24/2018
 +
| OCP NIC Subgroup
 +
| Thermal test fixture mechanical model(STEP) for small form factor add-in-card
 +
 
 +
|}
 +
 
 +
===Updated Supporting Doc===
  
 
{| class="wikitable"
 
{| class="wikitable"
Line 38: Line 84:
 
! Notes
 
! Notes
  
|-
 
| [http://files.opencompute.org/oc/public.php?service=files&t=3d9c65f7f6916824c90b0f52d62a16bf OCP_NIC_3.0_draft_0v01_20171205c_TN]
 
| 0v01
 
| 12/5/2017
 
| OCP NIC subgroup
 
| Draft - Spec Working in progress
 
  
 
|-  
 
|-  
| [http://files.opencompute.org/oc/public.php?service=files&t=8e5edde8eb3f4641d6bd69d2b433d4cc OCP 3.0 OCP 3.0 Pinout Proposal 20171205a_TN]
+
| [http://files.opencompute.org/oc/public.php?service=files&t=0eda861b0aca7a4942e2ff9aeec10555 OCP 3.0 Pinout 0v70_20180125a_TN]
| 20171205a_TN
+
| 0v70
| 12/05/2017
+
| 1/25/2018
 
| Intel
 
| Intel
| Pinout Proposal
+
| Pinout table
  
 
|-  
 
|-  
| [http://files.opencompute.org/oc/public.php?service=files&t=a1c12b8a366ceae9e18c5e1ccacf1919 OCP_NIC_3.0_discussion_r10_20170920]
+
| [http://files.opencompute.org/oc/public.php?service=files&t=fb6459537cb2cf7a77a02b0b86247bec OCP_NIC_3.0_discussion_r12_20180123]
| v10
+
| v12
| 9/20/2017
+
| 1/23/2018
| Facebook
+
| OCP NIC Subgroup
| General deck;updated before 9/20 call
+
| Presentation to Server WG/IC
  
 
|-  
 
|-  
| [http://files.opencompute.org/oc/public.php?service=files&t=3eda61b680e21060f5eb8b4bac4bd28f Mezz3.0 schedule v4_20170816]
+
| [http://files.opencompute.org/oc/public.php?service=files&t=6b94014ed393a1229c0d3c296c0fc3a0 Mezz3.0 schedule v7_20180123]
| v4
+
| v7
| 8/16/2017
+
| 1/23/2018
 
| Facebook
 
| Facebook
| OCP NIC 3.0 spec project schedule; commented on 9/6/2017
+
| OCP NIC 3.0 spec project schedule
  
 
|-  
 
|-  
| [http://files.opencompute.org/oc/public.php?service=files&t=cd7e005617a9a2bad2dd354a018a88f9 OCP NIC 3.0_Mechanical Discussion_v04_20171027]
+
| [http://files.opencompute.org/oc/public.php?service=files&t=e4c9401b56215bd33ea4f37336710c48 OCP NIC 3.0_Mechanical Discussion_v5_20171201_d]
| v4
+
| v5
| 10/27/2017
+
| 12/01/2017
 
| Facebook
 
| Facebook
 
| Mechanical Deck
 
| Mechanical Deck
  
|-
 
| [http://files.opencompute.org/oc/public.php?service=files&t=ebd99e48282324f42e945fe1171e3c50 OCP_NIC_3_3D_CAD_r2_20170920]
 
| v2
 
| 9/20/2017
 
| Facebook
 
| Mechanical 3D package
 
  
 
|-  
 
|-  
Line 140: Line 174:
 
===Updates===
 
===Updates===
  
'''12/5 update'''
 
  
1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN
+
'''1/19/2018 update'''
  
 +
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=663f885d9dbbf9bcee8bab0e6adbe77f OCP_NIC_3.0_draft_0v63_20180119e_TN]
  
  
'''11/20 update'''
 
  
1. Updated specification(11/12) and pin definition(11/15) to the "updated doc session"; The spec still needs a lot of work in the coming a few weeks.
+
'''1/18/2018 update'''
  
2. Thermal deck v7 is uploaded (same material as presented on 11/15)
+
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=7cd6c3ed5710b9c36e77eb164fe44718 OCP_NIC_3.0_draft_0v62_20180118f_TN]
  
  
'''10/31 update'''
 
  
1. We did 4x working session so far and made good progress in pinout and mechanical profile
+
'''1/16/2018 update'''
  
- 10/11 11:30am-3pm(PDT) - Done: TE/Dell-EMC/Intel/FB
+
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=2ab0d4e234abf29f37e6298c72d1c236 OCP_NIC_3.0_draft_0v60_20180116e_TN]
  
- 10/18 9am-2pm(PDT) - Done: TE/Dell-EMC/Lenovo/Broadcom/Intel/FB
 
  
- 10/27 8am - 11am(PDT)  Done: – TE/Dell-EMC/Lenovo/Broadcom/Intel/FB
 
  
- 10/31 8:30am - 10am(PDT) Done: - (Pinout specific session) Mellanox / Broadcom / Intel / Dell-EMC / FB
+
'''1/15/2018 update'''
  
- 11/3 8am-11am(PDT)
+
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=f1a9f7e9027c24418f0d10a830e882ae OCP_NIC_3.0_draft_0v57_20180109c_TN]
  
- 11/15 9am-5pm(PST)
 
  
2. Latest pin out and ME deck are posted at [http://www.opencompute.org/wiki/Server/Mezz#Updated_doc Table above]
+
'''1/2/2018 update'''
  
3. Plan to post WIP specification draft after 11/3 workshop for broader review
+
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=fad43541dfd5abb8265663ec93164e99 OCP_NIC_3.0_draft_0v50_20171222i_TN]
  
4. We will cancel the 2017/11/01 meeting as FB team has a conflict
+
2. Move updates before 12/1/2017 to [http://www.opencompute.org/wiki/Server/Mezz/Update_Archive archive]
  
  
 +
'''12/20/2017 update'''
  
'''10/18 Update'''
+
1. Updated spec draft, overview deck, and mechanical deck
  
- Intel/Dell-EMC/TE/FB joined the spec drafting working session on 10/11 and worked on these topics: [http://files.opencompute.org/oc/public.php?service=files&t=089dc36e019eadfcbdc590837e7e0dc6 framework], sections, pinout, connector, specification drafting logistics.
 
  
- With many inputs from community, FB updated Mechanical deck to v3; Key changes are 1) fine tuning module width by 2mm 2) proposing 1 extra sizes, and total 3x sizes with different width. Detail see [http://files.opencompute.org/oc/public.php?service=files&t=520161aaf734e0b8690a9003b73bd57c Mechanical Discussion_v03_20171018]
+
'''12/5/2017 update'''
  
- Pinout is being actively working on. Intel is taking lead on proposing and maintaining the draft; an updated version can be found [http://files.opencompute.org/oc/public.php?service=files&t=aa9736b73845229c4dcd6cf47c74296e [here]]
+
1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN
  
- We will move from Fuze to GoToWebinar for project calls in Nov. 10/18 call is likely the last call on Fuze. More details to follow in mailing list and calendar.  
+
2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN
  
 +
3. Specification draft complete rate (Estimation)
  
'''9/20 Update'''
+
{| class="wikitable"
 +
|-
 +
! Chapter
 +
! Draft complete rate
 +
! Status
  
- The subgroup closed on all other major options after a few months of iterations. #14 is the clear preference in subgroup. Details and specification will be worked out around this option.
+
|-
 +
|1. Overview
 +
| 70% drafted
 +
| finishing up / under review
  
- Update main deck: [http://files.opencompute.org/oc/public.php?service=files&t=a1c12b8a366ceae9e18c5e1ccacf1919 OCP_NIC_3.0_discussion_r10_20170920]
+
|-
 +
|2. Card form factor
 +
| 60+% drafted
 +
| finishing up / under review
  
- Update [http://files.opencompute.org/oc/public.php?service=files&t=ebd99e48282324f42e945fe1171e3c50 mechanical 3D package] to r02
+
|-
 +
|3. Card Edge and baseboard interface
 +
| 80+ % drafted
 +
| Under review
  
- Update [http://files.opencompute.org/oc/public.php?service=files&t=b9049cac01890df4354859ff2c028fa5 mechanical deck] to r02
+
|-
 +
|4. Management
 +
|0% drafted
 +
|Need to work on
  
 +
|-
 +
|5. Data Network requirement
 +
|TBD
 +
|Same content as Mezz 2.0; check for need to keep this chapter
  
 +
|-
 +
|6. Card routing guideline and SI consideration
 +
|TBD
 +
|NC-SI specified on card; PCIe TBD
  
'''9/6 Update'''
+
|-
 +
|7. Thermal and Environmental
 +
|TBD
 +
|Need edit based on Mezz 2.0
  
- Add updated doc session for better tracking of latest docs and community presentations
+
|}
 
 
- Update general deck to v9, thermal deck to v6
 
 
 
- Intend to exit phase 2 by 9/20 with option #14
 
 
 
- Change project name from "OCP Mezz NIC 3.0" to "OCP NIC 3.0" as option #14 is not Mezz style
 
 
 
 
 
'''8/23 Update'''
 
 
 
[http://files.opencompute.org/oc/public.php?service=files&t=bf394a4b8394ece800712a690a06bf57 HPE's presentation on 8/16 call]
 
 
 
 
 
'''8/22 Update'''
 
 
 
Thermal results and files
 
 
 
- [http://files.opencompute.org/oc/public.php?service=files&t=76bd6a84a9ef716ea21a915c466277ac Option #13 with QSFP heat sink]
 
 
 
- [http://files.opencompute.org/oc/public.php?service=files&t=3e29fd09df03360c1d2457348a81f453 Option #14 with QSFP heat sink]
 
 
 
- [http://files.opencompute.org/oc/public.php?service=files&t=ebcdfbcd14d24422b8d860bb1f6686dd Slides - Update of thermal results]
 
 
 
- [http://files.opencompute.org/oc/public.php?service=files&t=a5e561283cbdcaaad60e1c5b0f7a19c7 Summary of updated simulation results]
 
 
 
 
 
'''8/16 Update'''
 
 
 
[http://files.opencompute.org/oc/public.php?service=files&t=1d34f1178a223488716abf5f26641871 Master Deck r08 dated 8/16/2017]
 
 
 
[http://files.opencompute.org/oc/public.php?service=files&t=7fe67b5788e081c70387d371e29218fe Mechanical update r01 dated 8/16/2017]
 
 
 
[http://files.opencompute.org/oc/public.php?service=files&t=209581638a7781772c8c6314ea384fd6 Mechanical - 3D of option 14 v1]
 
 
 
 
 
'''8/2 Update'''
 
 
 
'''1. Update to deck'''
 
 
 
[http://files.opencompute.org/oc/public.php?service=files&t=269e6bc3cee73239105c5dafb09f31a2 Master Deck r07 dated 8/1/2017]
 
 
 
'''2. 8/2/2017 Meeting Agenda'''
 
 
 
'''General update'''
 
 
 
- Form factor stability goal (2+5+2 goal)
 
 
 
- Update the investigation of #14
 
 
 
- Revisit 1x or 2x form factor (tradeoff between simplicity and flexibility)
 
 
 
- Heads up of stating pin list discussion
 
 
 
'''Possible project name change'''
 
 
 
- One of the major option(#14) being looked at is not technical a "Mezz"
 
 
 
- Possible name change of project if the group is clearly trending toward #14
 
 
 
'''Mechanical intro''' - by Joshua Held @Facebook
 
 
 
- Josh will talk about coming activities in mechanical design of Mezz NIC
 
 
 
'''9/25 Workshop @ Dallas, TX'''
 
 
 
- Call for presentation; topical can be technically, or sharing how your experience with OCP Mezz NIC
 
 
 
- Suggest to drop me an email if you intend to attend (optional)
 
- Free to register; instruction sent in mailing list
 
 
 
 
 
'''7/25/2017'''
 
 
 
1. Update to deck
 
 
 
[http://files.opencompute.org/oc/public.php?service=files&t=102b0d696eb386222ce4d7b2b857b6cf Master Deck V6 dated 7/25]
 
 
 
 
 
'''7/14/2017'''
 
 
 
1. Update to deck
 
 
 
[http://files.opencompute.org/oc/public.php?service=files&t=15acc7dc37ae8d47e24e70098352ef1b Master Deck V5 dated 7/14]
 
 
 
2. Update to Schedule
 
 
 
[http://files.opencompute.org/oc/public.php?service=files&t=1f877ea9b23cc8ca217e586d079835eb Schedule update v3 dated 7/14]
 
 
 
3. Mezz subgroup will meet @ OCP Engineering workshop Sep 25th, 2017
 
  
[http://www.dcdconverged.com/conferences/colo-cloud/benefits/ocp-engineering-workshop More info here]
+
4. Key mechanical updates:  
  
 +
- Agreed on guiding feature and card sizes
  
'''7/5/2017'''
+
- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)
  
See below material for tomorrow's call:
+
To be closed:
  
[http://files.opencompute.org/oc/public.php?service=files&t=80ad70edb0793750e9ffa844277f642d Corrected thermal model: Cases A1-A5]
+
- Front bracket / latching mechanism design for small and large form factors
  
[http://files.opencompute.org/oc/public.php?service=files&t=969afb027f5266965c7d67fd67f4c0d9 Corrected thermal model: Cases A6-A10]
+
- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis
  
[http://files.opencompute.org/oc/public.php?service=files&t=db9e67e52055bf286e60c76a77395de5 Thermal model with QSFP heat sink: Cases A1-A5]
+
- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study
  
[http://files.opencompute.org/oc/public.php?service=files&t=4124bdef6c52904969309103f6fcd3d4 Thermal model with QSFP heat sink: Cases A6-A10]
 
  
[http://files.opencompute.org/oc/public.php?service=files&t=142e75071a9a6c98f8887c6005bb064d Summary of updated simulation results]
+
5. Coming working sessions and proposal of agenda:
  
[http://files.opencompute.org/oc/public.php?service=files&t=7373b67f33c85773220f26801a199b7f Presentation slides]
+
-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work
  
--- '''Agenda'''
+
-#8 12/13: 3-4hr: All draft work due for 1st pass of edit of all chapters. 1st cross review with changes suggested and agreed
  
1. Updates and corrections to thermal models
+
-#9 12/20: 3-4hr: Review changes and post 1st draft
  
2. Impact of QSFP heat sink
 
  
3. Impact of contact resistance on QSFP heat sink performance
 
  
4. Go over a few topics for discussion
 
  
  

Revision as of 05:53, 26 January 2018

Welcome

Welcome to the OCP Mezzanine NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in Mezzanine NIC space, under OCP framework.

Guideline

We are here to build a supportive, informative and inclusive community:


Supportive

- Support implementation questions

- Evaluate new use cases

Informative

- Share the latest topics and trends related to OCP Mezz NIC spec

- Share both challenges and opportunities

Inclusive

- Take community feedback and make iterations to proposal before submitting major revision to work group and IC

- Open to both adopters, and observers

Get Involved

0v70 Release Candidate Package

Specification Package Version Date Contributor Notes
OCP_NIC_3.0_draft_0v70_20180125c_TN_no_CB 0v70 1/25/2018 OCP NIC subgroup Specification without comment bar for Server WG and IC review
OCP_NIC_3.0_3D_CAD_0v70_20180122 0v70 1/22/2018 OCP NIC subgroup Mechanical 3D CAD models
OCP_NIC_3.0_2D_Drawings_0v70_20180124 0v70 1/24/2018 OCP NIC Subgroup Mechanical 2D Drawings
OCP_NIC_3.0_thermal_models_0v70_20180124 0v70 1/24/2018 OCP NIC Subgroup Thermal CFD model(PACK) with Mechanical model(STEP) extracted
OCP_NIC_3.0_thermal_TestFixture_0v70_20180124 0v70 1/24/2018 OCP NIC Subgroup Thermal test fixture mechanical model(STEP) for small form factor add-in-card

Updated Supporting Doc

Doc Version Date Contributor Notes


OCP 3.0 Pinout 0v70_20180125a_TN 0v70 1/25/2018 Intel Pinout table
OCP_NIC_3.0_discussion_r12_20180123 v12 1/23/2018 OCP NIC Subgroup Presentation to Server WG/IC
Mezz3.0 schedule v7_20180123 v7 1/23/2018 Facebook OCP NIC 3.0 spec project schedule
OCP NIC 3.0_Mechanical Discussion_v5_20171201_d v5 12/01/2017 Facebook Mechanical Deck


Thermal Deck_v7_20171115 v7 11/15/2017 Facebook Thermal deck
Updated thermal Simulation Results_v7_20171103 v7 11/3/2017 Facebook Thermal simulation result update
OCP_Mezz_thermal_model_v3_20171103 v3 11/3/2017 Facebook Thermal simulation model package
HPE_Comments_on_OCP_Mezz_v3_20170816 N/A 8/16/2017 HPE Presentation from HPE on 8/16/2017 call
Dell EMC - OCP NIC Presntation v1_20170906 v1 9/6/2017 Dell-EMC Presentation from Dell-EMC on 9/6/2017 call
Lenovo OCP Mezz3.0 Recommendations - 20170901 N/A 9/1/2017 Lenovo A mechanical focused presentation from Lenovo on 9/6/2017 call
9/25/2017 Workshop decks N/A 9/25/2017 Microsoft / TE / Amphenol / Broadcom / Intel / Facebook 9/25/2017 workshop slides from multiple contributors
9/25/2017 Workshop recording (large file 908MB) N/A 9/25/2017 Microsoft / TE / Amphenol / Broadcom / Intel / Facebook 9/25/2017 workshop recording from multiple contributors

Updates

1/19/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v63_20180119e_TN


1/18/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v62_20180118f_TN


1/16/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v60_20180116e_TN


1/15/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v57_20180109c_TN


1/2/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v50_20171222i_TN

2. Move updates before 12/1/2017 to archive


12/20/2017 update

1. Updated spec draft, overview deck, and mechanical deck


12/5/2017 update

1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN

2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN

3. Specification draft complete rate (Estimation)

Chapter Draft complete rate Status
1. Overview 70% drafted finishing up / under review
2. Card form factor 60+% drafted finishing up / under review
3. Card Edge and baseboard interface 80+ % drafted Under review
4. Management 0% drafted Need to work on
5. Data Network requirement TBD Same content as Mezz 2.0; check for need to keep this chapter
6. Card routing guideline and SI consideration TBD NC-SI specified on card; PCIe TBD
7. Thermal and Environmental TBD Need edit based on Mezz 2.0

4. Key mechanical updates:

- Agreed on guiding feature and card sizes

- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)

To be closed:

- Front bracket / latching mechanism design for small and large form factors

- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis

- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study


5. Coming working sessions and proposal of agenda:

-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work

-#8 12/13: 3-4hr: All draft work due for 1st pass of edit of all chapters. 1st cross review with changes suggested and agreed

-#9 12/20: 3-4hr: Review changes and post 1st draft




Find Archive of updates here

Find archive of mailing-list here


Meetings

This project meets - 2 times a Month; Defaults to 1st and 3rd Wednesday of the Month.

Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)

This call is open to the public.

If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.

Meeting minutes is sent out in mailing list and can be found at archive

Events

2017/3/9

OCP Engineering Workshop Sessions https://ocpussummit2017.sched.com/event/9SAa/ocp-mezzanine-nic-20-and-beyond

More information about OCP events can be found at: http://www.opencompute.org/community/events/ocp-events-calendar


Communication

- Project communication is done through the opencompute-mezz-card mailing list.

- Please make sure following the steps until you receive confirmation email and welcome email from Opencompute-mezz-card@lists.opencompute.org.

Please check your junk box and unblock Opencompute-mezz-card@lists.opencompute.org if you have trouble getting confirmation email.

- To access the mailing list archives go to: http://lists.opencompute.org/pipermail/opencompute-mezz-card/

- For general discussion, please use mailing-list above by default; This is public domain and all discussion is archived

- Reach to Jia Ning if there is strong reason not to have public discussion

Specifications and Designs

All these accepted by the IC

Specification Version Submit Date Contributor License Notes
OCP Mezzanine card v2.0

OCP_Mezz_2.0_rev1.00_20151215b_pub_release.pdf(2.2MB)

OCP_Mezz_2.0_rev1.00_20151215b_pub_release_3D_package.zip (88MB)

Mechanical 20151023_P1-P9_K1-K5 zip file (57MB)

V2.0-1.0 Dec 15, 2015 Facebook OWFa 1.0 Added support for x16 (quad x4), NCSI, dual QSFP+, & Quad SDP+

Accepted by OCP IC 2/24/2016

OCP Mezzanine card v0.5, original standard

Mezzanine Card (rev 0.5)

V0.5 Oct 8, 2012 Facebook OWFa 1.0 Defacto standard for the original network mezzanine with a x8 PCIe Gen3 interface