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==Get Involved==
==Get Involved==


===0v70 Release Candidate Package (Work in Progress)===


===Updates===
{| class="wikitable"
'''7/14/2017'''
|-
! Doc
! Version
! Date
! Contributor
! Notes


1. Update to deck
|-
| [OCP_NIC_3.0_draft_0v70_20180122a]
| 0v70
| 1/23/2018
| OCP NIC subgroup
| Placeholder


[http://files.opencompute.org/oc/public.php?service=files&t=15acc7dc37ae8d47e24e70098352ef1b Master Deck V5 dated 7/14]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=ed2b9296d00618efbe4c8216a6bb1b77 OCP_NIC_3.0_3D_CAD_0v70_20180122]
| 0v70
| 1/22/2018
| OCP NIC subgroup
| Mechanical 3D models


2. Update to Schedule
|-
| [Placeholder for Mechanical 2D drawings]
| 0v70
| 1/23/2018
| OCP NIC Subgroup
| Placeholder


[http://files.opencompute.org/oc/public.php?service=files&t=1f877ea9b23cc8ca217e586d079835eb Schedule update v3 dated 7/14]
|-
| [Placeholder for CAD step files for the Hot/Cold Aisle CFD geometry]
| 0v70
| 1/23/2018
| OCP NIC Subgroup
| Placeholder


3. Mezz subgroup will meet @ OCP Engineering workshop Sep 25th, 2017
|-
| [Placeholder for CAD File of thermal test fixture for Small Form Factor OCP NIC 3.0]
| 0v70
| 1/23/2018
| OCP NIC Subgroup
| Placeholder


[http://www.dcdconverged.com/conferences/colo-cloud/benefits/ocp-engineering-workshop More info here]
|}


===Updated doc===


'''7/5/2017'''
{| class="wikitable"
|-
! Doc
! Version
! Date
! Contributor
! Notes


See below material for tomorrow's call:
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=663f885d9dbbf9bcee8bab0e6adbe77f OCP_NIC_3.0_draft_0v63_20180119e_TN]
| 0v63
| 1/19/2018
| OCP NIC subgroup
| Draft - public review and feedback is welcome - Vote on 1/24 Server Workgroup call
Send feedback=> [mailto:opencompute-mezz-card@lists.opencompute.org opencompute-mezz-card@lists.opencompute.org]


[http://files.opencompute.org/oc/public.php?service=files&t=80ad70edb0793750e9ffa844277f642d Corrected thermal model: Cases A1-A5]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=8e5edde8eb3f4641d6bd69d2b433d4cc OCP 3.0 OCP 3.0 Pinout Proposal 20171205a_TN]
| 20171205a_TN
| 12/05/2017
| Intel
| Pinout Proposal


[http://files.opencompute.org/oc/public.php?service=files&t=969afb027f5266965c7d67fd67f4c0d9 Corrected thermal model: Cases A6-A10]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=fb3986ee5b9dcd5435acf0de7663ff4a OCP_NIC_3.0_discussion_r11_20171219]
| v11
| 12/19/2017
| OCP NIC Subgroup
| General deck;updated before 12/20 call


[http://files.opencompute.org/oc/public.php?service=files&t=db9e67e52055bf286e60c76a77395de5 Thermal model with QSFP heat sink: Cases A1-A5]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=616397237e7147b401684e0de8b44bf2 Mezz3.0 schedule v6_20171219]
| v6
| 12/19/2017
| Facebook
| OCP NIC 3.0 spec project schedule


[http://files.opencompute.org/oc/public.php?service=files&t=4124bdef6c52904969309103f6fcd3d4 Thermal model with QSFP heat sink: Cases A6-A10]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=e4c9401b56215bd33ea4f37336710c48 OCP NIC 3.0_Mechanical Discussion_v5_20171201_d]
| v5
| 12/01/2017
| Facebook
| Mechanical Deck


[http://files.opencompute.org/oc/public.php?service=files&t=142e75071a9a6c98f8887c6005bb064d Summary of updated simulation results]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=ebd99e48282324f42e945fe1171e3c50 OCP_NIC_3_3D_CAD_r2_20170920]
| v2
| 9/20/2017
| Facebook
| Mechanical 3D package


[http://files.opencompute.org/oc/public.php?service=files&t=7373b67f33c85773220f26801a199b7f Presentation slides]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=420aabdf9be26d4d3c90cb199a4cd369 Thermal Deck_v7_20171115]
| v7
| 11/15/2017
| Facebook
| Thermal deck


--- '''Agenda'''
|-  
| [http://files.opencompute.org/oc/public.php?service=files&t=6e30e729b094d6c5f3a2eb49c7611901 Updated thermal Simulation Results_v7_20171103]
| v7
| 11/3/2017
| Facebook
| Thermal simulation result update


1. Updates and corrections to thermal models
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=260bfb5257a2466f6bd4490ff31f3358 OCP_Mezz_thermal_model_v3_20171103]
| v3
| 11/3/2017
| Facebook
| Thermal simulation model package


2. Impact of QSFP heat sink
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=bf394a4b8394ece800712a690a06bf57 HPE_Comments_on_OCP_Mezz_v3_20170816]
| N/A
| 8/16/2017
| HPE
| Presentation from HPE on 8/16/2017 call


3. Impact of contact resistance on QSFP heat sink performance
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=7d48739a75eb23c5ad5805f5451233df Dell EMC - OCP NIC Presntation v1_20170906]
| v1
| 9/6/2017
| Dell-EMC
| Presentation from Dell-EMC on 9/6/2017 call


4. Go over a few topics for discussion
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=ad9c60f6e25a5d2eaa38cc72f8b22069 Lenovo OCP Mezz3.0 Recommendations - 20170901]
| N/A
| 9/1/2017
| Lenovo
| A mechanical focused presentation from Lenovo on 9/6/2017 call


|-
| [http://files.opencompute.org/oc/public.php?service=files&t=a4f6fee57057e7e888f0f39b5661c8cf 9/25/2017 Workshop decks]
| N/A
| 9/25/2017
| Microsoft / TE / Amphenol / Broadcom / Intel / Facebook
| 9/25/2017 workshop slides from multiple contributors 


'''6/20/2017'''
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=79d8d76c1942bc15d65776392c5fd411 9/25/2017 Workshop recording (large file 908MB)]
| N/A
| 9/25/2017
| Microsoft / TE / Amphenol / Broadcom / Intel / Facebook
| 9/25/2017 workshop recording from multiple contributors 


See below for material for tomorrow's call:
|}


[http://files.opencompute.org/oc/public.php?service=files&t=c6cd05fb6c2046c878ac7c9ddb010e31 Summary of simulation results under stand-by power]
===Updates===
 
[http://files.opencompute.org/oc/public.php?service=files&t=76c7973c379d6849e7bc0d96eeb95a73 Presentation slides]
 
--- '''Agenda'''


1. Review latest round of simulation results


2. Go over a few topics for discussion
'''1/19/2018 update'''


1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=663f885d9dbbf9bcee8bab0e6adbe77f OCP_NIC_3.0_draft_0v63_20180119e_TN]


'''6/6/2017'''


See below for material for tomorrow's call:


[http://files.opencompute.org/oc/public.php?service=files&t=7d19f143ec3f3109117904caf4a198cc Updated thermal model: Cases A1-A5]
'''1/18/2018 update'''


[http://files.opencompute.org/oc/public.php?service=files&t=776e636799258da85c562f69e22e05ae Updated thermal model: Cases A6-A10]
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=7cd6c3ed5710b9c36e77eb164fe44718 OCP_NIC_3.0_draft_0v62_20180118f_TN]


[http://files.opencompute.org/oc/public.php?service=files&t=7018dd736da61bf1a44030d4a582ce26 Updated thermal model: Cases D1-D8]


[http://files.opencompute.org/oc/public.php?service=files&t=b86d25485cf6f4c191c9c2fec2806e73 Summary of simulation results using updated thermal models]


[http://files.opencompute.org/oc/public.php?service=files&t=0f43d212fb481bca0efd5befbed07af1 Presentation slides]
'''1/16/2018 update'''


--- '''Agenda'''
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=2ab0d4e234abf29f37e6298c72d1c236 OCP_NIC_3.0_draft_0v60_20180116e_TN]


1. Review changes to thermal models based on feedback from the community


2. Review latest round of simulation results


3. Go over a few topics for discussion
'''1/15/2018 update'''


1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=f1a9f7e9027c24418f0d10a830e882ae OCP_NIC_3.0_draft_0v57_20180109c_TN]


'''5/16/2017'''


Here are the update in the past 2x weeks, and material for tomorrow's call:
'''1/2/2018 update'''


[http://files.opencompute.org/oc/public.php?service=files&t=5fd1d10bed7d85c6876478a975b7c867 Updated thermal simulation case deck:Thermal Simulation Feedback_20170517]
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=fad43541dfd5abb8265663ec93164e99 OCP_NIC_3.0_draft_0v50_20171222i_TN]


[http://files.opencompute.org/oc/public.php?service=files&t=9e5450687380a5c97feab23a3c0ccaf3 Update thermal simulation case spreadsheet: Updated Thermal Simulation Cases_20170511]
2. Move updates before 12/1/2017 to [http://www.opencompute.org/wiki/Server/Mezz/Update_Archive archive]


Additional questions to NIC suppliers:


- Standby(S5) power of NIC, or ratio of P_Standby / P_Max
'''12/20/2017 update'''


- P_standby of Optical modules
1. Updated spec draft, overview deck, and mechanical deck




'''12/5/2017 update'''


'''4/28/2017'''
1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN


As we kicked off the discussion of Mezz thermal simulation on 4/19, here are the updates: 
2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN


[http://files.opencompute.org/oc/public.php?service=files&t=cd97fcf9d20789a0128cdb4380f26f69 OCP Mezz 3.0 Thermal Simulation Description]
3. Specification draft complete rate (Estimation)


[http://files.opencompute.org/oc/public.php?service=files&t=1a8ba4c5533db8696ea9fd1f5a9d8a8b OCP Mezz 3.0 Thermal Simulation Package]
{| class="wikitable"
|-
! Chapter
! Draft complete rate
! Status


Please give your feedback in mailing list and we will talk about it on next call on 5/3.
|-
|1. Overview
| 70% drafted
| finishing up / under review


'''4/17/2017'''
|-
|2. Card form factor
| 60+% drafted
| finishing up / under review


We have an updated schedule for comment and feedback:
|-
|3. Card Edge and baseboard interface
[http://files.opencompute.org/oc/public.php?service=files&t=85117a6af40281399d13b87745f2c1ae Schedule Update V2]
| 80+ % drafted
| Under review


Mezz 3.0 Survey is closed with 5 participants; Summary with company names masked can be found here:
|-
|4. Management
[http://files.opencompute.org/oc/public.php?service=files&t=2f76191e6e3f7af67373148de827db77 Mezz 3.0 Survey filled 201704016]
|0% drafted
|Need to work on


A few updates were made to the master deck:
|-
[http://files.opencompute.org/oc/public.php?service=files&t=a906c9f2492d3d74e1053a4a82ba8331 Mezz 3.0 General Update]
|5. Data Network requirement
|TBD
|Same content as Mezz 2.0; check for need to keep this chapter


Our next call is on 4/19/2017 Wednesday 9am PDT(2nd call of the month). As always, call-in info can be found [http://opencompute.org/community/ocp-calendars here].
|-
|6. Card routing guideline and SI consideration
|TBD
|NC-SI specified on card; PCIe TBD


--- '''Agenda'''
|-
|7. Thermal and Environmental
|TBD
|Need edit based on Mezz 2.0


1. Sync with community about schedule refresher and get feedback for schedule and milestone
|}


2. Summary of survey
4. Key mechanical updates:


3. John Fernandes will share methodology for thermal simulation
- Agreed on guiding feature and card sizes


4. Call for more feedback on a few options (9,10,11,12)
- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)


To be closed:


- Front bracket / latching mechanism design for small and large form factors


- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis


- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study


'''3/29/2017'''


1. Ramp NIC survey template version to v03 to have more exact wording.  [http://files.opencompute.org/oc/public.php?service=files&t=888e8eb91172c13653c0bf733ca3b27f Template v03]
5. Coming working sessions and proposal of agenda:


2. Due to the limitation of mailing-list with attachment, please send the filled template to [mailto:jia.ning@ocproject.net jia.ning@ocproject.net]. Jia will aggregate and update to the wiki based on your selection of the confidential level (cell B6,B7 of the template v03)
-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work


3. [http://files.opencompute.org/oc/public.php?service=files&t=399a90213e5fe9004c79e7bd0be5041e Schedule proposal v01] is available for review and comment. A few notes:
-#8 12/13: 3-4hr: All draft work due for 1st pass of edit of all chapters. 1st cross review with changes suggested and agreed


- Overall it includes 3x stages: Information collection => Narrow down direction => work out details and 1st draft
-#9 12/20: 3-4hr: Review changes and post 1st draft


- The v01 schedule is on the aggressive side, i.e. the best case scenario when everything goes as expected.


- Please review it, give inputs in mailing-list, and discuss in the call next week.


'''3/24/2017'''
An [http://files.opencompute.org/oc/public.php?service=files&t=4baf98af7f736844e149508321370650 improved version of survey template v02] is created.
All NIC suppliers are strongly recommend to participate to influence Mezz 3.0.
Inputs from System supplier and Hyper-scale/CSP are welcome as well.
Agenda for next meeting (4/5)
1. Review overall Mezz 3.0 work schedule
2. Review the boundary with the context of major options
3. Pick major option branches to perform more detailed study
'''3/22/2017'''
A survey of boundary condition of typical use cases is going on.
Detail see [http://lists.opencompute.org/pipermail/opencompute-mezz-card/2017-March/000003.html here]
Please reply to mailing-list to share your boundary condition of Mezz3.0 or write to [mailto:jia.ning@ocproject.net Jia Ning]
'''3/14/2017'''
1. [https://www.youtube.com/watch?v=M9vg974Ww_4 Video of 3/17/2017 OCP Server workshop talk - Mezz 2.0 and beyond]
2. [http://files.opencompute.org/oc/public.php?service=files&t=6f58019848967b203deefef128c0aa04 Slide deck of 3/9/2017 workshop ]
3. [http://files.opencompute.org/oc/public.php?service=files&t=98ba555198e7083741fefbbf6794c12d Visco file for placement study]




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This project meets - 2 times a Month; Defaults to 1st and 3rd Wednesday of the Month.
This project meets - 2 times a Month; Defaults to 1st and 3rd Wednesday of the Month.


Call-in info and source of truth @ http://opencompute.org/community/ocp-calendars (Time zone shown: Eastern Time)  
Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)  


This call is open to the public.
This call is open to the public.
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Meeting minutes is sent out in mailing list and can be found at [http://lists.opencompute.org/pipermail/opencompute-mezz-card/ archive]
Meeting minutes is sent out in mailing list and can be found at [http://lists.opencompute.org/pipermail/opencompute-mezz-card/ archive]


===Events===
===Events===

Revision as of 04:12, 23 January 2018

Welcome

Welcome to the OCP Mezzanine NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in Mezzanine NIC space, under OCP framework.

Guideline

We are here to build a supportive, informative and inclusive community:


Supportive

- Support implementation questions

- Evaluate new use cases

Informative

- Share the latest topics and trends related to OCP Mezz NIC spec

- Share both challenges and opportunities

Inclusive

- Take community feedback and make iterations to proposal before submitting major revision to work group and IC

- Open to both adopters, and observers

Get Involved

0v70 Release Candidate Package (Work in Progress)

Doc Version Date Contributor Notes
[OCP_NIC_3.0_draft_0v70_20180122a] 0v70 1/23/2018 OCP NIC subgroup Placeholder
OCP_NIC_3.0_3D_CAD_0v70_20180122 0v70 1/22/2018 OCP NIC subgroup Mechanical 3D models
[Placeholder for Mechanical 2D drawings] 0v70 1/23/2018 OCP NIC Subgroup Placeholder
[Placeholder for CAD step files for the Hot/Cold Aisle CFD geometry] 0v70 1/23/2018 OCP NIC Subgroup Placeholder
[Placeholder for CAD File of thermal test fixture for Small Form Factor OCP NIC 3.0] 0v70 1/23/2018 OCP NIC Subgroup Placeholder

Updated doc

Doc Version Date Contributor Notes
OCP_NIC_3.0_draft_0v63_20180119e_TN 0v63 1/19/2018 OCP NIC subgroup Draft - public review and feedback is welcome - Vote on 1/24 Server Workgroup call

Send feedback=> opencompute-mezz-card@lists.opencompute.org

OCP 3.0 OCP 3.0 Pinout Proposal 20171205a_TN 20171205a_TN 12/05/2017 Intel Pinout Proposal
OCP_NIC_3.0_discussion_r11_20171219 v11 12/19/2017 OCP NIC Subgroup General deck;updated before 12/20 call
Mezz3.0 schedule v6_20171219 v6 12/19/2017 Facebook OCP NIC 3.0 spec project schedule
OCP NIC 3.0_Mechanical Discussion_v5_20171201_d v5 12/01/2017 Facebook Mechanical Deck
OCP_NIC_3_3D_CAD_r2_20170920 v2 9/20/2017 Facebook Mechanical 3D package
Thermal Deck_v7_20171115 v7 11/15/2017 Facebook Thermal deck
Updated thermal Simulation Results_v7_20171103 v7 11/3/2017 Facebook Thermal simulation result update
OCP_Mezz_thermal_model_v3_20171103 v3 11/3/2017 Facebook Thermal simulation model package
HPE_Comments_on_OCP_Mezz_v3_20170816 N/A 8/16/2017 HPE Presentation from HPE on 8/16/2017 call
Dell EMC - OCP NIC Presntation v1_20170906 v1 9/6/2017 Dell-EMC Presentation from Dell-EMC on 9/6/2017 call
Lenovo OCP Mezz3.0 Recommendations - 20170901 N/A 9/1/2017 Lenovo A mechanical focused presentation from Lenovo on 9/6/2017 call
9/25/2017 Workshop decks N/A 9/25/2017 Microsoft / TE / Amphenol / Broadcom / Intel / Facebook 9/25/2017 workshop slides from multiple contributors
9/25/2017 Workshop recording (large file 908MB) N/A 9/25/2017 Microsoft / TE / Amphenol / Broadcom / Intel / Facebook 9/25/2017 workshop recording from multiple contributors

Updates

1/19/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v63_20180119e_TN


1/18/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v62_20180118f_TN


1/16/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v60_20180116e_TN


1/15/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v57_20180109c_TN


1/2/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v50_20171222i_TN

2. Move updates before 12/1/2017 to archive


12/20/2017 update

1. Updated spec draft, overview deck, and mechanical deck


12/5/2017 update

1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN

2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN

3. Specification draft complete rate (Estimation)

Chapter Draft complete rate Status
1. Overview 70% drafted finishing up / under review
2. Card form factor 60+% drafted finishing up / under review
3. Card Edge and baseboard interface 80+ % drafted Under review
4. Management 0% drafted Need to work on
5. Data Network requirement TBD Same content as Mezz 2.0; check for need to keep this chapter
6. Card routing guideline and SI consideration TBD NC-SI specified on card; PCIe TBD
7. Thermal and Environmental TBD Need edit based on Mezz 2.0

4. Key mechanical updates:

- Agreed on guiding feature and card sizes

- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)

To be closed:

- Front bracket / latching mechanism design for small and large form factors

- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis

- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study


5. Coming working sessions and proposal of agenda:

-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work

-#8 12/13: 3-4hr: All draft work due for 1st pass of edit of all chapters. 1st cross review with changes suggested and agreed

-#9 12/20: 3-4hr: Review changes and post 1st draft




Find Archive of updates here

Find archive of mailing-list here


Meetings

This project meets - 2 times a Month; Defaults to 1st and 3rd Wednesday of the Month.

Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)

This call is open to the public.

If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.

Meeting minutes is sent out in mailing list and can be found at archive

Events

2017/3/9

OCP Engineering Workshop Sessions https://ocpussummit2017.sched.com/event/9SAa/ocp-mezzanine-nic-20-and-beyond

More information about OCP events can be found at: http://www.opencompute.org/community/events/ocp-events-calendar


Communication

- Project communication is done through the opencompute-mezz-card mailing list.

- Please make sure following the steps until you receive confirmation email and welcome email from Opencompute-mezz-card@lists.opencompute.org.

Please check your junk box and unblock Opencompute-mezz-card@lists.opencompute.org if you have trouble getting confirmation email.

- To access the mailing list archives go to: http://lists.opencompute.org/pipermail/opencompute-mezz-card/

- For general discussion, please use mailing-list above by default; This is public domain and all discussion is archived

- Reach to Jia Ning if there is strong reason not to have public discussion

Specifications and Designs

All these accepted by the IC

Specification Version Submit Date Contributor License Notes
OCP Mezzanine card v2.0

OCP_Mezz_2.0_rev1.00_20151215b_pub_release.pdf(2.2MB)

OCP_Mezz_2.0_rev1.00_20151215b_pub_release_3D_package.zip (88MB)

Mechanical 20151023_P1-P9_K1-K5 zip file (57MB)

V2.0-1.0 Dec 15, 2015 Facebook OWFa 1.0 Added support for x16 (quad x4), NCSI, dual QSFP+, & Quad SDP+

Accepted by OCP IC 2/24/2016

OCP Mezzanine card v0.5, original standard

Mezzanine Card (rev 0.5)

V0.5 Oct 8, 2012 Facebook OWFa 1.0 Defacto standard for the original network mezzanine with a x8 PCIe Gen3 interface