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===Updates===
===Updated doc===
'''7/5/2017'''
 
{| class="wikitable"
|-
! Doc
! Version
! Date
! Contributor
! Notes
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=a1c12b8a366ceae9e18c5e1ccacf1919 OCP_NIC_3.0_discussion_r10_20170920]
| v10
| 9/20/2017
| Facebook
| General deck;updated before 9/20 call


See below material for tomorrow's call:
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=3eda61b680e21060f5eb8b4bac4bd28f Mezz3.0 schedule v4_20170816]
| v4
| 8/16/2017
| Facebook
| OCP NIC 3.0 spec project schedule; commented on 9/6/2017


[http://files.opencompute.org/oc/public.php?service=files&t=80ad70edb0793750e9ffa844277f642d Corrected thermal model: Cases A1-A5]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=aa9736b73845229c4dcd6cf47c74296e OCP 3.0 Intel Pinout Proposal 20171016a_TN]
| 20171016a_TN
| 10/18/2017
| Intel
| Pinout Proposal


[http://files.opencompute.org/oc/public.php?service=files&t=969afb027f5266965c7d67fd67f4c0d9 Corrected thermal model: Cases A6-A10]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=520161aaf734e0b8690a9003b73bd57c OCP NIC 3.0_Mechanical Discussion_v03_20171018]
| v3
| 10/18/2017
| Facebook
| Mechanical Deck


[http://files.opencompute.org/oc/public.php?service=files&t=db9e67e52055bf286e60c76a77395de5 Thermal model with QSFP heat sink: Cases A1-A5]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=ebd99e48282324f42e945fe1171e3c50 OCP_NIC_3_3D_CAD_r2_20170920]
| v2
| 9/20/2017
| Facebook
| Mechanical 3D package


[http://files.opencompute.org/oc/public.php?service=files&t=4124bdef6c52904969309103f6fcd3d4 Thermal model with QSFP heat sink: Cases A6-A10]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=377e69b055f61f0deac736ce41e6ab35 Thermal Simulation Updates_v6_20170906]
| v6
| 9/6/2017
| Facebook
| Thermal deck


[http://files.opencompute.org/oc/public.php?service=files&t=142e75071a9a6c98f8887c6005bb064d Summary of updated simulation results]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=2d94319b5c807b797d4b4138342cebe3 Updated thermal Simulation Results_v6_20170906]
| v6
| 9/6/2017
| Facebook
| Thermal simulation result update


[http://files.opencompute.org/oc/public.php?service=files&t=7373b67f33c85773220f26801a199b7f Presentation slides]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=aca7a112857daafedb906fddbeb22d27 OCP_Mezz_thermal_model_v2_20170906]
| v2
| 9/6/2017
| Facebook
| Thermal simulation model package; same content as "8/22 Update"; Add rev control.


--- '''Agenda'''
|-  
| [http://files.opencompute.org/oc/public.php?service=files&t=bf394a4b8394ece800712a690a06bf57 HPE_Comments_on_OCP_Mezz_v3_20170816]
| N/A
| 8/16/2017
| HPE
| Presentation from HPE on 8/16/2017 call


1. Updates and corrections to thermal models
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=7d48739a75eb23c5ad5805f5451233df Dell EMC - OCP NIC Presntation v1_20170906]
| v1
| 9/6/2017
| Dell-EMC
| Presentation from Dell-EMC on 9/6/2017 call


2. Impact of QSFP heat sink
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=ad9c60f6e25a5d2eaa38cc72f8b22069 Lenovo OCP Mezz3.0 Recommendations - 20170901]
| N/A
| 9/1/2017
| Lenovo
| A mechanical focused presentation from Lenovo on 9/6/2017 call


3. Impact of contact resistance on QSFP heat sink performance
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=a4f6fee57057e7e888f0f39b5661c8cf 9/25/2017 Workshop decks]
| N/A
| 9/25/2017
| Microsoft / TE / Amphenol / Broadcom / Intel / Facebook
| 9/25/2017 workshop slides from multiple contributors 


4. Go over a few topics for discussion
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=79d8d76c1942bc15d65776392c5fd411 9/25/2017 Workshop recording (large file 908MB)]
| N/A
| 9/25/2017
| Microsoft / TE / Amphenol / Broadcom / Intel / Facebook
| 9/25/2017 workshop recording from multiple contributors 


|}


'''6/20/2017'''
===Updates===


See below for material for tomorrow's call:
'''9/20 Update'''


[http://files.opencompute.org/oc/public.php?service=files&t=c6cd05fb6c2046c878ac7c9ddb010e31 Summary of simulation results under stand-by power]
- The subgroup closed on all other major options after a few months of iterations. #14 is the clear preference in subgroup. Details and specification will be worked out around this option.


[http://files.opencompute.org/oc/public.php?service=files&t=76c7973c379d6849e7bc0d96eeb95a73 Presentation slides]
- Update main deck: [http://files.opencompute.org/oc/public.php?service=files&t=a1c12b8a366ceae9e18c5e1ccacf1919 OCP_NIC_3.0_discussion_r10_20170920]


--- '''Agenda'''
- Update [http://files.opencompute.org/oc/public.php?service=files&t=ebd99e48282324f42e945fe1171e3c50 mechanical 3D package] to r02


1. Review latest round of simulation results
- Update [http://files.opencompute.org/oc/public.php?service=files&t=b9049cac01890df4354859ff2c028fa5 mechanical deck] to r02


2. Go over a few topics for discussion




'''6/6/2017'''
'''9/6 Update'''


See below for material for tomorrow's call:
- Add updated doc session for better tracking of latest docs and community presentations


[http://files.opencompute.org/oc/public.php?service=files&t=7d19f143ec3f3109117904caf4a198cc Updated thermal model: Cases A1-A5]
- Update general deck to v9, thermal deck to v6


[http://files.opencompute.org/oc/public.php?service=files&t=776e636799258da85c562f69e22e05ae Updated thermal model: Cases A6-A10]
- Intend to exit phase 2 by 9/20 with option #14


[http://files.opencompute.org/oc/public.php?service=files&t=7018dd736da61bf1a44030d4a582ce26 Updated thermal model: Cases D1-D8]
- Change project name from "OCP Mezz NIC 3.0" to "OCP NIC 3.0" as option #14 is not Mezz style


[http://files.opencompute.org/oc/public.php?service=files&t=b86d25485cf6f4c191c9c2fec2806e73 Summary of simulation results using updated thermal models]


[http://files.opencompute.org/oc/public.php?service=files&t=0f43d212fb481bca0efd5befbed07af1 Presentation slides]
'''8/23 Update'''


--- '''Agenda'''
[http://files.opencompute.org/oc/public.php?service=files&t=bf394a4b8394ece800712a690a06bf57 HPE's presentation on 8/16 call]


1. Review changes to thermal models based on feedback from the community


2. Review latest round of simulation results
'''8/22 Update'''


3. Go over a few topics for discussion
Thermal results and files


- [http://files.opencompute.org/oc/public.php?service=files&t=76bd6a84a9ef716ea21a915c466277ac Option #13 with QSFP heat sink]


'''5/16/2017'''
- [http://files.opencompute.org/oc/public.php?service=files&t=3e29fd09df03360c1d2457348a81f453 Option #14 with QSFP heat sink]


Here are the update in the past 2x weeks, and material for tomorrow's call:  
- [http://files.opencompute.org/oc/public.php?service=files&t=ebcdfbcd14d24422b8d860bb1f6686dd Slides - Update of thermal results]


[http://files.opencompute.org/oc/public.php?service=files&t=5fd1d10bed7d85c6876478a975b7c867 Updated thermal simulation case deck:Thermal Simulation Feedback_20170517]
- [http://files.opencompute.org/oc/public.php?service=files&t=a5e561283cbdcaaad60e1c5b0f7a19c7 Summary of updated simulation results]


[http://files.opencompute.org/oc/public.php?service=files&t=9e5450687380a5c97feab23a3c0ccaf3 Update thermal simulation case spreadsheet: Updated Thermal Simulation Cases_20170511]


Additional questions to NIC suppliers:
'''8/16 Update'''


- Standby(S5) power of NIC, or ratio of P_Standby / P_Max
[http://files.opencompute.org/oc/public.php?service=files&t=1d34f1178a223488716abf5f26641871 Master Deck r08 dated 8/16/2017]


- P_standby of Optical modules
[http://files.opencompute.org/oc/public.php?service=files&t=7fe67b5788e081c70387d371e29218fe Mechanical update r01 dated 8/16/2017]


[http://files.opencompute.org/oc/public.php?service=files&t=209581638a7781772c8c6314ea384fd6 Mechanical - 3D of option 14 v1]




'''4/28/2017'''
'''8/2 Update'''


As we kicked off the discussion of Mezz thermal simulation on 4/19, here are the updates: 
'''1. Update to deck'''


[http://files.opencompute.org/oc/public.php?service=files&t=cd97fcf9d20789a0128cdb4380f26f69 OCP Mezz 3.0 Thermal Simulation Description]
[http://files.opencompute.org/oc/public.php?service=files&t=269e6bc3cee73239105c5dafb09f31a2 Master Deck r07 dated 8/1/2017]


[http://files.opencompute.org/oc/public.php?service=files&t=1a8ba4c5533db8696ea9fd1f5a9d8a8b OCP Mezz 3.0 Thermal Simulation Package]
'''2. 8/2/2017 Meeting Agenda'''


Please give your feedback in mailing list and we will talk about it on next call on 5/3.
'''General update'''


'''4/17/2017'''
- Form factor stability goal (2+5+2 goal)


We have an updated schedule for comment and feedback:
- Update the investigation of #14
[http://files.opencompute.org/oc/public.php?service=files&t=85117a6af40281399d13b87745f2c1ae Schedule Update V2]


Mezz 3.0 Survey is closed with 5 participants; Summary with company names masked can be found here:
- Revisit 1x or 2x form factor (tradeoff between simplicity and flexibility)
[http://files.opencompute.org/oc/public.php?service=files&t=2f76191e6e3f7af67373148de827db77 Mezz 3.0 Survey filled 201704016]


A few updates were made to the master deck:
- Heads up of stating pin list discussion
[http://files.opencompute.org/oc/public.php?service=files&t=a906c9f2492d3d74e1053a4a82ba8331 Mezz 3.0 General Update]


Our next call is on 4/19/2017 Wednesday 9am PDT(2nd call of the month). As always, call-in info can be found [http://opencompute.org/community/ocp-calendars here].
'''Possible project name change'''


--- '''Agenda'''
- One of the major option(#14) being looked at is not technical a "Mezz"


1. Sync with community about schedule refresher and get feedback for schedule and milestone
- Possible name change of project if the group is clearly trending toward #14


2. Summary of survey
'''Mechanical intro''' - by Joshua Held @Facebook


3. John Fernandes will share methodology for thermal simulation
- Josh will talk about coming activities in mechanical design of Mezz NIC


4. Call for more feedback on a few options (9,10,11,12)
'''9/25 Workshop @ Dallas, TX'''


- Call for presentation; topical can be technically, or sharing how your experience with OCP Mezz NIC


- Suggest to drop me an email if you intend to attend (optional)
- Free to register; instruction sent in mailing list




'''7/25/2017'''


'''3/29/2017'''
1. Update to deck


1. Ramp NIC survey template version to v03 to have more exact wording.  [http://files.opencompute.org/oc/public.php?service=files&t=888e8eb91172c13653c0bf733ca3b27f Template v03]
[http://files.opencompute.org/oc/public.php?service=files&t=102b0d696eb386222ce4d7b2b857b6cf Master Deck V6 dated 7/25]


2. Due to the limitation of mailing-list with attachment, please send the filled template to [mailto:jia.ning@ocproject.net jia.ning@ocproject.net]. Jia will aggregate and update to the wiki based on your selection of the confidential level (cell B6,B7 of the template v03)


3. [http://files.opencompute.org/oc/public.php?service=files&t=399a90213e5fe9004c79e7bd0be5041e Schedule proposal v01] is available for review and comment. A few notes:
'''7/14/2017'''


- Overall it includes 3x stages: Information collection => Narrow down direction => work out details and 1st draft
1. Update to deck


- The v01 schedule is on the aggressive side, i.e. the best case scenario when everything goes as expected.  
[http://files.opencompute.org/oc/public.php?service=files&t=15acc7dc37ae8d47e24e70098352ef1b Master Deck V5 dated 7/14]


- Please review it, give inputs in mailing-list, and discuss in the call next week.
2. Update to Schedule


[http://files.opencompute.org/oc/public.php?service=files&t=1f877ea9b23cc8ca217e586d079835eb Schedule update v3 dated 7/14]


3. Mezz subgroup will meet @ OCP Engineering workshop Sep 25th, 2017


'''3/24/2017'''
[http://www.dcdconverged.com/conferences/colo-cloud/benefits/ocp-engineering-workshop More info here]


An [http://files.opencompute.org/oc/public.php?service=files&t=4baf98af7f736844e149508321370650 improved version of survey template v02] is created.
All NIC suppliers are strongly recommend to participate to influence Mezz 3.0.
Inputs from System supplier and Hyper-scale/CSP are welcome as well.


Agenda for next meeting (4/5)
'''7/5/2017'''


1. Review overall Mezz 3.0 work schedule
See below material for tomorrow's call:


2. Review the boundary with the context of major options
[http://files.opencompute.org/oc/public.php?service=files&t=80ad70edb0793750e9ffa844277f642d Corrected thermal model: Cases A1-A5]


3. Pick major option branches to perform more detailed study
[http://files.opencompute.org/oc/public.php?service=files&t=969afb027f5266965c7d67fd67f4c0d9 Corrected thermal model: Cases A6-A10]


[http://files.opencompute.org/oc/public.php?service=files&t=db9e67e52055bf286e60c76a77395de5 Thermal model with QSFP heat sink: Cases A1-A5]


'''3/22/2017'''
[http://files.opencompute.org/oc/public.php?service=files&t=4124bdef6c52904969309103f6fcd3d4 Thermal model with QSFP heat sink: Cases A6-A10]


A survey of boundary condition of typical use cases is going on.
[http://files.opencompute.org/oc/public.php?service=files&t=142e75071a9a6c98f8887c6005bb064d Summary of updated simulation results]


Detail see [http://lists.opencompute.org/pipermail/opencompute-mezz-card/2017-March/000003.html here]
[http://files.opencompute.org/oc/public.php?service=files&t=7373b67f33c85773220f26801a199b7f Presentation slides]


Please reply to mailing-list to share your boundary condition of Mezz3.0 or write to [mailto:jia.ning@ocproject.net Jia Ning]
--- '''Agenda'''


'''3/14/2017'''
1. Updates and corrections to thermal models


1. [https://www.youtube.com/watch?v=M9vg974Ww_4 Video of 3/17/2017 OCP Server workshop talk - Mezz 2.0 and beyond]
2. Impact of QSFP heat sink


2. [http://files.opencompute.org/oc/public.php?service=files&t=6f58019848967b203deefef128c0aa04 Slide deck of 3/9/2017 workshop ]
3. Impact of contact resistance on QSFP heat sink performance


3. [http://files.opencompute.org/oc/public.php?service=files&t=98ba555198e7083741fefbbf6794c12d Visco file for placement study]
4. Go over a few topics for discussion





Revision as of 07:28, 18 October 2017

Welcome

Welcome to the OCP Mezzanine NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in Mezzanine NIC space, under OCP framework.

Guideline

We are here to build a supportive, informative and inclusive community:


Supportive

- Support implementation questions

- Evaluate new use cases

Informative

- Share the latest topics and trends related to OCP Mezz NIC spec

- Share both challenges and opportunities

Inclusive

- Take community feedback and make iterations to proposal before submitting major revision to work group and IC

- Open to both adopters, and observers

Get Involved

Updated doc

Doc Version Date Contributor Notes
OCP_NIC_3.0_discussion_r10_20170920 v10 9/20/2017 Facebook General deck;updated before 9/20 call
Mezz3.0 schedule v4_20170816 v4 8/16/2017 Facebook OCP NIC 3.0 spec project schedule; commented on 9/6/2017
OCP 3.0 Intel Pinout Proposal 20171016a_TN 20171016a_TN 10/18/2017 Intel Pinout Proposal
OCP NIC 3.0_Mechanical Discussion_v03_20171018 v3 10/18/2017 Facebook Mechanical Deck
OCP_NIC_3_3D_CAD_r2_20170920 v2 9/20/2017 Facebook Mechanical 3D package
Thermal Simulation Updates_v6_20170906 v6 9/6/2017 Facebook Thermal deck
Updated thermal Simulation Results_v6_20170906 v6 9/6/2017 Facebook Thermal simulation result update
OCP_Mezz_thermal_model_v2_20170906 v2 9/6/2017 Facebook Thermal simulation model package; same content as "8/22 Update"; Add rev control.
HPE_Comments_on_OCP_Mezz_v3_20170816 N/A 8/16/2017 HPE Presentation from HPE on 8/16/2017 call
Dell EMC - OCP NIC Presntation v1_20170906 v1 9/6/2017 Dell-EMC Presentation from Dell-EMC on 9/6/2017 call
Lenovo OCP Mezz3.0 Recommendations - 20170901 N/A 9/1/2017 Lenovo A mechanical focused presentation from Lenovo on 9/6/2017 call
9/25/2017 Workshop decks N/A 9/25/2017 Microsoft / TE / Amphenol / Broadcom / Intel / Facebook 9/25/2017 workshop slides from multiple contributors
9/25/2017 Workshop recording (large file 908MB) N/A 9/25/2017 Microsoft / TE / Amphenol / Broadcom / Intel / Facebook 9/25/2017 workshop recording from multiple contributors

Updates

9/20 Update

- The subgroup closed on all other major options after a few months of iterations. #14 is the clear preference in subgroup. Details and specification will be worked out around this option.

- Update main deck: OCP_NIC_3.0_discussion_r10_20170920

- Update mechanical 3D package to r02

- Update mechanical deck to r02


9/6 Update

- Add updated doc session for better tracking of latest docs and community presentations

- Update general deck to v9, thermal deck to v6

- Intend to exit phase 2 by 9/20 with option #14

- Change project name from "OCP Mezz NIC 3.0" to "OCP NIC 3.0" as option #14 is not Mezz style


8/23 Update

HPE's presentation on 8/16 call


8/22 Update

Thermal results and files

- Option #13 with QSFP heat sink

- Option #14 with QSFP heat sink

- Slides - Update of thermal results

- Summary of updated simulation results


8/16 Update

Master Deck r08 dated 8/16/2017

Mechanical update r01 dated 8/16/2017

Mechanical - 3D of option 14 v1


8/2 Update

1. Update to deck

Master Deck r07 dated 8/1/2017

2. 8/2/2017 Meeting Agenda

General update

- Form factor stability goal (2+5+2 goal)

- Update the investigation of #14

- Revisit 1x or 2x form factor (tradeoff between simplicity and flexibility)

- Heads up of stating pin list discussion

Possible project name change

- One of the major option(#14) being looked at is not technical a "Mezz"

- Possible name change of project if the group is clearly trending toward #14

Mechanical intro - by Joshua Held @Facebook

- Josh will talk about coming activities in mechanical design of Mezz NIC

9/25 Workshop @ Dallas, TX

- Call for presentation; topical can be technically, or sharing how your experience with OCP Mezz NIC

- Suggest to drop me an email if you intend to attend (optional) - Free to register; instruction sent in mailing list


7/25/2017

1. Update to deck

Master Deck V6 dated 7/25


7/14/2017

1. Update to deck

Master Deck V5 dated 7/14

2. Update to Schedule

Schedule update v3 dated 7/14

3. Mezz subgroup will meet @ OCP Engineering workshop Sep 25th, 2017

More info here


7/5/2017

See below material for tomorrow's call:

Corrected thermal model: Cases A1-A5

Corrected thermal model: Cases A6-A10

Thermal model with QSFP heat sink: Cases A1-A5

Thermal model with QSFP heat sink: Cases A6-A10

Summary of updated simulation results

Presentation slides

--- Agenda

1. Updates and corrections to thermal models

2. Impact of QSFP heat sink

3. Impact of contact resistance on QSFP heat sink performance

4. Go over a few topics for discussion



Find Archive of updates here

Find archive of mailing-list here


Meetings

This project meets - 2 times a Month; Defaults to 1st and 3rd Wednesday of the Month.

Call-in info and source of truth @ http://opencompute.org/community/ocp-calendars (Time zone shown: Eastern Time)

This call is open to the public.

If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.

Meeting minutes is sent out in mailing list and can be found at archive


Events

2017/3/9

OCP Engineering Workshop Sessions https://ocpussummit2017.sched.com/event/9SAa/ocp-mezzanine-nic-20-and-beyond

More information about OCP events can be found at: http://www.opencompute.org/community/events/ocp-events-calendar


Communication

- Project communication is done through the opencompute-mezz-card mailing list.

- Please make sure following the steps until you receive confirmation email and welcome email from Opencompute-mezz-card@lists.opencompute.org.

Please check your junk box and unblock Opencompute-mezz-card@lists.opencompute.org if you have trouble getting confirmation email.

- To access the mailing list archives go to: http://lists.opencompute.org/pipermail/opencompute-mezz-card/

- For general discussion, please use mailing-list above by default; This is public domain and all discussion is archived

- Reach to Jia Ning if there is strong reason not to have public discussion

Specifications and Designs

All these accepted by the IC

Specification Version Submit Date Contributor License Notes
OCP Mezzanine card v2.0

OCP_Mezz_2.0_rev1.00_20151215b_pub_release.pdf(2.2MB)

OCP_Mezz_2.0_rev1.00_20151215b_pub_release_3D_package.zip (88MB)

Mechanical 20151023_P1-P9_K1-K5 zip file (57MB)

V2.0-1.0 Dec 15, 2015 Facebook OWFa 1.0 Added support for x16 (quad x4), NCSI, dual QSFP+, & Quad SDP+

Accepted by OCP IC 2/24/2016

OCP Mezzanine card v0.5, original standard

Mezzanine Card (rev 0.5)

V0.5 Oct 8, 2012 Facebook OWFa 1.0 Defacto standard for the original network mezzanine with a x8 PCIe Gen3 interface