Open Compute Project

How to contribute

There are many opportunities for individuals and companies to get involved with the OCP community.

·      Join a current project, and sign up for the mailing list, and attend monthly meetings

·      Download, read and offer comments and suggestions on current and developing specifications and designs

·      Feed ideas for new projects to the incubation committee

·      Contribute hardware or software

·      Contribute your organization’s Products to be recognized as OCP-ACCEPTED™ or OCP-INSPIRED™ and featured in our Marketplace

·      Attend our online meetings, our in-person Engineering Workshops and our Annual Summit 

Stay informed:

·     OCP Blog

·     Mailing Lists

·     IRC Channels

·     OCP Wiki

·     Social Media Channels (Facebook, Twitter and Google+)

To become an OCP Tiered Member of the Open Compute Project Foundation please complete the OCP Membership Agreement. The individual membership agreement can be signed by creating an account/profile on the website. Once you've done that, please pick the projects you are interested in and sign up for those mailing lists. If you or your organization decides to contribute Intellectual Property (Specs/Designs) or want to have your Product Recognized as OCP-ACCEPTED™ or OCP-INSPIRED™ then you will need see the 'Contribute' section below. 

Tiered Membership:

·      Individual

·      Corporate: Community, Silver, Gold, Platinum

If your company is interested in sponsoring an OCP Summit, please contact and we'd be happy to share upcoming opportunities.

If you're interested in leading a technical workshop or presenting at a future summit, please contact

Engineering Workshops: The Open Compute Project Foundation hosts a series of engineering workshops each year to build the community. Registration for these is capped at 100 attendees, as they are working sessions.  The goals of the engineering workshops are:

·      Increased community participation and stickiness

·      Increase the OCP technology portfolio; depth and breadth of specifications and charters

·      Drive the product-ionization of OCP’s specifications.  A good example here is the Intel’s interconnect technology that enables Sipho

·      Solidify specification versioning pipeline, release process, naming conventions

·      Take into account/understand the suppliers needs and OCP partner needs

·      Implementation of OCP’s legal framework (CLA’s, OWFa’s)

·      Building out/addressing technologies for new sectors

If you are interested in sponsoring an upcoming engineering workshop, please contact