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OCP Engineering Workshops @ DCD Colo & Cloud - Videos are live!

Tuesday, September 26, 2017 · Posted by at 9:41 AM

The Open Compute Project held a series of engineering workshops on September 25th, 2017 co-located with the DCD Colo & Cloud event in Dallas TX.

The videos and presentations from this event are now live!

Datacenter

Video

Agenda:

Welcome


Robert Bunger, (OCP Project Lead) Schneider Electric

Review of Colocation Facility Guidelines for OCP Racks


Robert Bunger, (OCP Project Lead) (Schneider Electric

Colocation Facility Assessment Process


Robert Bunger, (OCP Project Lead) Schneider Electric

Comparing an OCP data center using Romonet Site Analysis Tool (Slides)


Zahl Limbuwala, Romonet

Color Coded Cabling Proposal (Slides)


Michael Bailey, Fidelity

Liquid Cooled Data Center Review - Alibaba (Slides)


David Wu, Alibaba

Hardware Management

Video

Agenda:

Welcome and General update


Bernie Meier (Ericsson) and Norman James (IBM), OCP Project Co- Leads

With John Leung (Intel), Incubation Committee Representative

Panel Discussion on OpenBMC

 


Bill Carter (OCP CTO), Chris Austen (IBM), Sai Dasari (Facebook), John Leung (DMTF), James Mihm (Intel), Rick Altherr (Google), Bryan Kelly (Microsoft)

Moderator: Archna Haylock, OCP Community Director

OpenBMC  @ IBM (Slides)


Norman James (IBM), Chris Austen (IBM)

OpenBMC @ Microsoft (Slides)


Ali Larijani  (Microsoft)

OpenBMC @ Facebook (Slides)


Eran Tal, OCP IC Vice-Chair (Facebook), Sai Dasari (Facebook)

OpenBMC @ Intel (Slides)


James Mihm (Intel)

OpenBMC @ Google


Rick Altherr (Google)

Redfish OCP Interoperability Profile Review (Slides)


Jeff Autor (HPE)

Rack & Power

Video

Agenda:

Welcome (Slides)


Steve Mills, OCP Rack and Power Project Co-lead (Facebook)

Open Rack Standard V2 specification proposal:  ‘Independent Busbar’ (Amphenol Slides) (Rittal Slides)


Derek Winsor, (Rittal)

Michael Wingard, (Amphenol)

Justin Knott Field, (Amphenol)                                                            

BarKlip 48V IT Gear Connector (Slides)


Skip Fry, (Amphenol)

Review Proposed Changes to Open Rack Specification 2.0: (Slides)


Steve Mills, OCP Rack and Power Project Co-lead (Facebook)

Antony Ren, (Delta Electronics)

Review Specification Proposal:  True 3-phase 380 – 480 Vac to 48Vdc Power Shelf (Slides)


Paul Smith, (GE Industrial Solutions)

Overview of Flatpack-:  Adapting 12V IT gear to 48V Open Rack (Slides)


Nate Klein, (Google)

Scott McCauley, (Google)

Community Driven Discussion of the Power Shelf Specification Roadmap


Steve Mills, OCP Project Co-lead (Facebook)

Server & Mezz Card

Video

Agenda:

Welcome and General update


Jia Ning, Facebook

Project Olympus update (Slides)


Mark Shaw, Microsoft

Overview of OCP NIC 3.0 status (Slides)


Jia Ning, Facebook

Mezz 3.0 Specification - Thermal considerations (Slides)


John Fernandes and Yueming Li, Facebook

Mezz 3.0 Specification - Mechanical update (Slides)


Joshua Held, Facebook

Mock-up review and demo


Joshua Held, Facebook

Connector Update (Slides)


TE

Connector Update (Slides)


Amphenol

Dell – EMC update (Slides)


Jon Lewis, Dell-EMC

Pinout discussion (Slides)


Jia Ning, Facebook

NIC Management (Slides)


Hemal Shah, Broadcom

 

Telco

Video

Agenda:

Welcome (Slides)


Tom Anschutz, OCP Incubation Committee Representative (AT&T)

PON XGS Spec (Slides)


Tom Anschutz, OCP Incubation Committee Representative (AT&T)

XGS Design & Device (Slides)


Jeff Catlin (Accton/Edgecore)

GPON - NGPON2 Interest (Slides)


Tom Anschutz, OCP Incubation Committee Representative (AT&T)

Use of FPGAs (Slides)


Tom Anschutz, OCP Incubation Committee Representative (AT&T)

AT&T 24 Port PON Spec (Slides)


Sumitra Bhojan (AT&T)

PON Fiber Distribution Hub (Slides)


Earl Pope (AT&T)

G.fast 16 Port DPUs: Sckipio, Broadcom (Slides)

Common Wiring Adaptation Module (Slides)


Sumitra Bhojan (AT&T)

G.fast Single Port DPU (Slides)


Mark Shostak (AT&T)

UCPE Update on spec (Slides)


John Gibbons (AT&T)

UCPE Expansion Card (Slides)


John Gibbons (AT&T)

UCPE x86 Next steps (Slides)


John Gibbons (AT&T)

Accton/Edgecore UCPE (Slides)


Jeff Catlin (Accton/Edgecore)

Silicom-USA UCPE (Slides)


Steve Yates

UCPE Arm Spec (Slides)


Tom Anschutz, OCP Incubation Committee Representative (AT&T)/John Gibbons (AT&T)

ARM/SOC Presentation (Slides)


Bob Monkman (ARM), Manya Rastogi (NXP)

UCPE Arm Device (Slides)


Guy Ellis (Traverse)

TIP Engagement (Slides)


Martin Rehwald (TIP)

Close


Tom Anschutz, OCP Incubation Committee Representative (AT&T)/ Archna Haylock, OCP Community Director